In May 2020, TSMC, the leading foundry, announced that it would invest $12 billion to build a 5nm advanced process wafer fab in Arizona, the United States. The first phase of production capacity can reach 20,000 wafers per month, and mass production is expected to begin in 2024. Last year, the construction of the wafer fab had already started. However, the lack of local semiconductor talent has also brought great challenges to TSMC.
Recently, TSMC founder Morris Chang gave a speech at the Brookings Institution, a US think tank, and said that the cost of building a factory in the United States for TSMC has increased by 50% compared to Taiwan, and that building a factory in the United States also faces the problem of a shortage of semiconductor manufacturing talent.
The key reason is that the U.S. manufacturing industry has been shrinking in recent years, especially the semiconductor manufacturing talent shortage. In addition, there are very few local technicians willing to work overtime and in shifts. This is a major problem for TSMC's U.S. wafer factory, which needs to recruit thousands of employees.
In response to this, TSMC started recruiting in the United States last year. According to previous news, the first batch of engineers recruited locally have come to TSMC Tainan Fab 18 for relevant training. The latest news shows that TSMC is currently recruiting relevant technicians in Taiwan who can be stationed in the wafer factory in Arizona, USA.
According to reports, the recruitment qualifications require that applicants have a high school diploma or above, and experience in the semiconductor industry is preferred, but no experience is also acceptable. However, since the job must be conducted in an all-English environment, the TOEIC score must be above 800 (out of a total of 990 points).
Related reports emphasize that the work of TSMC's operators stationed in Arizona wafer factories includes machine operation, product inspection, equipment abnormalities, etc. After being admitted, they must first work in TSMC's factories in Hsinchu Science Park, Central Science Park, or Southern Science Park, and then be stationed in Arizona wafer factories in the United States before the end of December to meet the company's needs. The time is at least 2 years. For the technicians' time in Arizona, the company will provide accommodation, local and return transportation subsidies.
Previous article:The U.S. House of Representatives jointly protested against Wingtech's acquisition of NWF, the largest chip manufacturer in the UK
Next article:Ministry of Industry and Information Technology: Pressure on chip supply and price stability increases
Recommended ReadingLatest update time:2024-11-15 02:40
- ASML provides update on market opportunities at 2024 Investor Day
- It is reported that memory manufacturers are considering using flux-free bonding for HBM4 to further reduce the gap between layers
- Intel China officially releases 2023-2024 Corporate Social Responsibility Report
- Mouser Electronics and Analog Devices Launch New E-Book
- AMD launches second-generation Versal Premium series: FPGA industry's first to support CXL 3.1 and PCIe Gen 6
- SEMI: Global silicon wafer shipment area increased by 6.8% year-on-year and 5.9% month-on-month in 2024Q3
- TSMC's 5nm and 3nm supply reaches "100% utilization" showing its dominance in the market
- LG Display successfully develops world's first stretchable display that can be expanded by 50%
- Infineon's revenue and profit both increased in the fourth quarter of fiscal year 2024; market weakness in fiscal year 2025 lowered expectations
- LED chemical incompatibility test to see which chemicals LEDs can be used with
- Application of ARM9 hardware coprocessor on WinCE embedded motherboard
- What are the key points for selecting rotor flowmeter?
- LM317 high power charger circuit
- A brief analysis of Embest's application and development of embedded medical devices
- Single-phase RC protection circuit
- stm32 PVD programmable voltage monitor
- Introduction and measurement of edge trigger and level trigger of 51 single chip microcomputer
- Improved design of Linux system software shell protection technology
- What to do if the ABB robot protection device stops
- CGD and Qorvo to jointly revolutionize motor control solutions
- CGD and Qorvo to jointly revolutionize motor control solutions
- Keysight Technologies FieldFox handheld analyzer with VDI spread spectrum module to achieve millimeter wave analysis function
- Infineon's PASCO2V15 XENSIV PAS CO2 5V Sensor Now Available at Mouser for Accurate CO2 Level Measurement
- Advanced gameplay, Harting takes your PCB board connection to a new level!
- Advanced gameplay, Harting takes your PCB board connection to a new level!
- A new chapter in Great Wall Motors R&D: solid-state battery technology leads the future
- Naxin Micro provides full-scenario GaN driver IC solutions
- Interpreting Huawei’s new solid-state battery patent, will it challenge CATL in 2030?
- Are pure electric/plug-in hybrid vehicles going crazy? A Chinese company has launched the world's first -40℃ dischargeable hybrid battery that is not afraid of cold
- ARM or x86? Who will stand out in the future industrial SBC digital industry?
- ST MEMS Device Resource Library-Development Platform Application Guide
- A new low-cost miniaturized GPS antenna
- This factory will run on 100% renewable energy!
- Question about the positive input pin of the proportional amplifier circuit being left floating
- AWR1243 RF Powered-up RF enable failure (Dev mode) processing
- [Raspberry Pi Pico Review] Driver for the digital tube display module
- The new Keysight DSOX1102G oscilloscope is upgraded to 200M
- Problems with long pressing of infrared remote control
- Looking for a simple 24V to 12V100mA circuit