XPC755BPX400LER2 datasheet, PDF

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XPC755BPX400LER2: Description32-BIT, 400MHz, RISC PROCESSOR, PBGA360, PLASTIC, BGA-360; CategoryThe embedded processor and controller Microcontrollers and processors; File Size79KB，8 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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XPC755BPX400LER2 Overview

32-BIT, 400MHz, RISC PROCESSOR, PBGA360, PLASTIC, BGA-360

XPC755BPX400LER2 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
Parts packaging code	BGA
package instruction	PLASTIC, BGA-360
Contacts	360
Reach Compliance Code	unknown
ECCN code	3A991
Address bus width	32
bit size	32
boundary scan	YES
maximum clock frequency	100 MHz
External data bus width	64
Format	FLOATING POINT
Integrated cache	YES
JESD-30 code	S-PBGA-B360
JESD-609 code	e0
length	25 mm
low power mode	YES
Humidity sensitivity level	3
Number of terminals	360
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA255,16X16,50
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	2,2.5/3.3 V
Certification status	Not Qualified
Maximum seat height	2.77 mm
speed	400 MHz
Maximum supply voltage	2.1 V
Minimum supply voltage	1.9 V
Nominal supply voltage	2 V
surface mount	YES
technology	CMOS
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	25 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

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Advance Information

MPC755XLEPNS/D

Rev. 0, 2/2003

MPC755 Part Number

Specification for the

XPC755Bxx400LE and

XPC755CRX450LE Series

Motorola Part

Numbers Affected:

XPC755BRX400LE

XPC755BPX400LE

XPC755CRX450LE

This document describes part-number-specific changes to recommended operating conditions

and revised electrical specifications, as applicable, from those described in the general

MPC755 RISC Microprocessor Hardware Specifications

(Order No. MPC755EC/D). The

devices described in this specification are no longer in production and this document is

provided for reference only. For recommended upgrades or replacement devices, contact your

Motorola sales office.

Specifications provided in this document supersede those in the

MPC755 RISC

Microprocessor Hardware Specifications,

Rev. 6 or later, for the part numbers listed in

Table A only. Specifications not addressed herein are unchanged. Because this document is

frequently updated, refer to http://www.motorola.com/semiconductors or to your Motorola

sales office for the latest version.

Note that headings and table numbers in this document are not consecutively numbered. They

are intended to correspond to the heading or table affected in the general hardware

specification.

Part numbers addressed in this document are listed in Table A. For more detailed ordering

information, see Section 1.10, “Ordering Information.”

Table A. Part Numbers Addressed by This Data Sheet

Operating Conditions

Motorola

Part Number

CPU

Frequency

(MHz)

400

(°C)

Significant Differences from

Hardware Specification

XPC755BRX400LE

XPC755BPX400LE

XPC755CRX450LE

2.0 V ±100 mV 0 to 105 Modified power specifications. These

devices are no longer in production.

450

Note:

The X prefix in a Motorola PowerPC part number designates a “Pilot Production Prototype” as

defined by Motorola SOP 3-13. These are from a limited production volume of prototypes

manufactured, tested, and Q.A. inspected on a qualified technology to simulate normal production.

These parts have only preliminary reliability and characterization data. Before pilot production

prototypes may be shipped, written authorization from the customer must be on file in the applicable

sales office acknowledging the qualification status and the fact that product changes may still occur

while shipping pilot production prototypes.

XPC755BPX400LER2 Related Products

	XPC755BPX400LER2	XPC755BPX400LE	XPC755BRX400LE
Description	32-BIT, 400MHz, RISC PROCESSOR, PBGA360, PLASTIC, BGA-360	32-BIT, 400MHz, RISC PROCESSOR, PBGA360, PLASTIC, BGA-360	32-BIT, 400MHz, RISC PROCESSOR, CBGA360, CERAMIC, BGA-360
Parts packaging code	BGA	BGA	BGA
package instruction	PLASTIC, BGA-360	BGA,	BGA, BGA360,19X19,50
Contacts	360	360	360
Reach Compliance Code	unknown	unknown	unknown
ECCN code	3A991	3A991	3A991
Address bus width	32	32	32
bit size	32	32	32
boundary scan	YES	YES	YES
maximum clock frequency	100 MHz	100 MHz	100 MHz
External data bus width	64	64	64
Format	FLOATING POINT	FLOATING POINT	FLOATING POINT
Integrated cache	YES	YES	YES
JESD-30 code	S-PBGA-B360	S-PBGA-B360	S-CBGA-B360
length	25 mm	25 mm	25 mm
low power mode	YES	YES	YES
Number of terminals	360	360	360
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED
encapsulated code	BGA	BGA	BGA
Package shape	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.77 mm	2.77 mm	3.2 mm
speed	400 MHz	400 MHz	400 MHz
Maximum supply voltage	2.1 V	2.1 V	2.1 V
Minimum supply voltage	1.9 V	1.9 V	1.9 V
Nominal supply voltage	2 V	2 V	2 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Terminal form	BALL	BALL	BALL
Terminal pitch	1.27 mm	1.27 mm	1.27 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM
width	25 mm	25 mm	25 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Is it Rohs certified?	incompatible	-	incompatible
Maker	NXP	-	NXP
JESD-609 code	e0	-	e0
Encapsulate equivalent code	BGA255,16X16,50	-	BGA360,19X19,50
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	NOT SPECIFIED
power supply	2,2.5/3.3 V	-	2 V
Terminal surface	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED

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