According to foreign media reports, a whistleblower said on social media on Monday local time that Apple will launch a Mac Pro equipped with an upgraded version of its self-developed M series chips in the fourth quarter of this year, and their plan to transition their Mac product line to self-developed chips will be completed by then.
The whistleblower also revealed that the M series chip equipped with Mac Pro will not be the M2, nor the M1 Max launched last year, but an upgraded version of the M1, with more cores than the M1 Max.
In addition to the Mac Pro, the whistleblower also said that Apple may launch an iMac equipped with a high-end chip with a larger screen size, but he did not disclose whether the chip will be the same as the Mac Pro or the high-end M series chip that has already been launched.
Apple's plan to develop its own Mac chips was announced at the Worldwide Developers Conference in June 2020. According to the plan announced at the time, they will develop their own chips based on the Arm architecture for use in the Mac product line, and transition to self-developed chips within two years, at which time Intel processors will no longer be used in Mac products.
In November 2020, five months after the announcement of its self-developed chip plan, Apple launched its first self-developed Mac chip M1, and in October last year launched the more powerful M1 Pro and M1 Max.
When Apple launched its first self-developed Mac chip M1 in November 2020, it also launched the MacBook Air, 13-inch MacBook Pro and Mac mini equipped with this self-developed chip. Last year, it also launched the 14-inch and 16-inch MacBook Pro equipped with M1 Pro and M1 Max.
Among the products currently on sale in Apple's Mac product line, only the Mac Pro and the 27-inch iMac still use Intel processors. If Apple launches a Mac Pro and a larger-screen iMac with self-developed chips this year as the whistleblower revealed, Apple's entire Mac product line will have switched to self-developed chips, and the two-year transition plan will be completed.
Previous article:TSMC's capital expenditure will reach US$44 billion in 2022, surpassing Samsung for the first time, according to reports
Next article:Qualcomm leads the innovation of IoT technology and reshapes the future of retail
- Popular Resources
- Popular amplifiers
- Vietnam's chip packaging and testing business is growing, and supply-side fragmentation is splitting the market
- The US asked TSMC to restrict the export of high-end chips, and the Ministry of Commerce responded
- ASML predicts that its revenue in 2030 will exceed 457 billion yuan! Gross profit margin 56-60%
- ASML provides update on market opportunities at 2024 Investor Day
- It is reported that memory manufacturers are considering using flux-free bonding for HBM4 to further reduce the gap between layers
- Intel China officially releases 2023-2024 Corporate Social Responsibility Report
- Mouser Electronics and Analog Devices Launch New E-Book
- AMD launches second-generation Versal Premium series: FPGA industry's first to support CXL 3.1 and PCIe Gen 6
- SEMI: Global silicon wafer shipment area increased by 6.8% year-on-year and 5.9% month-on-month in 2024Q3
- LED chemical incompatibility test to see which chemicals LEDs can be used with
- Application of ARM9 hardware coprocessor on WinCE embedded motherboard
- What are the key points for selecting rotor flowmeter?
- LM317 high power charger circuit
- A brief analysis of Embest's application and development of embedded medical devices
- Single-phase RC protection circuit
- stm32 PVD programmable voltage monitor
- Introduction and measurement of edge trigger and level trigger of 51 single chip microcomputer
- Improved design of Linux system software shell protection technology
- What to do if the ABB robot protection device stops
- Learn ARM development(22)
- Learn ARM development(21)
- Learn ARM development(20)
- Learn ARM development(19)
- Learn ARM development(14)
- Learn ARM development(15)
- Analysis of the application of several common contact parts in high-voltage connectors of new energy vehicles
- Wiring harness durability test and contact voltage drop test method
- From probes to power supplies, Tektronix is leading the way in comprehensive innovation in power electronics testing
- From probes to power supplies, Tektronix is leading the way in comprehensive innovation in power electronics testing
- BMS insulation detection circuit
- i.MX6ULL Embedded Linux Development 1-Preliminary Study on Uboot Transplantation
- 【Synopsys IP Resources】 Comprehensive IP Solutions to Help HPC Chip Development
- GPIO Features of TMS320C6748
- Panel Light PCB
- [Project source code] FPGA-based buzzer plays "Castle in the Sky" program
- Can I use LPS22HB without connecting SD0/SA0 to anything?
- App Client
- The most comprehensive answers to common questions about electric vehicle charging!
- This may be a solution to the error in connecting the STM32 VCP host computer to the serial port