Intel Convenes Global Government Affairs and Business Leaders to Advise on Global Public Affairs Issues Affecting the Semiconductor Industry
Intel Corporation today announced the formation of a Government Affairs Advisory Council to provide Intel executives with a broad perspective on global government and political affairs. The Council will bring a unique combination of skills, experience and perspectives from around the world to help Intel and the technology and semiconductor industry address surging semiconductor demand, the impact of the global chip shortage, and the importance of public-private partnerships to ensure a healthy, balanced global semiconductor manufacturing supply chain.
“Our new Advisory Board includes eight outstanding members who bring decades of experience in global government affairs and business, as well as valuable perspectives from outside Intel,” said Intel CEO Pat Gelsinger. “In today’s society-wide challenges, the COVID-19 pandemic and the global semiconductor shortage, their insights will help Intel navigate the increasingly complex landscape and help us better fulfill our mission of creating world-changing technology that benefits everyone on Earth.”
This is a new era of innovation and opportunity for Intel. The members of the advisory board will provide invaluable advice and perspective as Intel executes its product, platform and "IDM 2.0" strategies. The eight board advisors are global government affairs experts and business leaders covering the United States, Europe and China, and will bring a wide range of talent and experience to Intel. The board will provide Intel's leadership and board of directors with international perspectives on key strategic areas, helping Intel navigate the global geopolitical landscape and innovate quickly to meet customer priorities, including the continued growth in global demand for semiconductor production capacity.
Members of the Government Affairs Advisory Committee include:
•Gregory D. Smith (Chairman) is a director of Intel Corporation and Executive Vice President of Corporate Operations and Chief Financial Officer of The Boeing Company.
•Jon Huntsman (Vice Chairman) is Vice Chairman for Policy at Ford Motor Company. He previously served as U.S. Ambassador to Russia, China, and Singapore, and as Governor of Utah.
•Erich Clementi is Vice Chairman of the Supervisory Board of E.ON. He was previously Senior Vice President of IBM Global Markets and Chairman of IBM Europe.
•Michèle Flournoy is co-founder and managing partner of WestExec Advisors and former co-founder and CEO and current chairman of the Center for a New American Security. She previously served as undersecretary of defense for policy at the U.S. Department of Defense.
•Fred Kempe is president and CEO of the Atlantic Council. He previously worked as an editor and reporter at The Wall Street Journal, including as global editorial lead for Europe and the Middle East.
•Robert M. Kimmitt is a senior international lawyer at WilmerHale LLP. He previously served as U.S. Under Secretary of the Treasury and U.S. Ambassador to Germany.
•Janet Napolitano is a professor of public policy at the University of California, Berkeley, and founder and academic director of the Center for Political Security. She is a former U.S. Secretary of Homeland Security and governor of Arizona.
•Yang Yuanqing is the Chairman and CEO of Lenovo Group. He joined Lenovo Group in 1989 and has played a key role in Lenovo's transformation into a diversified technology solutions provider with revenue of US$60 billion and operations in 180 markets around the world.
Intel's Government Affairs Advisory Committee will meet three times a year. Intel General Counsel Steven Rodgers will serve as the committee's executive manager.
Intel will continue to add members to the council to include additional perspectives and expertise.
More background information: Biographies of Government Affairs Advisory Committee members
About Intel
Intel (NASDAQ: INTC) is an industry leader that creates world-changing technology that drives global progress and enriches lives. Inspired by Moore's Law, we are committed to advancing semiconductor design and manufacturing to help our customers meet their greatest challenges. By embedding intelligence in the cloud, network, edge and various computing devices, we unleash the potential of data to help improve business and society. For more information about Intel innovation, please visit Intel China News Center
Previous article:Chips are in short supply! TSMC has begun negotiating orders with customers for 2023
Next article:Silicon wafers may be in short supply next year and the year after
Recommended ReadingLatest update time:2024-11-15 07:50
- Popular Resources
- Popular amplifiers
- Microcomputer Principles and Interface Technology 3rd Edition (Zhou Mingde, Zhang Xiaoxia, Lan Fangpeng)
- Microcomputer Principles and Interface Technology Examples and Exercises (Kong Qingyun, Qin Xiaohong)
- Design and application of autonomous driving system (Yu Guizhen, Zhou Bin, Wang Yang, Zhou Yiwei)
- EDA Technology Practical Tutorial--Verilog HDL Edition (Sixth Edition) (Pan Song, Huang Jiye)
- ASML provides update on market opportunities at 2024 Investor Day
- It is reported that memory manufacturers are considering using flux-free bonding for HBM4 to further reduce the gap between layers
- Intel China officially releases 2023-2024 Corporate Social Responsibility Report
- Mouser Electronics and Analog Devices Launch New E-Book
- AMD launches second-generation Versal Premium series: FPGA industry's first to support CXL 3.1 and PCIe Gen 6
- SEMI: Global silicon wafer shipment area increased by 6.8% year-on-year and 5.9% month-on-month in 2024Q3
- TSMC's 5nm and 3nm supply reaches "100% utilization" showing its dominance in the market
- LG Display successfully develops world's first stretchable display that can be expanded by 50%
- Infineon's revenue and profit both increased in the fourth quarter of fiscal year 2024; market weakness in fiscal year 2025 lowered expectations
- LED chemical incompatibility test to see which chemicals LEDs can be used with
- Application of ARM9 hardware coprocessor on WinCE embedded motherboard
- What are the key points for selecting rotor flowmeter?
- LM317 high power charger circuit
- A brief analysis of Embest's application and development of embedded medical devices
- Single-phase RC protection circuit
- stm32 PVD programmable voltage monitor
- Introduction and measurement of edge trigger and level trigger of 51 single chip microcomputer
- Improved design of Linux system software shell protection technology
- What to do if the ABB robot protection device stops
- CGD and Qorvo to jointly revolutionize motor control solutions
- CGD and Qorvo to jointly revolutionize motor control solutions
- Keysight Technologies FieldFox handheld analyzer with VDI spread spectrum module to achieve millimeter wave analysis function
- Infineon's PASCO2V15 XENSIV PAS CO2 5V Sensor Now Available at Mouser for Accurate CO2 Level Measurement
- Advanced gameplay, Harting takes your PCB board connection to a new level!
- Advanced gameplay, Harting takes your PCB board connection to a new level!
- A new chapter in Great Wall Motors R&D: solid-state battery technology leads the future
- Naxin Micro provides full-scenario GaN driver IC solutions
- Interpreting Huawei’s new solid-state battery patent, will it challenge CATL in 2030?
- Are pure electric/plug-in hybrid vehicles going crazy? A Chinese company has launched the world's first -40℃ dischargeable hybrid battery that is not afraid of cold
- How to daisy chain 485
- Silergy SY5072 specification sheet help
- Please help me find out which movie the characters in the attached picture are from. Thank you.
- Renovation of old items + transformation of discarded charging heads into bathroom lighting
- How should I draw the various layers of the Allegro pad pins?
- TMS320C6678 development routine manual study 1
- AD 20.0.12 x64
- Fudan Micro FM33xx full series offline burner firmware & host computer
- Award-winning live broadcast: Application of NXP LPC553x in dual motor control is in progress!
- Gaoyun GW1NR-9 FPGA uses video frame buffer and the error "in hclk tree must have constraint" appears