采用自主设计封装，绝缘电阻显著提高！ROHM开发出更高电压xEV系统的SiC肖特基势垒二极管

采用自主设计封装，绝缘电阻显著提高！

ROHM develops SiC Schottky barrier diodes to support higher voltage xEV systems

~Compared to ordinary products, it can ensure about 1.3 times the creepage distance. Even for surface mount type, resin potting insulation treatment is not required~

ROHM (headquartered in Kyoto, Japan), a world-renowned semiconductor manufacturer, has developed a surface-mount SiC Schottky barrier diode (hereinafter referred to as "SBD") with longer creepage distance*1 between pins and higher insulation resistance. The current product lineup already has 8 "SCS2xxxNHR" models suitable for automotive equipment applications such as on-board chargers (OBC). It is planned to release 8 more "SCS2xxxN" models for industrial equipment such as FA equipment and photovoltaic inverters in December 2024.

In recent years, xEV has been rapidly popularized, and power semiconductors are indispensable for its supporting components such as OBC. Therefore, the market demand for SiC SBDs with low heat generation, fast switching speed and strong voltage resistance is increasing. Among them, surface mount (SMD) package products that are small and can be installed using a patch machine are particularly in demand because they can improve the production efficiency of application products. On the other hand, since the application of high voltage is prone to leakage tracking, devices with longer creepage distances are required. As a leading company in the SiC field, ROHM has been committed to developing high-performance SiC SBDs with excellent voltage resistance and mountability that support high-voltage applications. This time, by adopting ROHM's original package shape, a product with a minimum creepage distance of 5.1mm and excellent insulation performance has been developed.

The new product removes the center pin at the bottom of the package and adopts ROHM's original package shape, which extends the creepage distance to a minimum of 5.1mm, about 1.3 times that of conventional products. By ensuring a longer creepage distance, tracking (surface discharge) between the pins can be suppressed*2, so when the device is mounted on the circuit board in high voltage applications, it is no longer necessary to perform insulation treatment by resin potting*3.

Currently, there are two types of products, 650V and 1200V, which are suitable not only for the 400V system widely used in xEV, but also for higher voltage systems that are expected to expand in the future. In addition, the pad pattern of the new product is common to ordinary products and previous products with TO-263 package, so it can be directly replaced on the existing circuit board. In addition, the "SCS2xxxNHR" for automotive equipment also complies with the automotive electronic product reliability standard AEC-Q101*4.

Samples of the new product have been available for sale since September 2024 (sample price 1,500 yen/piece, excluding tax). The production base for the front-end process is ROHM Apollo CO., LTD. (Chikugo Factory, Fukuoka Prefecture), and the production base for the back-end process is ROHM Korea Corporation (South Korea). In addition, the new product has begun to be sold through e-commerce platforms such as Ameya360.

In the future, ROHM will continue to develop high-voltage SiC SBDs and contribute to energy conservation and efficiency improvement in automobiles and industrial equipment by providing high-quality power components that meet market needs.

＜Product Lineup＞

＜Application Examples＞

◇In-vehicle equipment: on-board charger (OBC), DC-DC converter, etc.

◇Industrial equipment: AC servos for industrial robots, photovoltaic inverters, power conditioners, uninterruptible power supplies (UPS), etc.

＜E-commerce sales information＞

E-commerce platform: Ameya360

The new products will also be gradually released on other e-commerce platforms.

Products on sale: "SCS2xxxxNHR" for vehicle-mounted equipment

The "SCS2xxxxN" suitable for industrial equipment is expected to be gradually released from December 2024.

＜About the “EcoSiC™” brand＞

EcoSiC™ is a component brand that uses silicon carbide (SiC), which has attracted much attention in the field of power components due to its superior performance to silicon (Si). From wafer production to manufacturing processes, packaging and quality management methods, ROHM has been independently developing the technologies necessary for upgrading SiC products. In addition, ROHM uses a consistent production system in the manufacturing process and has established its position as a leading company in the SiC field.

・EcoSiC™ is a trademark or registered trademark of ROHM Co., Ltd.

＜Terminology＞

*1) Creepage distance

The shortest distance between two conductive bodies (leads) along the surface of the device package. In semiconductor design, in order to prevent electric shock, leakage, and short circuit of semiconductor products, it is necessary to take insulation measures to ensure creepage distance and electrical clearance.

*2 Tracking (surface discharge)

When a high voltage is applied to a pin that is a conductor, discharge occurs on the insulator, the surface of the package. Discharge occurs between patterns that should not be conductive, causing dielectric breakdown of the device. As packages become smaller, creepage distances become shorter, making this phenomenon more likely to occur.

*3) Resin potting

Electrical insulation is achieved by sealing the device body and the electrode connection parts between the device and the circuit with resins such as epoxy resin. Resin potting can also effectively protect the device, prevent water and dust, and improve durability and weather resistance.

*4) Automotive electronics reliability standard “AEC-Q101”

AEC is the abbreviation of Automotive Electronics Council, which is a reliability standard for automotive electronic components jointly established by major automobile manufacturers and major electronic component manufacturers in the United States. Q101 is a standard applicable to discrete semiconductor components (transistors, diodes, etc.).