AMD launches world's first data center CPU with 3D chip stacking

AMD announced the full launch of the world's first data center CPU with 3D die stacking, the third-generation AMD EPYC processors with AMD 3D V-Cache technology, code-named "Milan-X". Based on the "Zen 3" core architecture, these processors further expand the third-generation EPYC processor family and provide up to 66% performance improvement over non-stacked third-generation AMD EPYC processors for a variety of targeted technical computing workloads.

The new processors feature industry-leading L3 cache, the same socket, software compatibility, and modern security features as 3rd Gen EPYC CPUs, while delivering exceptional performance for technical computing workloads such as computational fluid dynamics (CFD), electronic design automation (EDA), and structural analysis. These workloads are critical design tools for companies that need to model the complex physical world to create models to test or validate engineering designs for the world’s most innovative products.

“Building on our momentum in the data center and our industry firsts, 3rd Gen AMD EPYC processors with AMD 3D V-Cache showcase our leading design and packaging technology, enabling us to deliver the industry’s first workload-specific server processors with 3D die stacking,” said Dan McNamara, senior vice president and general manager, Server Business Unit, AMD. “Our latest processors with AMD 3D V-Cache deliver breakthrough performance for mission-critical technical computing workloads, leading to better product designs and faster time to market.”

"Customers are increasingly adopting data-rich applications, which are placing new demands on data center infrastructure," said Raj Hazra, senior vice president and general manager of the Compute and Networking Group at Micron. "Micron and AMD share a common vision to deliver the full capabilities of leading-edge DDR5 memory for high-performance data center platforms. Our deep collaboration with AMD includes preparing AMD platforms based on Micron's latest DDR5 solutions, as well as bringing 3rd Gen AMD EPYC processors with AMD 3D V-Cache technology to our own data centers, where we have seen up to 40 percent performance improvements in specific EDA workloads compared to 3rd Gen AMD EPYC processors without AMD 3D V-Cache."

Industry-leading packaging technology innovation

Cache size increases have long been a top priority for performance improvements, especially for technical computing workloads that rely heavily on large data sets. These workloads benefit from increased cache size, but 2D chip designs impose physical limitations on the amount of cache that can be effectively built on a CPU. AMD 3D V-Cache technology addresses these physical challenges by combining the AMD "Zen 3" core with cache modules, increasing the amount of L3 cache while minimizing latency and increasing throughput. This technology represents another innovation in CPU design and packaging, and delivers breakthrough performance for targeted technical computing workloads.

Breakthrough Performance

As the world’s highest-performing server processor for technical computing, 3rd Gen AMD EPYC processors with AMD 3D V-Cache technology deliver faster results and efficiency for targeted workloads such as:

* EDA – The 16-core AMD EPYC 7373X CPU delivers up to 66% faster simulation speeds for Synopsys VCS compared to the EPYC 73F3 CPU.

* FEA – 64-core AMD EPYC 7773X processor delivers enhanced performance in Altair Radioss simulation applications.

* CFD – The 32-core AMD EPYC 7573X processor enables more CFD problems to be solved every day when running ANSYS CFX.

These performance and capabilities will ultimately help customers deploy fewer servers and reduce data center energy consumption, thereby lowering total cost of ownership (TCO), reducing carbon emissions and achieving their environmental sustainability goals.

Industry-wide ecological support

3rd Gen AMD EPYC processors with AMD 3D V-Cache technology are currently supported by a broad range of OEM partners including Atos, Cisco, Dell Technologies, HPE, Lenovo, QCT, and Supermicro.

The 3rd Gen AMD EPYC processor with AMD 3D V-Cache technology is also supported by a broad range of AMD software ecosystem partners, including Altair, Ansys, Cadence, Dassault Systèmes, Siemens and Synopsys.

Microsoft Azure HBv3 virtual machines are now fully upgraded to the third generation AMD EPYC with AMD 3D V-Cache technology. Microsoft said that HBv3 virtual machines are the fastest deployed products in the history of the Azure HPC platform, and compared with the previous generation HBv3 series virtual machines, thanks to the support of AMD 3D V-Cache, the performance of key HPC workloads has increased by up to 80%.