IPD chip shipments exceed 1 billion, Xinhe Semiconductor appears at IMS2022

June 2, 2022, Shanghai, China - Corechip, a leading company in the domestic EDA and IPD industries, announced at the 2022 IMS exhibition being held in Denver, USA that its cumulative IPD chip shipments have exceeded 1 billion for the first time.

Xinhe Semiconductor has accumulated more than ten years of development experience and successful cases in the field of integrated passive device IPD and system-level packaging SiP design. Combined with the virtual IDM model, it has built the Xinhe passive device IPD platform. Based on the advantages of IPD technology such as high consistency, strong integration, small size, low height, high reliability, low cost, customizability, superior performance, and pin layout flexibility, the Xinhe passive device IPD platform provides a full-link solution covering passive devices such as filters, multiplexers, couplers, baluns, RC networks, matching networks, high-density capacitors, etc. from simulation models to physical products, meeting the needs of various frequency bands and scenarios in the mobile communication market 3G, 4G, 5G and IoT markets.

In the past two years, with the mass commercialization of 5G and IoT products, Coreho Semiconductor's IPD chips have been highly recognized by the market and successfully entered the supply chain of domestic Tier 1 mainstream mobile phone platforms and RF chip companies, with an average monthly shipment of more than 60 million pieces, quickly occupying the 5G RF and IoT markets, and was selected by Yole as the world's leading IPD chip supplier. According to the latest statistics, the total shipments of Coreho Semiconductor's IPD chips have successfully exceeded 1 billion pieces.

Xinhe Semiconductor's IPD chips have three core competitive advantages, including: unique technical capabilities, solid partnerships with wafer foundries and packaging plants, and powerful EDA tool support.

Features of the core and passive chip IPD platform include:

Contains IP library that has been rigorously verified by the foundry;

Includes nearly 100 kinds of passive components such as filters, RC networks, power dividers, couplers, baluns, multiplexers, matching networks, EMI filters, etc.;

Can be customized and developed according to different needs, helping customers to improve system performance and reduce the number of peripheral devices to the greatest extent;

 Provides various passive device model libraries to help customers realize joint simulation of module systems and provide guidance for analysis and debugging, which greatly enhances customers' product design, iteration and optimization capabilities and shortens the time to market for customers' products.

The main application scenarios of the core and passive chip IPD platform include:

Filters , multiplexers and other devices are mainly used in 5G RF front-end modules and NB/WiFi/BT/UWB/CAT1/power carrier/TWS silicon microphones and other scenarios

High -density capacitors have lower insertion loss, thinner size, better voltage and temperature stability, and smaller ESL/ESR. They are mainly used in power decoupling of high-end chips such as GPU/CPU/AI/ASIC/DSP and ultra-wideband modules such as optical modules/millimeter waves.