Intel announced that it may invest 80 billion euros in Europe in the next 10 years to increase its chip production capacity in Europe, and will build a semiconductor plant in Ireland for the production of automotive chips. According to Reuters, Intel CEO Pat Gelsinger mentioned at the Munich IAA International Auto Show that the company will announce two new wafer fab locations in Europe before the end of 2021. It is speculated that Intel may set up factories in Germany and France, and Intel's R&D center in Poland is also included in this expansion of wafer production capacity.
Gelsinger pointed out that the future goal is to create a project worth 80 billion euros (94.77 billion U.S. dollars) to promote the development of the semiconductor industry, and it is expected to become the driving force for the development of the entire technology industry. As the largest manufacturer of PC and data center processor chips, Intel recently announced that it will open its wafer fabs to external users. Gelsinger told Reuters that Intel expects to provide chips to automakers within 6 to 9 months to help solve the global shortage of automotive chips. Cars have become mobile data centers, and chip manufacturers and car manufacturers need each other, so Intel's vision is to establish an innovation center for Europe.
The purpose of the Intel Foundry Services Accelerator is to help automakers learn Intel 16 technology to manufacture chips and move towards Intel 3 and Intel 18A technology. Although Intel has not yet publicly announced the manufacturers participating in the program, it is rumored that nearly 100 automakers and important supply chain companies, including BMW, Volkswagen Group, Daimler and Bosch, support the program.
Although it is not clear whether Intel can achieve its target, it is certain that automotive chips are one of its important strategies. Gelsinger believes that by 2030, the proportion of chips in the cost of automobiles will increase by 4% compared to 2019, reaching 20%.
By 2030, chips could account for 20% of the total cost of a car (Image source: Intel)
Previous article:Wuling's domestically produced chips and battery swaps at the Hainan conference
Next article:99% of new car-making forces will die, and the remaining 1% will bring new life to the industry
Recommended ReadingLatest update time:2024-11-15 08:13
- Popular Resources
- Popular amplifiers
- Microcomputer Principles and Interface Technology 3rd Edition (Zhou Mingde, Zhang Xiaoxia, Lan Fangpeng)
- Microcomputer Principles and Interface Technology Examples and Exercises (Kong Qingyun, Qin Xiaohong)
- Design and application of autonomous driving system (Yu Guizhen, Zhou Bin, Wang Yang, Zhou Yiwei)
- EDA Technology Practical Tutorial--Verilog HDL Edition (Sixth Edition) (Pan Song, Huang Jiye)
- Red Hat announces definitive agreement to acquire Neural Magic
- 5G network speed is faster than 4G, but the perception is poor! Wu Hequan: 6G standard formulation should focus on user needs
- SEMI report: Global silicon wafer shipments increased by 6% in the third quarter of 2024
- OpenAI calls for a "North American Artificial Intelligence Alliance" to compete with China
- OpenAI is rumored to be launching a new intelligent body that can automatically perform tasks for users
- Arm: Focusing on efficient computing platforms, we work together to build a sustainable future
- AMD to cut 4% of its workforce to gain a stronger position in artificial intelligence chips
- NEC receives new supercomputer orders: Intel CPU + AMD accelerator + Nvidia switch
- RW61X: Wi-Fi 6 tri-band device in a secure i.MX RT MCU
Professor at Beihang University, dedicated to promoting microcontrollers and embedded systems for over 20 years.
- LED chemical incompatibility test to see which chemicals LEDs can be used with
- Application of ARM9 hardware coprocessor on WinCE embedded motherboard
- What are the key points for selecting rotor flowmeter?
- LM317 high power charger circuit
- A brief analysis of Embest's application and development of embedded medical devices
- Single-phase RC protection circuit
- stm32 PVD programmable voltage monitor
- Introduction and measurement of edge trigger and level trigger of 51 single chip microcomputer
- Improved design of Linux system software shell protection technology
- What to do if the ABB robot protection device stops
- CGD and Qorvo to jointly revolutionize motor control solutions
- CGD and Qorvo to jointly revolutionize motor control solutions
- Keysight Technologies FieldFox handheld analyzer with VDI spread spectrum module to achieve millimeter wave analysis function
- Infineon's PASCO2V15 XENSIV PAS CO2 5V Sensor Now Available at Mouser for Accurate CO2 Level Measurement
- Advanced gameplay, Harting takes your PCB board connection to a new level!
- Advanced gameplay, Harting takes your PCB board connection to a new level!
- A new chapter in Great Wall Motors R&D: solid-state battery technology leads the future
- Naxin Micro provides full-scenario GaN driver IC solutions
- Interpreting Huawei’s new solid-state battery patent, will it challenge CATL in 2030?
- Are pure electric/plug-in hybrid vehicles going crazy? A Chinese company has launched the world's first -40℃ dischargeable hybrid battery that is not afraid of cold
- 【Iprober 520 Current Probe】Evaluation Report (II) Basic Performance Test
- MicroPython Hands-on (28) - Yeelight for the Internet of Things
- Basic operations and precautions for exporting Gerber files from PCB design (Part 1)
- Allegro cannot be installed due to VC2005. Is there any way to fix this?
- Has anyone used Sensortile Box? Please help~
- RFID semantic events in supply chain environment
- 【GD32307E-START】Light up an LED
- The MP3 purchased with E coins has arrived. It’s never too late to learn English!
- MSP430F5529 library functions
- A seemingly reasonable PCB design, why does the step area on the board bubble after welding?