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STMicroelectronics' Q3 2024 financial report is released: STMicroelectronics continues to strengthen its layout in automotive and industrial electrification

[Semiconductor Manufacturing]A key step towards acoustic integrated circuits: Sound waves can be controlled and modulated on a chip for the first time
[Semiconductor Manufacturing]Domestic photoresist has passed mass production verification, Wuhan Taiziwei's T150 A has a resolution of 120nm
[Semiconductor Manufacturing]World's first vacuum noise chip released
[Semiconductor Manufacturing]It is reported that memory manufacturers are considering using flux-free bonding for HBM4 to further reduce the gap between layers
[Semiconductor Manufacturing]Cadence Launches New Digital Twin Platform Millennium Platform, Delivering Ultra-High Performance and High Energy Efficiency
[Semiconductor Manufacturing]Intel announces expansion of its Chengdu base in China

Latest

It is reported that memory manufacturers are considering using flux-free bonding for HBM4 to further reduce the gap between layers: On November 14, according to Korean media ETNews, Samsung Electronics, SK Hynix, and Micron are all interested in using fluxless bonding in the next generation of HBM4 memory. ...; Keywords： HBM4 memory Samsung SK Hynix Micron
Publish Time：2024-11-14

Intel announces expansion of its Chengdu base in China: On October 28, Intel announced today that it will expand its packaging and testing base in Chengdu. This move aims to deepen its service commitment to the Chinese market and accelerate its response to local customers’ demand for high-performance servers. ...; Keywords： Intel
Publish Time：2024-10-28

Domestic photoresist has passed mass production verification, Wuhan Taiziwei's T150 A has a resolution of 120nm: On October 15, according to the Wuhan East Lake New Technology Development Zone Management Committee (China Optics Valley), Optics Valley companies have achieved a major breakthrough in the field of semiconductor-specific photoresists: Wuhan Taizi Micro Optics ...; Keywords： Photoresist
Publish Time：2024-10-15

The Japanese government is reportedly planning to invest in Rapidus, an advanced chip maker, to attract private investment.: On October 15, Kyodo News reported that the Japanese government plans to directly invest in Rapidus, an advanced chip manufacturer, in the form of in-kind investment. ...; Keywords： Chip Rapidus
Publish Time：2024-10-15

Paving the way for mass production of self-developed chips! Jinghe Integrated 28nm logic chip passed verification: On October 10, Jinghe Integrated Circuit announced that its 28-nanometer logic chip has passed functional verification and successfully lit up the TV. This means that Jinghe Integrated Circuit has made a significant step forward in the field of 28-nanometer logic process. ...; Keywords： Logic chip Jinghe Integrated Circuit
Publish Time：2024-10-10

Foxconn plans to build the world's largest Nvidia GB200 AI chip manufacturing plant in Mexico: On October 8, according to Reuters today, Foxconn Senior Vice President Benjamin Ting announced at the 2024 Hon Hai Technology Day that Foxconn plans to build the world’s largest ...; Keywords： Foxconn Nvidia
Publish Time：2024-10-08

Samsung's 3nm Exynos 2500 chip yield is low, Galaxy S25 series may be equipped with Snapdragon 8 Elite: On October 7, Samsung's upcoming Galaxy S25 series is expected to be the company's first mobile phone to use a 3nm chip. Earlier rumors have said that Samsung will use a 3nm chip in the Galaxy S25. ...; Keywords： Samsung Exynos 2500 chip
Publish Time：2024-10-08

There are few orders for advanced processes. Samsung reportedly shuts down 30% of its 4, 5 and 7 nm production lines at Pyeongtaek P2 and P3 factories: On September 30, Korean media ChosunBiz reported on the 27th local time that Samsung Electronics has significantly adjusted its advanced process business strategy, reduced the scale of related operations, and closed its Pyeongtaek, South Korea ...; Keywords： Samsung Electronics Advanced Process
Publish Time：2024-09-30

