According to media reports, SK Hynix plans to invest in and build a huge semiconductor production park in Yongin City, central Gyeonggi Province, South Korea, costing at least 120 trillion won (approximately US$90.7 billion).
It is reported that the new semiconductor production park includes four independent wafer fabs and will become the largest three-layer wafer fab in the world.
SK hynix announced development plans in 2019, but development was delayed due to licensing issues. SK hynix said the plan has made progress through an agreement reached by central and local governments and companies in 2022.
According to SK Hynix's plan, the new production park will officially break ground in March 2025. The first wafer fab is expected to be completed in 2027, and the construction of the entire park is expected to be fully completed in 2046.
At present, there is no clear news about the specific production direction of the first wafer fab, that is, whether it will produce DRAM or NAND flash memory chips.
However, considering the current strong demand for HBM products in the artificial intelligence market and the tight production capacity of SK hynix, this direction is likely to be its key consideration.
It is understood that four wafer fabs will occupy half of the park, and SK Hynix will also build a large number of supporting support facilities in the park, such as wastewater treatment plants.
In addition to SK Hynix, Samsung has also chosen to build a similar semiconductor production park nearby, including a research and development center.
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