ZESTRON attended CEIA Chongqing Seminar with packaging cleaning solutions

Publisher:EE小广播Latest update time:2022-02-17 Source: EEWORLDKeywords:ZESTRON Reading articles on mobile phones Scan QR code
Read articles on your mobile phone anytime, anywhere

ZESTRON, an expert in precision electronic cleaning for electronic manufacturing and semiconductor packaging, as well as a service provider of process solutions and consulting and training services, announced that it will attend the Chongqing Electronic Industry Intelligent Manufacturing Annual Conference and the 75th CEIA China Electronic Intelligent Manufacturing Summit Forum in Chongqing on February 24, 2022. ZESTRON will bring cutting-edge packaging cleaning solutions to industry customers in the western region and deliver relevant keynote speeches.


At this conference, ZESTRON will showcase ATRON ® AP 125A, a water-based cleaning agent specially developed for the removal of flux in the packaging industry. ATRON ® AP 125A can remove water-soluble flux from various packaging products, such as flip chips, including 2.5D/3D TSV stacking, BGA and SiP, etc. At the same time, ATRON ® AP 125A has a high level of material compatibility with sensitive metals and is particularly suitable for cleaning products with low bottom clearance and narrow ball pitch.


ZESTRON provides advanced precision cleaning solutions, cleaning process optimization, reliability and surface technology training, coaching and failure analysis services for SIP packaging. ZESTRON has 8 technical centers around the world and more than 70 world-renowned cleaning equipment and analysis equipment. It has successful experience in cleaning process solutions and reliability and surface analysis in high-end industries such as automobiles, communications, medical, aviation, photovoltaics, etc. ZESTRON sincerely invites you to participate in this forum and looks forward to discussing cleaning technology solutions with you face to face to promote the reliability of electronic products one step forward!


Meeting Information:


Time: 8:00 - 17:00, February 24, 2022

Location: No. 22, Nanbin Road, Nan'an District, Chongqing (Sanxia Ballroom, Radisson Blu Hotel, Chongqing)

Registration method: Scan the QR code below via WeChat to register for free

Inquiry contact: Ms. Wang of Marketing Department Luna.wang@zestronchina.com







Word count : 500

Image Copyright – ZESTRON

Contact


Luna Wang

ZESTRON China

Tel: +86 5296 8185 ext.810

Fax: +86 5296 8186

Email: Luna.Wang@zestronChina.com


Keywords:ZESTRON Reference address:ZESTRON attended CEIA Chongqing Seminar with packaging cleaning solutions

Previous article:85 new wafer fabs will be built around the world. Will the semiconductor testing market enter a golden period?
Next article:Samsung focuses on advanced packaging and testing, and plans to expand production of mature processes

Latest Semiconductor design/manufacturing Articles
Change More Related Popular Components

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

About Us Customer Service Contact Information Datasheet Sitemap LatestNews


Room 1530, 15th Floor, Building B, No.18 Zhongguancun Street, Haidian District, Beijing, Postal Code: 100190 China Telephone: 008610 8235 0740

Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号