Samsung's semiconductor factories in South Korea and the United States were reported to have pressed the pause button: On September 26, South Korean media DigitalDaily published a blog post yesterday (September 25), reporting that Samsung has stopped the P4 in Pyeongtaek, South Korea, and the Plan ...; Keywords： Samsung Semiconductor
Publish Time：2024-09-26

SK Hynix announces mass production of 12-layer HBM3E chips, achieving a maximum capacity of 36GB: On September 26, SK Hynix announced that it has taken the lead in the world to start mass production of 12-layer HBM3E chips, achieving the largest 36GB capacity among existing HBM products. ...; Keywords： SK Hynix HBM3E
Publish Time：2024-09-26

World's first vacuum noise chip released: Recently, Beijing Economic and Technological Development Zone (Beijing Yizhuang) enterprise Beijing Zhongke Guoguang Quantum Technology Co., Ltd. (hereinafter referred to as "Guoguang Quantum") successfully launched the world's first ...; Keywords： Vacuum Noise Chip
Publish Time：2024-09-24

Tata Group and chip giant ADI form strategic alliance to explore building chip factories in India: According to media reports, India's Tata Group recently announced a strategic alliance with global analog chip giant Analog Devices Inc. to jointly explore the possibility of establishing a chip manufacturing plant in India. ...; Keywords： Chip ADI
Publish Time：2024-09-23

TSMC and Samsung Electronics are reportedly exploring the possibility of building a large wafer fab in the UAE: On September 23, the Wall Street Journal reported that both TSMC and Samsung Electronics have explored the possibility of building a large wafer fab in the United Arab Emirates. ...; Keywords： TSMC Samsung wafer
Publish Time：2024-09-23

It is reported that TSMC's 2nm process technology has started risk trial production in July, earlier than expected: In early July, foreign media reported that TSMC, a foundry, would start risk trial production of its 2nm process technology at its Baoshan wafer fab in Hsinchu Science Park in the middle of that month, which was four months earlier than the market generally expected. ...; Keywords： TSMC 2nm
Publish Time：2024-09-20

Apple begins producing chips in the U.S., becoming TSMC's first U.S. customer: On September 18, Beijing time, according to former Bloomberg reporter Tim Culpan, Apple is producing its A16 chip in the United States. Two years ago, the A16 was first used in the iPhone 14 Pro. ...; Keywords： Apple TSMC
Publish Time：2024-09-18

Huang Renxun: Nvidia can abandon TSMC if necessary: On September 12, Beijing time, Nvidia CEO Jensen Huang said at the Goldman Sachs Technology Conference on Wednesday that TSMC is far ahead in chip foundry, but if necessary, Nvidia can ...; Keywords： Nvidia TSMC
Publish Time：2024-09-12

TSMC's Arizona wafer plant's 4nm trial production yield is comparable to that of its Taiwan plant: On September 9, Bloomberg reported on September 6, Beijing time, citing sources that the wafer yield of TSMC's first 4nm production line in Arizona wafer factory project has reached 100% of the original production line. ...; Keywords： TSMC 4nm
Publish Time：2024-09-09

Adani Group and Tower Semiconductor to jointly invest $10 billion in India to build wafer fab: On September 9, according to Devendra Fadnavis, Deputy Chief Minister of Maharashtra, India, on the 5th of this month, Beijing time, the Indian giant Adani Group ...; Keywords： Semiconductor Wafer
Publish Time：2024-09-09

Intel has reportedly handed over all processes below 3nm to TSMC, and has cut 15% of its global workforce in an effort to reverse its decline: On September 9, according to Taiwan media "Commercial Times", Intel's wafer foundry business development has been hindered. It is said that it has handed over all processes below 3 nanometers to TSMC and started global layoffs. ...; Keywords： Intel TSMC
Publish Time：2024-09-09

Micron confirms the start of "production-ready" 12-layer HBM3E 36GB memory shipments: On September 6, Micron stated in a technical blog released this month that its "production-capable" 12-layer stacked HBM3E 36GB ...; Keywords： Micron HBM3E
Publish Time：2024-09-06

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