Semiconductor Manufacturing-Semiconductor design/manufacturing-9-EEWORLD

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STMicroelectronics' Q3 2024 financial report is released: STMicroelectronics continues to strengthen its layout in automotive and industrial electrification

[Semiconductor Manufacturing]Domestic photoresist has passed mass production verification, Wuhan Taiziwei's T150 A has a resolution of 120nm
[Semiconductor Manufacturing]A key step towards acoustic integrated circuits: Sound waves can be controlled and modulated on a chip for the first time
[Semiconductor Manufacturing]It is reported that memory manufacturers are considering using flux-free bonding for HBM4 to further reduce the gap between layers
[Semiconductor Manufacturing]World's first vacuum noise chip released
[Semiconductor Manufacturing]Cadence Launches New Digital Twin Platform Millennium Platform, Delivering Ultra-High Performance and High Energy Efficiency
[Semiconductor Manufacturing]Intel announces expansion of its Chengdu base in China

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Through AI acceleration, smart terminal applications are innovatively improved: Beijing, China - July 11, 2023 - Imagination Technologies announced that it has authorized Jingwei Qili to use IMG S in its latest programmable smart chip Avatar FPGA series ...; Keywords： AI intelligent terminal Imagination Jingwei Qili
Publish Time：2023-07-11

Why did Foxconn withdraw from India after giving up hundreds of billions of investments?: Foxconn, the world's largest electronics foundry, suddenly announced on July 10 that it would withdraw from its semiconductor joint venture with Indian metals and oil group Vedanta. Indian Prime Minister Narendra Modi aims to develop India into a chip manufacturing center. Foxconn's withdrawal is a major blow to him...; Keywords： Foxconn semiconductor chip
Publish Time：2023-07-11

3D integration technology reaches its highest performance yet, with data bandwidth up to 1.6 megabytes per second: The latest proposed integration techniques are designed using a stacking approach. Image source: Tokyo Institute of Technology Japanese researchers report that they have designed a new three-dimensional technology that integrates processors and memories to achieve ...; Keywords： storage
Publish Time：2023-07-03

The commissioning ceremony of Mengzhimo's world's first flexible circuit board additive manufacturing mass production demonstration factory was successfully held: On June 30, 2023, the completion and commissioning ceremony of Xiamen Romo Electronic Technology Co., Ltd., the world's first flexible circuit board additive manufacturing mass production demonstration factory, was held at Anren Industrial Park, Jimei District, Xiamen City, Fujian Province ...; Keywords： Dream Ink flexible circuit board
Publish Time：2023-06-30

Synopsys and Samsung Expand IP Collaboration to Accelerate Advanced SoC Design in Emerging Industries: Synopsys' Interface and Foundation IP for Samsung 8LPU, SF5 (A), SF4 (A), and SF3 Processes Accelerate Success in Advanced SoC Designs Summary:  Synopsys Interface IP for USB, PCI Ex ...; Keywords： Synopsys Samsung IP SoC
Publish Time：2023-06-30

Samsung updates process technology roadmap: 2nm in 2025, 1.4nm in 2027: On June 28, according to the latest process technology roadmap released by Samsung Foundry at the annual Samsung Foundry Forum (SFF 2023) today, the company plans to ...; Keywords： Samsung Electronics 1 4nm
Publish Time：2023-06-28

Intel announces investment of US$25 billion to build factory: According to the Times of Israel, U.S. semiconductor giant Intel has signed an in-principle agreement with the Israeli government to invest $25 billion to build a chip manufacturing plant in Kiryat Gat. Israeli Prime Minister Benjamin ...; Keywords： Intel
Publish Time：2023-06-19

Micron will invest more than 4.3 billion yuan in Xi'an packaging and testing factory to introduce new production lines to manufacture DRAM, NAND and SSD: According to news on June 16, Micron Technology announced today that it plans to invest more than 4.3 billion yuan in its packaging and testing factory in Xi'an, China, in the next few years. The announcement stated that Micron Technology has decided to ...; Keywords： Micron
Publish Time：2023-06-16

Intel PowerVia technology is the first to realize chip backside power supply, breaking through the interconnection bottleneck: Intel is the first to implement backside power supply technology on product-level chips, achieving a unit utilization rate of over 90%, while also demonstrating industry-leading performance in other dimensions. ...; Keywords： Intel PowerVia chips power supply
Publish Time：2023-06-06

