TSMC held a groundbreaking ceremony for its first wafer fab in Europe with a total investment of over 10 billion euros

Publisher:SparkleMagicLatest update time:2024-08-21 Source: IT之家Keywords:TSMC Reading articles on mobile phones Scan QR code
Read articles on your mobile phone anytime, anywhere

On August 21, TSMC, Bosch, Infineon and NXP jointly established a joint venture company, the European Semiconductor Manufacturing Company (ESMC), held a groundbreaking ceremony in Dresden, Germany today, officially launching the land preparation work for TSMC's first European semiconductor factory. TSMC said that the factory is expected to start construction later this year.

TSMC CEO Wei Zhejia presided over the ceremony, and German Chancellor Scholz and European Commission President von der Leyen attended the ceremony and delivered speeches. To express her firm support, President von der Leyen announced that the European Commission has approved Germany's 5 billion euro aid plan in accordance with EU state aid rules to support the European Semiconductor Manufacturing Company (ESMC) in building and operating semiconductor factories.

Scholz defended the high subsidies for Germany's semiconductor industry, saying that high subsidies can guarantee chip demand and employment opportunities for German companies and provide "extra impetus" to the entire regional economy.

Wei Zhejia said: "We are building the Dresden plant together with our partners Bosch, Infineon and NXP to meet the fast-growing European automotive and industrial demand for semiconductors. Through this advanced manufacturing plant, we will bring TSMC's advanced manufacturing capabilities to European customers and partners, promote economic development in the region, and promote technological progress throughout Europe."

After full production, ESMC is expected to have a monthly production capacity of 40,000 300mm (12-inch) wafers, using TSMC's 28/22nm planar CMOS and 16/12nm FinFET process technology, and using advanced FinFET transistor technology to further strengthen Europe's semiconductor manufacturing ecosystem. The total investment is expected to exceed 10 billion euros (IT Home Note: Currently about 78.962 billion yuan), from equity injections, debt financing, and strong support from the EU and German governments.

The new plant is expected to create around 2,000 direct high-tech professional jobs. In addition, each direct job created by the project is expected to stimulate a significant number of indirect jobs throughout the EU supply chain, boosting the region's economy.


Keywords:TSMC Reference address:TSMC held a groundbreaking ceremony for its first wafer fab in Europe with a total investment of over 10 billion euros

Previous article:SK Hynix: Seven major U.S. technology giants have expressed their intention to customize HBM memory
Next article:ASML CEO: It is impossible for Chinese manufacturers to produce advanced lithography machines of 7nm and below

Recommended ReadingLatest update time:2024-11-14 16:14

TSMC's revenue in 2021 is NT$1.59 trillion, and its 5nm process revenue increased by 188% year-on-year
On February 25, TSMC released its 2021 annual financial report. According to the report, TSMC's operating income in 2021 was NT$1.59 trillion, a year-on-year increase of 19%, and its net profit was NT$597.1 billion, a year-on-year increase of 15%. The basic earnings per share were NT$23.01, and the diluted earnings pe
[Mobile phone portable]
TSMC's revenue in 2021 is NT$1.59 trillion, and its 5nm process revenue increased by 188% year-on-year
The first TSMC WoW 3D packaged chip is mass-produced, and Graphcore Bow IPU is launched
Recently, IPU company Graphcore (to be announced) announced the launch of its new IPU called Bow, as well as computing blades: Bow-Machine and computing system Bow Pod series. Compared with the M2000 equipped with the second-generation IPU-Colossus Mk2 GC200, the Bow Pod series can achieve an overall performance impro
[Embedded]
The first TSMC WoW 3D packaged chip is mass-produced, and Graphcore Bow IPU is launched
Apple and TSMC reportedly work together to develop ultra-advanced micro OLED display technology
    Nikkei Asia reported today that Apple and TSMC have further deepened their relationship and are working together to develop ultra-advanced display technology. People familiar with the matter revealed that Apple plans to develop micro OLED displays, a new display technology that is built directly onto chip wafers,
[Mobile phone portable]
TSMC: 2nm chips will be put into production in 2025 and use GAA technology for the first time
During its first-quarter earnings call, TSMC reported that it is working full steam ahead on the development of next-generation process nodes. The semiconductor giant plans to have its first 3nm processes in production later this year and have 2nm ready by the end of 2025. In this conference call, Bruce Lee, an anal
[Semiconductor design/manufacturing]
TSMC expects to mass-produce A14 processor for iPhone 12 next month
According to media reports in Taiwan, TSMC will mass-produce the 5nm A14 processor for Apple's next-generation smartphone iPhone 12 in April this year.   The production of A-series chips usually begins in April or May, so this means that TSMC's mass production of the A14 processor is proceeding as scheduled and is not
[Mobile phone portable]
Analysis of the global pure MEMS foundry list: TSMC ranks first
Last year, TSMC was the world's largest pure-play MEMS device foundry, with revenue soaring 201%. It not only captured market share from competitors but also created new sources of revenue.   According to IHS iSuppli's MEMS competitive analysis report, TSMC's related operating income reached US$53 million in 2011, f
[Analog Electronics]
TSMC's price hike puts chip companies in a dilemma
TSMC will increase the price of its entire process by 6% in 2023, and IC design customers are facing a dilemma, especially at this stage when some applications are beginning to loosen and they need to reduce the amount of wafer input, but they find it difficult to refuse price increase requests from important partners
[Semiconductor design/manufacturing]
Computing lithography speed increases by 40 times, TSMC expects to introduce Nvidia AI acceleration technology into 2nm trial production in June
NVIDIA worked hand in hand with TSMC, ASML and Synopsys. After four years of development, NVIDIA finally completed the new AI acceleration technology cuLitho. According to reports, CuLitho can increase the computational optical scale of next-generation chips by more than 40 times, making it possible to manufacture 2nm
[Semiconductor design/manufacturing]
Computing lithography speed increases by 40 times, TSMC expects to introduce Nvidia AI acceleration technology into 2nm trial production in June
Latest Semiconductor design/manufacturing Articles
Change More Related Popular Components

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

About Us Customer Service Contact Information Datasheet Sitemap LatestNews


Room 1530, 15th Floor, Building B, No.18 Zhongguancun Street, Haidian District, Beijing, Postal Code: 100190 China Telephone: 008610 8235 0740

Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号