ACM Semiconductor Equipment Launches 18-Cavity Single Wafer Cleaning System for Advanced Memory Applications

ACM Semiconductor Equipment (NASDAQ:ACMR), a leading equipment supplier in wafer cleaning technology for advanced semiconductor devices, recently released the Ultra C VI single wafer cleaning equipment, which is the latest product to join the Ultra C cleaning series. The Ultra C VI is designed for high-throughput cleaning of dynamic random access memory (DRAM) and 3D NAND flash wafers to achieve a shortened production cycle of storage products. This new product is based on ACM's mature multi-chamber technology and further expands the cleaning equipment product line. The Ultra C VI system is equipped with 18 single-wafer cleaning chambers, which increases the number of chambers and production capacity by 50% compared to ACM's existing 12-chamber Ultra CV system, while the equipment width remains unchanged and the equipment length is slightly increased.

"Memory products continue to increase in complexity, but there are still strict requirements for production output," said Dr. Hui Wang, Chairman of ACM. "As cleaning processes take longer or more complex drying techniques are used, adding cleaning chambers can effectively solve production capacity issues, allowing advanced memory device manufacturers to maintain or even shorten product production cycles. Our 18-chamber cleaning system will be a powerful tool to solve such problems. The Ultra C VI balances the number of chambers, achieving high throughput (wafer-per-hour) while taking into account the matching of factory automation capabilities, while also avoiding the pressure of equipment downtime due to too many chambers."

The Ultra C VI can perform single wafer cleaning for advanced DRAM products down to the 1y node and below and advanced 3D NAND products with 128 layers and above. The equipment can be used for a variety of front-end and back-end processes, such as polymer removal, mid-line tungsten or back-end copper process cleaning, pre-deposition cleaning, post-etch and post-chemical mechanical polishing (CMP) cleaning, deep trench cleaning and RCA standard cleaning, depending on the application and the chemistry involved.

A variety of chemical combinations can be used in the cleaning process, including standard cleaning (SC1, SC2), hydrofluoric acid (HF), ozone deionized water (DI-O3), dilute sulfuric acid and hydrogen peroxide mixture (DSP, DSP +), organic solvents or other process chemicals. Up to two of the chemicals can be recycled to save costs. The equipment can also use optional physical assisted cleaning methods, such as two-fluid nitrogen atomized water cleaning or Shengmei's proprietary spatial alternating phase shift (SAPS) and time-induced cavitation oscillation (TEBO) megasonic cleaning technology. Optional isopropyl alcohol (IPA) drying function is applied to graphics with high aspect ratios. In addition, because the equipment is consistent with the width of Shengmei's existing equipment, it helps to improve the space utilization of the wafer fab and further reduce costs.

ACM plans to deliver the Ultra C VI to a leading storage manufacturer for evaluation and validation in early Q3 2020.

Visit us at SEMICON China booth E5223 to learn more about our complete cleaning solutions, including our latest Ultra C VI system. The show will be held at the Shanghai New International Expo Center from June 27 to 29, 2020. You can also contact the relevant person in charge of the following regions for more information.