Synopsys and Arm Join Forces to Accelerate Development of Next-Generation Mobile SoCs: Synopsys' industry-leading EDA and IP solutions combined with Arm's comprehensive computing solutions help the ecosystem address multi-die system design challenges Summary: Synopsys system-level ...; Keywords： Synopsys Arm Mobile SoC SoC
Publish Time：2023-06-05

X-FAB is the first to launch 110nm BCD-on-SOI foundry solution to market: Next-generation automotive-grade process for high-digital design Beijing, China, June 2, 2023 - X-FAB Silicon Foundries ("X-FAB Silicon Foundries"), a globally recognized leading analog mixed-signal foundry ...; Keywords： X-FAB BCDonSOI wafer
Publish Time：2023-06-02

It is reported that Qualcomm Snapdragon 8G4 is exclusively manufactured by TSMC 3nm and Samsung may be out of the game: A few days ago, ARM released a new generation of Cortex-X4 A720 A520 CPU architecture, which is the main force of ARM processors this year and next year. Qualcomm's next-generation flagship Snapdragon 8G4 will also continue to use the X4 ultra-large core, and ...; Keywords： Qualcomm Snapdragon
Publish Time：2023-05-31

SK hynix 1bnm process will be used for DDR5 RDIMM and HBM3E DRAM solutions: SK Hynix announced that its fifth-generation 10nm process 1bnm has completed verification and will provide support for next-generation DDR5 and HBM3E solutions. SK Hynix 1bnm process will provide 6 4 Gbps for DDR5 ...; Keywords： SKhynix DDR5
Publish Time：2023-05-31

Cadence releases 112G-ELR SerDes IP demonstration for TSMC 3nm process: The 3nm era is here! Cadence released the 112G ultra-long reach (112G-ELR) Se for TSMC 3nm process (N3E) during the 2023 TSMC North American Technology Symposium. ...; Keywords： Cadence TSMC ELR
Publish Time：2023-05-19

3D NAND-like design, Neo Semiconductor launches 3D X-DRAM: 8 times density, 230 layers: According to news on May 10, Neo Semiconductor, a 3D NAND flash memory manufacturer headquartered in the United States, recently launched a 3D X-DRAM memory chip, claiming to be the world’s first ...; Keywords： 3D NAND X-DRAM
Publish Time：2023-05-10

Samsung's semiconductor business suffered a huge loss of 4.58 trillion won in 1Q, and the group's R&D investment hit a new high: Samsung Electronics' semiconductor business suffered a loss of 4.58 trillion won (approximately US$3.41 billion) in the first quarter of 2023. However, it benefited from improvements in profitability in the mobile phone and home appliance fields. ...; Keywords： Samsung Semiconductor
Publish Time：2023-04-27

TSMC: 2nm process will be mass produced in 2025, N3P will be mass produced in the second half of 2024: On April 26, local time in the United States, TSMC held the North American Technology Forum in Santa Clara, California, and announced the latest progress and roadmap of its 3nm process. Among them, the most interesting ...; Keywords： TSMC
Publish Time：2023-04-27

Fire breaks out at TSMC Advanced Packaging and Testing Factory No. 6 site: According to news on April 26, on the evening of April 25, a fire broke out at the TSMC Advanced Packaging and Testing Factory No. 6 under construction in Zhunan Science Park, Miaoli County. Smoke billowed from the second floor of the site, but luckily no one was there. ...; Keywords： TSMC packaging and testing
Publish Time：2023-04-26

EUV lithography machine consumes 30,000 kilowatt-hours of electricity per day TSMC is worried about rising electricity bills: TSMC recently released its Q1 quarterly financial report, with revenue of US$16.72 billion, a year-on-year decrease of 48% and a month-on-month decrease of 161%. It was the first year-on-year revenue decline in three years, which means that the bull market has passed. More serious ...; Keywords： EUV lithography machine TSMC
Publish Time：2023-04-23

Rapid Silicon allows engineers to use GPT for FPGA design: FPGA developer Rapid Silicon Inc (Los Gatos, Calif.) announces RapidGPT, an AI-based FPGA design tool with conversational capabilities ...; Keywords： FPGA GPT
Publish Time：2023-04-12

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