On October 30, Samsung is currently expanding the proportion of Qualcomm Snapdragon chips used in its Galaxy flagship phones, while its own Exynos chips mainly cover mid-to-low-end and home appliance products.
According to a report by Korean media SEDaily on October 29, Exynos chips may not even be able to keep their position in other areas. Samsung may be pushing home appliances to install Qualcomm's application processor chips, the report said. In order to keep up with the AI era, Samsung is in favor of using cutting-edge chips in such devices.
The report mentioned that since Samsung needs to install expensive Qualcomm processors in the Galaxy S25 series smartphones to be released next year, it plans to achieve cost-effectiveness by actively installing Qualcomm products in home appliances.
Yoo Mi-young, vice president of Samsung Electronics' home appliance division, once said: "We are developing products with the goal of launching home appliances that use large-scale language models on devices (that is, edge AI) in 2025. We are developing our own low-power, high-performance neural network processing unit (NPU) chips. Multiple organizations are conducting research."
The report also believes that the most affected home appliance product is the refrigerator. The AI in the latest Samsung refrigerator uses a camera to identify ingredients and recommend recipes. To make this AI function more advanced, the support of cutting-edge chips is essential.
IT Home noticed that Samsung Electronics has been developing Exynos 2500, but previous sources said that Samsung Galaxy S25/S25+/Ultra mobile phones in the global market are all equipped with Qualcomm Snapdragon 8 Extreme Edition.
Korean media reported that the price of Snapdragon 8 Extreme Edition is about twice that of Exynos. Samsung decided to actively expand Qualcomm chips into the field of home appliances to follow the trend of smart home appliances and spread the cost. An industry insider said that the price of the latest Snapdragon products has increased by 20% compared with previous models, so Samsung's cost burden has also increased significantly, which is a reasonable choice for Samsung.
Previous article:GMCC Technology Industrial Park: Creating a new benchmark for μ-level precision manufacturing of consumer electronics
Next article:最后一页
Recommended ReadingLatest update time:2024-11-23 18:03
- Apple reveals the secret of its own chip success: competitors can't use the latest cutting-edge technology
- Nvidia's new generation Blackwell GPU is exposed to overheating problems, causing delivery delays
- Innovation is not limited to Meizhi, Welling will appear at the 2024 China Home Appliance Technology Conference
- Enjoy big-screen gaming anytime, anywhere: Making portable 4K UHD 240Hz gaming projector a reality
- AMD surpasses Intel: CPU shipments surge in Q3 this year
- Exynos is losing ground, Samsung plans to use Qualcomm chips in home appliances
- Intel and 50 partners unveiled a full range of 30 notebook and desktop AI PCs equipped with Intel Core Ultra (2nd Generation)
- Innovation leads the new trend of mobile refrigeration GMCC will present new products at 2024 CIAAR
- Lenovo and NVIDIA expand collaboration to jointly launch new liquid-cooled AI servers
- Intel promotes AI with multi-dimensional efforts in technology, application, and ecology
- ChinaJoy Qualcomm Snapdragon Theme Pavilion takes you to experience the new changes in digital entertainment in the 5G era
- Infineon's latest generation IGBT technology platform enables precise control of speed and position
- Two test methods for LED lighting life
- Don't Let Lightning Induced Surges Scare You
- Application of brushless motor controller ML4425/4426
- Easy identification of LED power supply quality
- World's first integrated photovoltaic solar system completed in Israel
- Sliding window mean filter for avr microcontroller AD conversion
- What does call mean in the detailed explanation of ABB robot programming instructions?
- STMicroelectronics discloses its 2027-2028 financial model and path to achieve its 2030 goals
- 2024 China Automotive Charging and Battery Swapping Ecosystem Conference held in Taiyuan
- State-owned enterprises team up to invest in solid-state battery giant
- The evolution of electronic and electrical architecture is accelerating
- The first! National Automotive Chip Quality Inspection Center established
- BYD releases self-developed automotive chip using 4nm process, with a running score of up to 1.15 million
- GEODNET launches GEO-PULSE, a car GPS navigation device
- Should Chinese car companies develop their own high-computing chips?
- Infineon and Siemens combine embedded automotive software platform with microcontrollers to provide the necessary functions for next-generation SDVs
- Continental launches invisible biometric sensor display to monitor passengers' vital signs
- ST's sensors can be purchased at the STM32 Tmall official flagship store
- Gear Speed Measurement Using Differential Hall Devices
- "Dating in Spring" + "Just Strolling"
- How to build a Keil project using the LPC8xx ROM?
- C2000 CLA FAQ: Architecture and Configuration
- Analysis of China Mobile and China Unicom packages: choosing the wrong package will lead to wasted money
- New infrared temperature measurement thermal imager is coming! AutoNavi holds a press conference in Beijing!
- Divide an assembly file into several assembly files. Compile prompt variable is not defined
- LT8918L: LVDS to 1-Port MIPI signal conversion chip solution introduction
- RF amplifier performance test