According to the Nikkei Chinese website on May 18, Japan's Renesas Electronics announced on May 17 that it will invest approximately 90 billion yen to increase production of power semiconductors used for power control.
Renesas will introduce new manufacturing equipment for the Kofu plant, which was closed in October 2014, and use 300mm diameter wafers for mass production.
Renesas has previously used 150-200 mm diameter wafers to mass-produce power semiconductors, and this is the first time that it supports large-size wafers. Renesas will start trial production in the first half of 2024 and start full-scale mass production centered on automotive use in 2025, doubling its production capacity.
Renesas Electronics was established on April 1, 2003 by the merger of the semiconductor divisions of Hitachi, Ltd. and Mitsubishi Electric. Combining the advanced technologies and rich experience of Hitachi and Mitsubishi in the semiconductor field, Renesas is a global leading supplier of embedded semiconductors designed and manufactured for the wireless network, automotive, consumer and industrial markets.
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