China Integrated Circuit Design Innovation Conference and IC Application Expo (ICDIA 2022) was successfully held in Wuxi!

On August 25-26, the "Second China Integrated Circuit Design Innovation Conference and IC Application Expo" (ICDIA 2022 for short), hosted by the China Integrated Circuit Design Innovation Alliance, Jiangsu Wuxi Economic Development Zone Management Committee, China Semiconductor Industry Association Integrated Circuit Design Branch, National "Core Fire" Entrepreneurship and Innovation Base (Platform), and "Core High-tech" National Science and Technology Major Project Overall Expert Group, was successfully held at Wuxi Taihu International Expo Center.

Cheng Jinge, Secretary General of China Integrated Circuit Design Innovation Alliance, presided over the opening ceremony. Qiu Gang, Deputy Director of the Major Projects Department of the Ministry of Science and Technology, Zhou Wendong, Deputy Mayor of Wuxi Municipal Government, and Professor Wei Shaojun, Chairman of China Integrated Circuit Design Innovation Alliance, attended the opening ceremony and delivered speeches. Mr. Yang Jianping, Secretary of the Party Working Committee and Director of the Management Committee of Wuxi Economic and Technological Development Zone, introduced the investment environment of semiconductor storage and integrated circuit industry in Wuxi Economic and Technological Development Zone.

The conference was themed "Focus on innovation, integrate applications, and build new development advantages together" . It consisted of a summit forum, supply and demand docking, parallel theme forums, product exhibitions and other links. Nearly 70 integrated circuit companies from home and abroad displayed their latest products and technologies at the conference. Nearly 1,000 people from relevant national ministries and local leaders, industry experts and industry representatives attended the conference.

In the morning of the summit forum, Ye Tianchun, chief technical engineer of National 02 Project, Ding Rongjun, expert in rail transit traction electric transmission and network control and academician of the Chinese Academy of Engineering, Wang Xiaoyun, deputy chief technical engineer of National 03 Project and general manager of the Technology Department of China Mobile Communications Group Corporation, Sun Yuwang, partner and president of SMIC, Zhou Chen, executive vice president of Unigroup Spreadtrum, Chen Wei, chairman of Silergy, Yang Jun, expert of National 01 Project and professor of National ASIC System Engineering Technology Research Center of Southeast University, and other industry experts and corporate representatives delivered keynote speeches at the conference.

Ye Tianchun, chief technical engineer of the National 02 Project, vice chairman and secretary-general of the China Integrated Circuit Innovation Alliance, delivered a keynote speech entitled " Taking the Path of Characteristic Innovation of China's Integrated Circuits."

Ding Rongjun, academician of the Chinese Academy of Engineering and expert in rail transit traction electric transmission and network control, delivered a keynote speech entitled "The Road to Autonomy of High-Speed ​​Train Control Systems" .

Wang Xiaoyun, deputy chief engineer of the National 03 Special Technology and general manager of the Technology Department of China Mobile Communications Group Co., Ltd., delivered a keynote speech entitled "Building a 5G High-Collaborative Innovation Chain and Jointly Building a Strong Basic Industrial Chain . "

Sun Yuwang, partner and president of SMIC Juyuan Equity Investment Management (Shanghai) Co., Ltd., delivered a keynote speech entitled " Capital drives China's chip design industry from quantitative change to qualitative change."

Zhou Chen, executive vice president of Unigroup Spreadtrum Technologies Co., Ltd., delivered a keynote speech titled "New Model of Chip Design Development from the Perspective of Application Systems" .

Chen Wei, Chairman of Silergy Semiconductor Technology (Hangzhou) Co., Ltd., delivered a keynote speech entitled "Discussion on Analog Chip Trends" .

Yang Jun, a national 01 project expert and professor at the National ASIC System Engineering Technology Research Center of Southeast University, delivered a keynote speech entitled "Some Thoughts on the New Era of Integrated Circuit Design" .

