Universal Instruments and parent company Delta Electronics debuted at SEMICON Taiwan to demonstrate semiconductor solutions

High-precision front-end and terminal process solutions drive smart factory efficiency

Universal Instruments and its parent company Delta Electronics will make an appearance at the SEMICON Taiwan exhibition held in Taipei from September 6 to 8. At booth Q5446 in Hall 2 of the exhibition hall, they will focus on semiconductor front-end and back-end solutions, including Delta's wafer inspection and grinding edge solutions as well as Universal Instruments’ multi-chip advanced packaging solutions. Delta focused on demonstrating wafer edge grinding, edge profile measurement, sorting and infrared pinhole detection functions, while Universal Instruments demonstrated the performance of the FuzionSC™ semiconductor placement machine equipped with a high-speed wafer feeder.

The FuzionSC semiconductor placement machine can place the widest size range of advanced packaging components with high precision on the largest working area and achieve the highest speed flip-chip assembly. FuzionSC handles all aspects of flip-chip assembly, reducing operating and capital costs by maximizing floor space throughput. The high-speed wafer feeder is the world's fastest fast-switching multi-chip feeder. When used with the FuzionSC semiconductor placement machine, it can provide the highest utilization rate and the best overall economic benefits for advanced multi-chip applications.

"With the booming development of multi-chip packaging, we have launched a solution that can handle different types of chips on the same machine, avoiding the need to transfer products between different machines, reducing accuracy and efficiency." Global Instruments Marketing Vice President President Glenn Farris continued, “The system’s flexibility, accuracy and throughput make it the world’s only all-in-one solution for cutting-edge applications such as heterogeneous integration and electric vehicle power module assembly. We are excited to At the exhibition, we will showcase its capabilities and Delta’s wide range of precision process solutions to the semiconductor industry.”

In addition to demonstrations at the booth, Global Instruments Vice President of Marketing Glenn Farris delivered speeches on advanced packaging assembly challenges at two international forums, including attending the International Forum on Soft Hybrid Electronics at 3:30 pm on September 6, delivering a speech entitled " "Advanced Packaging Technology Supports Wearable Electronic Products" and a speech titled "Intelligent System Architecture for Heterogeneous Integrated Assembly" at the High-Tech Smart Manufacturing Forum at 2:40 pm on September 8.

If you want to know more about how Universal Instruments Solutions addresses electronic production challenges, you can call 0755-2685-9108 or 021-6495-2100, or visit cn.uic.com for details.

FuzionSC semiconductor placement machine combined with high-speed wafer feeder is the best semiconductor solution