Provides the industry's highest capacity flash, RAM, and GPIO combination, supporting Matter over Thread
Beijing, China – April 9, 2024 – Silicon Labs (NASDAQ: SLAB), a global leader committed to building a more connected world with secure, intelligent wireless connectivity technologies, today announced the launch of the new xG26 series of wireless system-on-chips (SoCs) and microcontrollers (MCUs), the highest performance series of leading companies in the IoT industry to date. The new series includes the multi-protocol MG26 SoC, low-power Bluetooth (Bluetooth LE) BG26 SoC and PG26 MCU. All three products have twice the flash and RAM capacity of other multi-protocol products of Silicon Labs and are designed to meet the needs of the future Internet of Things (IoT) to cope with some demanding emerging applications such as Matter.
"As users from consumer to industrial sectors gain more benefits from their IoT deployments, their needs are steadily increasing," said Matt Johnson, CEO of Silicon Labs. "The new xG26 family is built for the future, giving device makers confidence that their current designs will meet future needs."
To help designers build devices capable of running advanced IoT applications, the xG26 family offers the following features:
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Compared to the xG24 family, the flash, RAM and GPIO capacity have been doubled to support IoT device manufacturers in developing advanced edge applications. Its double the number of general-purpose input/output (GPIO) pins of the xG24 means that device manufacturers can connect it to twice as many peripherals for better system integration.
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The ARM® Cortex®-M33 CPU and dedicated cores for RF and security subsystems enable higher-performance computing capabilities in a multi-core format, helping to free up the main cores for customer applications.
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Embedded artificial intelligence/machine learning (AI/ML) hardware acceleration capabilities increase the processing speed of machine learning algorithms by 8 times, while consuming only 1/6 of the original power, achieving higher energy efficiency.
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Best-in-class security is achieved through Silicon Labs Secure Vault™ technology and ARM TrustZone technology. Leveraging Silicon Labs’ custom component manufacturing services, xG26 products can also be hard-coded with customer-designed security keys and other features during the manufacturing process, further enhancing their ability to resist vulnerabilities.
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Leverage Silicon Labs’ proven, tested, and certified 2.4 GHz wireless protocol software stacks for 2.4 GHz wireless connectivity, including Matter, Zigbee, OpenThread, Bluetooth Low Energy, Bluetooth mesh, proprietary protocols, and multi-protocols, while delivering an optimal RF link budget that increases transmission range and reduces transmission retries, resulting in a better user experience and extended battery life.
MG26 multi-protocol SoC is designed to be the most advanced SoC supporting Matter over Thread
Silicon Labs is focused on Matter, a rapidly deployable application layer protocol that enables devices to interoperate across leading IoT networks and ecosystems. Silicon Labs is the largest contributor to Matter code in the semiconductor space and the third largest contributor of all vendors. The experience gained from working on the development of Matter has given Silicon Labs a deep understanding of how to build products that adapt to the evolving needs of the Matter standard as Matter adds support for new device types, security enhancements, and more. Since the release of Matter 1.0 in October 2022, Matter code requirements for most device types have increased by 6% in the 18 months so far.
Consumers who invest in a Matter-enabled smart home don’t want their new devices to become obsolete in a few years. Instead, they want to be confident that the Matter device they bought last year will still work with the same devices and be just as secure as the next Matter device they buy next year. That’s the promise of Matter interoperability and security, and why Silicon Labs designed the MG26 to be the most advanced Matter-enabled SoC.
Built on the same platform as the award-winning MG24 multi-protocol wireless SoC, the MG26 has twice the flash and RAM capacity of the MG24, configurable up to 3200 KB of flash and 512 KB of RAM. The MG26 also has twice the number of GPIO pins, which means device manufacturers can connect it to twice as many peripherals for better system integration.
MG26、BG26和PG26集成了芯科科技专有的矩阵矢量AI/ML硬件加速器,不止可以为Matter应用,而是可以为所有应用实现更高的智能。该专用内核针对机器学习进行了优化,处理机器学习操作的速度提升了高达8倍,而功耗仅为传统嵌入式CPU的1/6。这显著提高了该系列产品的能量效率,因为这些产品可以将基于机器学习的激活或唤醒提示交由加速器分担,从而允许更多耗电功能进入休眠状态,可以最大限度地降低电池消耗。这对于传感器或开关等电池供电的智能家居设备来说是理想的选择,因为消费者希望这些设备能够隐匿在他们的家庭环境中,而不是需要不断更换电池来引起他们的注意。
Silicon Labs Strengthens Its IoT Leadership with New SoC and MCU Portfolios
Silicon Labs is one of the world’s leading companies focused entirely on the Internet of Things, with unmatched breadth, depth, and expertise in the field. That’s why the xG26 is offered as a family of products. The MG26 is ideal for Matter, the BG26 Bluetooth SoC has all the same features and is optimized for Bluetooth LE and Bluetooth mesh, while the PG26 provides low-power intelligence for non-connected applications such as CCTV cameras, remote controls, and children’s toys. Pin compatibility between the more advanced xG26 and xG24 products, as well as shared hardware and software development tools like Silicon Labs Simplicity Studio, make development simple and enable seamless migration from other products in Silicon Labs’ second-generation wireless development platform.
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