In the afternoon of the summit forum, senior representatives from enterprises and institutions such as HuaDa Empyrean, Xinlianxin, Arm Technology, Xinqiyuan, Xinyaohui, Yunbao Intelligent, Innola, Xindong Technology, Kuixin Technology, Xingxin Technology, Solo Technology, ASE, Montage Technology, and China Household Electrical Appliances Research Institute also delivered keynote speeches on topics such as EDA and IP innovation, multi-heterogeneous computing platforms, DPU's transformation of data centers, challenges of ultra-large-scale chip design, automotive electronic component packaging solutions, AI and cloud computing, and the integrated development of China's home appliance industry and chip industry, and shared their views on industry innovation with the delegates.

At the same time as the "Summit Forum", the "Automotive Chip Supply and Demand Matchmaking Conference" was also held on the afternoon of August 25. At the conference, the "Automotive Electronic Chip Innovation Product Catalog" (2022) jointly compiled by the China Integrated Circuit Design Innovation Alliance, China Electronics Technology Standardization Institute, China Association of Automobile Manufacturers Brake Branch, China Society of Automotive Engineering Automobile Modernization Management Branch, Shanghai Society of Automotive Engineering, "China Integrated Circuit" Magazine and other units was released. The "Catalog" collects 383 automotive electronic chip innovation products from 97 local IC companies, involving nearly 20 categories of automotive chip products such as processors, memory, power management, interface chips, power devices, information security chips, network interconnection chips, FPGAs, sensor radar chips, infotainment chips, video chips, etc., of which 43 companies provided 45 AEC-Q100 test reports.

As one of the editorial experts, Chen Dawei, deputy chief engineer of the China Electronics Technology Standardization Institute, interpreted the overall automotive-grade certification status of local automotive chip products published in the "Catalog" from a professional perspective at the automotive chip supply and demand matching meeting. Yuan Chengyin, director/general manager of the National New Energy Vehicle Technology Innovation Center and secretary-general of the China Automotive Chip Industry Innovation Strategic Alliance, delivered a keynote report in the form of video entitled "Development Status and Active Response of China's Automotive Chip Industry . "

Dawei Chen, Deputy Chief Engineer, China Electronics Standardization Institute

In order to promote the linkage between chips and machines and the connection between production and demand, in the innovative product roadshow of the "Automotive Chip Supply and Demand Matchmaking Conference", automotive chip companies such as Jiefa Technology, Xinwang Micro, Xinqing Technology, Indixin, Xinlit, Saizhuo Electronics, Fudan Micro, Suzhou Guoxin Technology, Lingxin, National Technology, Kunrui, Shuming Semiconductor, and Huapu Microelectronics introduced their own different automotive chip products, and complete machine parts manufacturers such as Wuhu Betheli Automotive Safety Systems, SAIC Group, and Dongfeng Motor shared their views and practices on the application and replacement of domestic chips, as well as their own response to the shortage of automotive chips. The matchmaking conference played an important role in building a production-use docking cooperation platform, making two-way efforts to ensure the supply of chip products, and meeting market demand.

Live broadcast of the automotive chip supply and demand matchmaking meeting

On the second day of the conference, special forums such as the "9th Automotive Electronics Innovation Summit Forum", "Automotive Chips and Industrial Ecosystem", "Intelligence and Autonomous Driving Forum", "IC Design Innovation Forum", "Artificial Intelligence and Internet of Things Innovation Forum", and "2022 Storage Innovation and Wuxi Integrated Circuit Industry Cooperation Forum" were also held simultaneously.

Live broadcast of each sub-forum

At the "9th Automotive Electronics Innovation Summit Forum", a ceremony to award the AEC-Q100 reliability certification confirmation audit certificate for automotive chips and a 2022 Automotive Electronics Innovation Award ceremony were also held.

In recent years, Wuxi has been committed to building the integrated circuit industry into a landmark industry with industrial agglomeration, extensive influence and core competitiveness, and has gradually formed a complete industrial chain covering integrated circuit design, manufacturing, packaging and testing, supporting equipment and materials, etc., gathering more than 400 companies including China Resources Microelectronics, Changdian Technology, Zhongkexin, SK Hynix, Huahong Wuxi, etc. The successful convening of the China Integrated Circuit Design Innovation Conference and IC Application Expo will have a far-reaching impact on further enhancing the influence and core competitiveness of Wuxi's integrated circuit industry and promoting the innovative development of China's integrated circuits.