Recently, Yiwu Chip Industrial Park was officially put into use. Four semiconductor companies, namely, Nanochip, AnyCe, RuiCe and Xinneng, have entered the park. It is expected that the total investment of 1 billion yuan will be completed by the end of next year.
It is understood that Yiwu Chip Industrial Park covers an area of about 39 acres, with a land area of about 26,000 square meters and a total construction area of over 58,000 square meters. It integrates chip factory management offices and employee life functions, creating space for product research and development, testing, IC design, code development, etc.
On July 7, a signing ceremony for Yiwu's investment promotion projects was held, including the Yiwu Semiconductor Industry Mother Fund Project, Ruice Semiconductor Project, Flanders 5G Optoelectronic New Materials Project, Rena Silver Paste Project, overseas semiconductor mergers and acquisitions, and a monthly production of 150,000 pieces of 8-inch wafer factory projects.
According to the news released by Yiwu, in July, Yiwu signed 6 chip semiconductor projects, planned to establish a 10 billion yuan semiconductor industry mother fund, planned to build a chip town, actively seized the new strategic heights of semiconductor development, and strived to promote Yiwu's semiconductor industry to the forefront of the country.
Previous public information showed that the Yiwu Semiconductor Industry Fund of Funds project will establish a Yiwu Semiconductor Industry Fund of Funds with a total scale of 10 billion yuan, with a term of 8+2+2. Shanghai Weihao Chuangxin Investment Management Co., Ltd. will coordinate high-quality listed companies in the semiconductor industry chain and Yiwu Industrial Investment Development Group Co., Ltd. to jointly invest.
In recent years, Yiwu Economic and Technological Development Zone has focused on building a chip industry chain system, creating a Yiwu chip enterprise development cluster base through the chip industrial park, and focusing on introducing industrial chain projects such as semiconductor materials, equipment manufacturing, packaging and testing.
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