It is reported that TSMC has made a major breakthrough in 3nm mass production and will start production in August this year

According to Taiwan’s United Daily News, the battle between TSMC and Samsung over the 3nm process has always attracted the attention of the global semiconductor industry.

According to investigations, TSMC's 3nm process, which was once delayed in development, has recently made a major breakthrough. The delay caused Apple's new generation of processors to still use the enhanced version of 5nm N4P.　　

According to reports, TSMC has decided to mass-produce the second version of the 3nm process N3B this year, and will simultaneously start production in August at the eighth phase of the R&D center at Fab 12 in Hsinchu and the P5 plant at Fab 18 in Southern Taiwan Science Park. It will officially use the fin field-effect transistor (FinFET) architecture to compete with Samsung's gate-all-around (GAA) process.

IT Home previously reported that there are reports that TSMC's 3nm manufacturing process will still go into production later this year. The variant entering production is called "N3B", and Digitims expects initial production to be between 40,000 and 50,000 wafers per month. After "N3B", there will soon be an advanced variant called "N3E", which is expected to go into production in 2023.