Fully develop 3D IC silicon wafer system integration processing! SMIC Phase II officially operates

On December 30, 2019, the Phase II J2A cleanroom of SMIC Semiconductor (Jiangyin) Co., Ltd. was completed and put into use as planned. The first equipment was successfully installed and the Phase II project officially entered the operation stage.

The second phase of SJEC Semiconductor plans to build three large-scale modern silicon wafer processing plants to form a leading R&D and manufacturing base for mid-range silicon wafer manufacturing and advanced packaging. The J2A plant project is the first plant, and the groundbreaking ceremony was held on September 15, 2017.

According to official news from SMIC Semiconductor, CEO Cui Dong said that the launch of the second phase of operations will, on the one hand, expand the company's business scale and provide customers with greater processing capacity; on the other hand, it will expand the business content to meet the needs of silicon wafer-level advanced packaging in the booming 5G, AI, IOT, automotive electronics and other market fields. It will also help the company promote continuous innovation, achieve a comprehensive acceleration of R&D projects, and make an all-out effort to impact the industrial highland of 3D IC silicon wafer-level system integration processing.

It is understood that SMIC Semiconductor Co., Ltd. is China's first professional 12-inch mid-stage bump processing company. Previously, the first phase of the 28-nanometer silicon wafer mass production project has been fully completed, and the world-leading 14-nanometer silicon wafer processing has begun production.