Intel CEO Pat Gelsinger once used two keywords to summarize Intel's "core" and "soul": one is "innovation" and the other is "execution." In 2023, in the face of new demands and challenges brought about by the ever-changing digitalization process, Intel continues to be committed to innovation in the field of technology, has achieved a number of breakthroughs, and has steadily released new products in accordance with the established roadmap with strong execution capabilities to support " The vigorous development of "core economy".
Specifically, Intel has mainly made the following progress in technology and products in 2023:
December
Intel launches a new generation of powerful products to accelerate the more common application of AI in cloud-edge workloads:
Intel Core Ultra processor represents the company's most significant architectural change in 40 years. It has a built-in on-chip AI accelerator - neural network processing unit NPU, which provides power for AI PC and new applications.
The fifth-generation Intel Xeon Scalable processor has built-in AI accelerators in each core, bringing more powerful AI capabilities to data centers, clouds, networks, and edges.
The Intel Gaudi3 accelerator, which will be released as scheduled next year, was demonstrated for the first time.
At IEDM 2023, Intel demonstrated research progress that continues to advance Moore's Law, including 3D stacked CMOS transistors that combine back-side powering and direct back-contacts, expansion paths for back-side powering technology (such as back-side contacts), and taking the lead in the same 300 Successfully integrated silicon transistors and gallium nitride transistors on millimeter wafers.
November
Intel showcased its next-generation Core Intelligent Cockpit Platform for smart cars, hoping to help OEMs create a more immersive in-cabin experience for users.
October
Intel launched the "AI PC Acceleration Program", through in-depth cooperation with more than 100 ISV partners and integrating more than 300 AI acceleration functions, to accelerate the popularization of AI applications and bring AI features to more than 100 million PCs by 2025.
Intel Radar A580 desktop graphics card is available through global partners, providing users with excellent mid-range product choices.
September
Intel announced that it has begun mass production of the Intel 4 process node using extreme ultraviolet lithography (EUV) technology for Intel Core Ultra processors. The "Five Process Nodes in Four Years" plan is progressing steadily.
At the Intel on Technology Innovation Conference, Intel released a series of new products and technologies aimed at making AI ubiquitous and promoting the vigorous development of the "core economy":
Chip technology
Intel demonstrated the first multi-die package based on the Universal Core Interconnect Express (UCIe) open specification.
Hardware products
Intel disclosed the latest progress of future client and data center processor products, and will promote the wider application of AI in client, edge, network and cloud workloads based on leading products.
Software products
Intel announced the full launch of the Intel Developer Cloud Platform, released version 2023.2 of the Intel distribution OpenVINO tool suite, and launched the Strata project and the development of edge native software platforms.
Intel has announced the industry's first glass substrate for next-generation advanced packaging, which it plans to introduce to the market in the next few years.
Intel released version 3.0 of Intel Super Cloud Terminal, which not only meets the basic requirements for centralized management, but can also easily cope with the needs of more different scenarios, improves the experience of large-scale end users, and helps realize personalized office in the future.
Intel has launched Thunderbolt 5, a new generation of Thunderbolt connection standard, providing PC users with even more superior connection speed and bandwidth advantages.
The fourth generation Intel® Xeon® Scalable processors and others demonstrated powerful AI inference performance in the MLPerf inference v3.1 performance benchmark test.
August
Intel and Synopsys announced that they will jointly develop an IP product portfolio based on Intel 3 and Intel 18A process nodes for Intel Foundry Services customers, allowing Intel Foundry Services to provide higher quality services to existing and future customers.
Intel Sharp Graphics releases a major performance update for DirectX 11 games.
July
Intel launches the new Gaudi2 processor, which accelerates AI training and inference with its leading cost-effectiveness, provides higher deep learning performance and efficiency, and becomes a better solution for large-scale deployment of AI.
Intel and Ericsson have reached a strategic cooperation agreement to use the Intel 18A process to create customized 5G system-level chips for Ericsson and provide optimization for Ericsson's Cloud RAN solution.
June
Intel PowerVia is the first to implement backside power supply on product-level test chips. This technology, which will be launched in the Intel 20A process, solves the increasingly serious chip interconnect bottleneck problem by moving the power line to the back of the wafer.
Intel Ruixuan Pro A60 and Pro A60M two professional-grade graphics card products were released.
Intel releases Tunnel Falls, a new quantum chip containing 12 silicon spin qubits. Silicon spin qubits are expected to be mass-produced faster because they can be produced in fabs and are 1 million times smaller than other types of qubits.
Fourth-generation Intel® Xeon® Scalable processors demonstrate impressive training results in MLPerf Training 3.0, and Xeon’s built-in accelerators make them an ideal solution for running large AI workloads on general-purpose processors.
Intel Research Institute released a new AI diffusion model LDM3D, which can generate 360-degree panoramas based on text prompts.
May
Intel Bridge Technology and Celadon enable Android applications to be seamlessly switched to run on Windows PCs.
Intel Flex series GPU releases software update package to expand support for new features such as Windows cloud gaming and AI workloads.
April
Intel Foundry Services and Arm announced a collaboration on multi-generation cutting-edge system chip design, enabling chip design companies to develop low-power computing system-on-chips using the Intel 18A process. This cooperation will first focus on the design of mobile system-level chips.
March
Intel disclosed its Xeon product roadmap for 2025: Sierra Forest, an energy-efficient core processor using Intel 3 process node, will be launched in the first half of 2024; Granite Rapids, a performance core processor, will be launched soon after; Clearwater Forest, the next-generation energy-efficient core processor, will be released in 2025.
February
Intel Sharp Graphics releases major performance update for DirectX 9 games.
January
Intel releases the fourth generation Intel Xeon Scalable processors, Intel Xeon CPU Max series and Intel Data Center GPU Max series. The fourth-generation Intel Xeon Scalable processors with numerous built-in accelerators are designed to meet the performance needs of diverse workloads in a sustainable manner. As of the third quarter, more than 1 million units have been shipped.
Entering 2024, Intel will continue to move forward rapidly, launch innovative technologies and leading products as planned, promote high-quality development with sustainable computing power, and work with partners to create a better digital future.
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