101A484S7C datasheet, PDF - EEWORLD Datasheet

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101A484S7C: DescriptionSB-28, Tube; Categorystorage storage; File Size599KB，9 Pages; ManufacturerIDT (Integrated Device Technology)

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101A484S7C Overview

SB-28, Tube

101A484S7C Parametric

Parameter Name	Attribute value
Brand Name	Integrated Device Technology
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	IDT (Integrated Device Technology)
Parts packaging code	SB
package instruction	DIP, DIP28,.4
Contacts	28
Manufacturer packaging code	SF28
Reach Compliance Code	_compli
ECCN code	EAR99
Maximum access time	7 ns
I/O type	SEPARATE
JESD-30 code	R-CDIP-T28
JESD-609 code	e0
memory density	16384 bi
Memory IC Type	STANDARD SRAM
memory width	4
Humidity sensitivity level	1
Negative supply voltage rating	-5.2 V
Number of functions	1
Number of terminals	28
word count	4096 words
character code	4000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	75 °C
Minimum operating temperature
organize	4KX4
Output characteristics	OPEN-EMITTER
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.4
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	-5.2 V
Certification status	Not Qualified
Maximum slew rate	0.19 mA
surface mount	NO
technology	BICMOS
Temperature level	COMMERCIAL EXTENDED
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED

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101A484S7C Related Products

	101A484S7C	10A484S5C	100A484S7C	10A484S7C	101A484S5C
Description	SB-28, Tube	SB-28, Tube	SB-28, Tube	SB-28, Tube	SB-28, Tube
Brand Name	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
Parts packaging code	SB	SB	SB	SB	SB
package instruction	DIP, DIP28,.4	DIP, DIP28,.4	DIP, DIP28,.4	DIP, DIP28,.4	DIP, DIP28,.4
Contacts	28	28	28	28	28
Manufacturer packaging code	SF28	SF28	SF28	SF28	SF28
Reach Compliance Code	_compli	not_compliant	not_compliant	not_compliant	_compli
Maximum access time	7 ns	5 ns	7 ns	7 ns	5 ns
I/O type	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE
JESD-30 code	R-CDIP-T28	R-CDIP-T28	R-CDIP-T28	R-CDIP-T28	R-CDIP-T28
JESD-609 code	e0	e0	e0	e0	e0
memory density	16384 bi	16384 bit	16384 bit	16384 bit	16384 bi
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	4	4	4	4	4
Humidity sensitivity level	1	1	1	1	1
Negative supply voltage rating	-5.2 V	-5.2 V	-4.5 V	-5.2 V	-5.2 V
Number of functions	1	1	1	1	1
Number of terminals	28	28	28	28	28
word count	4096 words	4096 words	4096 words	4096 words	4096 words
character code	4000	4000	4000	4000	4000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	75 °C	75 °C	85 °C	75 °C	75 °C
organize	4KX4	4KX4	4KX4	4KX4	4KX4
Output characteristics	OPEN-EMITTER	OPEN-EMITTER	OPEN-EMITTER	OPEN-EMITTER	OPEN-EMITTER
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP28,.4	DIP28,.4	DIP28,.4	DIP28,.4	DIP28,.4
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	260	260	260	260	260
power supply	-5.2 V	-5.2 V	-4.5 V	-5.2 V	-5.2 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum slew rate	0.19 mA	0.19 mA	0.17 mA	0.19 mA	0.19 mA
surface mount	NO	NO	NO	NO	NO
technology	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS
Temperature level	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	OTHER	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED

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