On August 20, according to Korean media MK, Ryu Seong-soo, vice president of SK Hynix in charge of HBM memory business, said at the SK Group's 2024 Icheon Forum yesterday local time that M7 technology giants have expressed their intention to hope that SK Hynix will develop customized HBM products for them.
M7 stands for Magnificent 7, which refers to the seven major technology giants in the U.S. stock market: Apple, Microsoft, Alphabet (Google), Tesla, Nvidia, Amazon and Meta.
Ryu Seong-soo mentioned that he continued to work on weekends, communicating with M7 companies by phone, and running around to meet the needs of these companies to integrate engineering resources within SK Hynix and supply chain companies across South Korea.
The executive believes that the memory industry is reaching a tipping point of paradigm shift as demand for customized products increases, and SK Hynix will continue to develop its memory business by leveraging opportunities brought about by these changes.
Ryu Seong-soo also said that as the AI market becomes more segmented, SK Hynix will not only continue to provide solutions for the mass market in the future, but will also launch differentiated products with performance 20 to 30 times that of existing models.
SK expects to launch a 12-layer stacked HBM4 memory product using the MR-MUF bonding process in the second half of 2025, while the higher-capacity 16-layer stacked HBM is expected to be released in 2026 when relevant demand arises.
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