What is the difference between transistors and MOS tubes when used as switches in circuit design? Working properties:
1. The transistor is controlled by current, while the MOS tube is controlled by voltage.
2. Cost issue: transistors are cheap, MOS tubes are expensive.
3. Power consumption problem: transistor loss is large.
4. Driving capability: MOS tubes are often used for power switches and high current local switching circuits.
In fact, triodes are relatively cheap, easy to use, and are often used in digital circuit switch control.
MOS tubes are used in high-frequency and high-speed circuits, high-current applications, and places that are sensitive to base or drain control current.
Generally speaking, for low-cost applications, triodes should be considered first, and if that doesn't work, MOS tubes should be considered.
In fact, it is wrong to say that current control is slow and voltage control is fast. To truly understand it, you need to understand the working methods of bipolar transistors and MOS transistors. The triode works by the movement of carriers. Take the emitter follower of the npn tube as an example. When the base is not added with voltage, the pn junction composed of the base and the emitter region prevents the diffusion movement of the majority carriers (holes in the base region and electrons in the emitter region). At this pn junction, an electrostatic field (i.e., built-in electric field) pointing from the emitter region to the base region will be induced. When the positive voltage applied to the base points from the base region to the emitter region, when the electric field generated by the applied voltage to the base is greater than the built-in electric field, the carriers (electrons) in the base region may flow from the base region to the emitter region. The minimum value of this voltage is the forward conduction voltage of the pn junction (generally considered to be 0.7v in engineering).
However, there will be charges on both sides of each pn junction at this time. If a positive voltage is applied to the collector-emitter, under the action of the electric field, the electrons in the emitter region move to the base region (in fact, the electrons move in the opposite direction). Since the width of the base region is very small, the electrons can easily cross the base region to reach the collector region and recombine with the PN holes here (close to the collector). To maintain balance, the electrons in the collector region are accelerated to move to the outer collector under the action of the positive electric field, while the holes move to the pn junction. This process is similar to an avalanche process.
The electrons in the collector return to the emitter through the power supply, which is the working principle of the transistor. When the transistor is working, both pn junctions will induce charges. When the switch is in the on state, the transistor is in the saturation state. If the transistor is cut off at this time, the charge induced by the pn junction needs to return to the equilibrium state, and this process takes time. The MOS transistor works differently and does not have this recovery time, so it can be used as a high-speed switch.
(1) Field effect tubes are voltage-controlled components, while transistors are current-controlled components. When only a small amount of current is allowed to be drawn from the signal source, field effect tubes should be used; when the signal voltage is low and more current is allowed to be drawn from the signal source, transistors should be used. (2) Field effect tubes use majority carriers to conduct electricity, so they are called unipolar devices, while transistors use both majority carriers and minority carriers to conduct electricity. They are called bipolar devices.
(3) The source and drain of some field effect transistors can be used interchangeably, and the gate voltage can be positive or negative, which makes them more flexible than transistors.
(4) Field effect transistors can operate under very small current and very low voltage conditions, and their manufacturing process can easily integrate many field effect transistors on a silicon wafer. Therefore, field effect transistors have been widely used in large-scale integrated circuits.
(5) Field effect transistors have advantages such as high input impedance and low noise, and are therefore widely used in various electronic devices. In particular, using field effect transistors as the input stage of the entire electronic device can achieve performance that is difficult to achieve with ordinary transistors.
(6) Field effect transistors are divided into two categories: junction type and insulated gate type, and their control principles are the same.
Previous article:Research on a Low-Temperature Drift CMOS Bandgap Voltage Reference
Next article:Design of an automatic constant current charging circuit based on discrete devices
- Popular Resources
- Popular amplifiers
- MathWorks and NXP Collaborate to Launch Model-Based Design Toolbox for Battery Management Systems
- STMicroelectronics' advanced galvanically isolated gate driver STGAP3S provides flexible protection for IGBTs and SiC MOSFETs
- New diaphragm-free solid-state lithium battery technology is launched: the distance between the positive and negative electrodes is less than 0.000001 meters
- [“Source” Observe the Autumn Series] Application and testing of the next generation of semiconductor gallium oxide device photodetectors
- 采用自主设计封装,绝缘电阻显著提高!ROHM开发出更高电压xEV系统的SiC肖特基势垒二极管
- Will GaN replace SiC? PI's disruptive 1700V InnoMux2 is here to demonstrate
- From Isolation to the Third and a Half Generation: Understanding Naxinwei's Gate Driver IC in One Article
- The appeal of 48 V technology: importance, benefits and key factors in system-level applications
- Important breakthrough in recycling of used lithium-ion batteries
- LED chemical incompatibility test to see which chemicals LEDs can be used with
- Application of ARM9 hardware coprocessor on WinCE embedded motherboard
- What are the key points for selecting rotor flowmeter?
- LM317 high power charger circuit
- A brief analysis of Embest's application and development of embedded medical devices
- Single-phase RC protection circuit
- stm32 PVD programmable voltage monitor
- Introduction and measurement of edge trigger and level trigger of 51 single chip microcomputer
- Improved design of Linux system software shell protection technology
- What to do if the ABB robot protection device stops
- Huawei's Strategic Department Director Gai Gang: The cumulative installed base of open source Euler operating system exceeds 10 million sets
- Download from the Internet--ARM Getting Started Notes
- Learn ARM development(22)
- Learn ARM development(21)
- Learn ARM development(20)
- Learn ARM development(19)
- Learn ARM development(14)
- Learn ARM development(15)
- Analysis of the application of several common contact parts in high-voltage connectors of new energy vehicles
- Wiring harness durability test and contact voltage drop test method
- IBM develops 2-nanometer chip
- NXP MCU development environment installation prompts expiration
- Crazy Shell AI open source drone ADC (joystick control)
- How to delete the top level in AD
- MicroPython adds USB and JTAG support to the ESP32-C3
- How much does a 5G base station cost?
- RF PA circuit design based on gallium nitride (GaN) devices
- The magical problem encountered by KICAD
- X-NUCLEO-IKS01A3 Official Technical Data
- AT32F425-Evaluation Report-Serial Port and Waveform Display Host Computer Debugging-09