Feisilink Microelectronics launches the first RISC-V processor-managed Layer 2 SoC switch chip

Publisher:SparkStar22Latest update time:2021-12-19 Source: 爱集微Keywords:SoC Reading articles on mobile phones Scan QR code
Read articles on your mobile phone anytime, anywhere

On December 17, the first Dishui Lake China RISC-V Industry Forum was held in Lingang, Shanghai. At the meeting, Yang Qing, product line director of Feisling Microelectronics Technology Co., Ltd., introduced Xuanyuan 1030M, the first managed two-layer SoC switch chip with integrated RISC-V processor.

Wuhan Feisiling Microelectronics Technology Co., Ltd. is an integrated circuit design company jointly funded by FiberHome Communications and China Academy of Posts and Telecommunications Technology, a subsidiary of China Information and Communications Technology. It has a full-process chip solution from "demand to chip design, and then to system application". Feisiling is a leading IC design company in Central China, and a member of the China Semiconductor Industry Association (CSIA), the Design Branch (ICCAD), and the Communications Integrated Circuit Committee (CCIC) of the China Institute of Communications.


Yang Qing introduced that Xuanyuan 1030M is a managed SoC chip with integrated L2 Ethernet switching function, with a processing bandwidth of up to 30Gbps, designed for hub and switch deployment. It has an embedded RISC-V self-controllable CPU with a main frequency of up to 600MHz, which meets the needs of upper-layer protocol processing and device management; it has embedded 2 10G optical interfaces, 4 1G optical interfaces, and 8 1G electrical interfaces, supporting multiple communication protocols; it has complete L2 bridge, VLAN, ACL and Meter functions, supporting L2 multicast, STP, RSTP, mirroring and QinQ, etc.; it has an integrated 1.5Mbytes data cache, supports flow classification based on IEEE 802.1p QoS or DiffServ priority, and rate shaping based on ports and queues with a granularity of 8 Kbps; it has a rich scheduling strategy to ensure the stable operation of high-speed networks.

For different network architecture levels, for core switches, routers, edge gateways, network cards, PHY, etc., Feisiling has launched switching chips such as Xuanyuan 9, 9, 3 series, Fuxi, Nuwa, Shaohao series, etc.


In addition to switching chips, Feisling also has general-purpose and automotive-grade product lines for MCU products. Yang Qing introduced Feisling's automotive-grade MCU products under development. Based on the advantages of switching and security technologies, Feisling has jointly developed products in the three core areas of power safety, driving information, and body electronics with Dongfeng Motor. Among them, the high-performance Fuxi 2360 series chips for the power safety domain are equipped with a high-performance RISC-V Lockstep core, which has better performance than the ARM M7 core and a maximum clock frequency of 400MHz.


In addition, Yang Qing also introduced security chips, which are based on RISC-V+ hardware accelerators. The acceleration of key generation, signing, and signature verification are respectively 54.1 times, 42.8 times, and 17.5 times compared with software implementations, and are at the forefront of the world.


Keywords:SoC Reference address:Feisilink Microelectronics launches the first RISC-V processor-managed Layer 2 SoC switch chip

Previous article:CoreShine Technology launches China Mobile's first RISC-V low-power, high-capacity MCU chip
Next article:Fangcun Microelectronics launches RISC-V based high security and high reliability embedded network processor

Recommended ReadingLatest update time:2024-11-23 07:28

Renesas Electronics and Fixstars to Jointly Develop Tool Kit for Optimizing R-Car SoC AD/ADAS AI Software
Renesas Electronics and Fixstars to Jointly Develop Tool Kit for Optimizing R-Car SoC AD/ADAS AI Software Shorten development cycles through rapid development of optimized network models and high-speed simulation Beijing, China, December 15, 2022 - Renesas Electronics, a global supplier
[Microcontroller]
Renesas Electronics and Fixstars to Jointly Develop Tool Kit for Optimizing R-Car SoC AD/ADAS AI Software
Analysis of application demand trend of smart cockpit SoC chips
1. Introduction With the rapid development of science and technology, the widespread application of technologies such as artificial intelligence, the Internet of Things, and big data is changing the automotive industry. As an important part of modern automobiles, smart cockpits have become an important di
[Embedded]
ARM-based 32-bit MCU provides SoC design reference
With the rapid development of manufacturing technology, MCU has made great progress in peripheral integration, performance, power consumption and cost reduction, and can almost provide performance similar to SoC, and the number of applications is increasing. In particular, ARM-based 32-bit MCU provides SoC designers
[Microcontroller]
Introduction to the composition and standards of automotive SoC chips
This article is from the " 2024 Automotive SoC Chip Industry Analysis Report ". With the improvement of the level of automotive intelligence, the vehicle EE architecture has been upgraded from the previous distributed ECU architecture to the centralized domain controller architecture,
[Automotive Electronics]
HOLOPLOT Delivers Next-Generation Audio Experience with AMD Adaptive SoC
HOLOPLOT is a science-based company that delivers immersive audio experiences for a variety of applications, including live concerts, themed entertainment, and corporate events. The company combines its innovative X1 matrix array professional audio platform with advanced proprietary algorithms and integra
[Embedded]
HOLOPLOT Delivers Next-Generation Audio Experience with AMD Adaptive SoC
A Deeper Look at Automotive System-on-Chip (SoC): Overview of ARM’s Business Model and CPU Microarchitecture
The core components of automotive system-on-chip (SoC) include CPU, GPU, AI accelerator, on-chip bus and interconnection. Currently, CPUs are mainly ARM architecture, x86 architecture and RISC-V architecture. ARM architecture occupies the vast majority of the market. Image source: Internet
[Automotive Electronics]
A Deeper Look at Automotive System-on-Chip (SoC): Overview of ARM’s Business Model and CPU Microarchitecture
SoC front-end (ARM) embedded system development practice training (Part 2)
Introduction: In the RISC reduced instructions, it contains multiple meanings, so it is difficult to understand. However, under the full transparency of the debugger to the CPU, you can clearly see the execution of instructions and deepen your understanding of the CPU. In order to watch the execution of instructions a
[Microcontroller]
SoC front-end (ARM) embedded system development practice training (Part 2)
Design of FSPLC Microprocessor SOC Using AVR IP Core
 1 Introduction With the rapid improvement of chip integration, an electronic system or subsystem can be fully integrated on a chip, and the IC industry has formed a design method based on system-on-chip (SOC) technology. At the same time, IC design capabilities and EDA tools are relatively lagging behind the deve
[Microcontroller]
Design of FSPLC Microprocessor SOC Using AVR IP Core
Latest Mobile phone portable Articles
Change More Related Popular Components

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

About Us Customer Service Contact Information Datasheet Sitemap LatestNews


Room 1530, 15th Floor, Building B, No.18 Zhongguancun Street, Haidian District, Beijing, Postal Code: 100190 China Telephone: 008610 8235 0740

Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号