TI's diverse product portfolio helps operational amplifier design!

Figure 1 provides an overview of the full device family, with similarities highlighted at the top. The three sub-families are interchangeable because they use the same supply voltage, input and output voltage ranges, and offset voltage. In addition, their similar low-resistance output impedance minimizes stability issues.

However, each sub-family offers unique performance advantages. For example, if you initially use the TLV9002 in a Single-Supply Low-Side, Unidirectional Current Sensing Solution with Output Swing to GND Circuitry for motor current sensing , but later determine that higher gain and faster slew rates are required to handle large motor current transients, you can easily switch to the higher bandwidth, pin-to-pin compatible TLV9052 without redesigning. This is possible because each sub-family has the same 16 package options covering all three channel configurations.

Figure 2 details the various package options. The Industry Standard column identifies whether the package is available from other suppliers as a second-source option. The Shutdown column highlights packages that have a shutdown feature. The shutdown feature helps reduce overall energy consumption.

Glucose monitors use test strips that interact with the patient's blood, creating a chemical reaction that generates a current signal with the help of a special sensor strip. This current signal is small and is usually converted to an amplified voltage signal in a transimpedance amplifier (TIA) stage . The current signal from the sensor strip is fed to the TIA with a configurable gain setting and then sampled by an analog-to-digital converter (ADC, usually inside a microcontroller).

These three amplifier subfamilies are available in the industry’s smallest single- and quad-channel packages. TI’s single-channel 0.8mm x 0.8mm ultra-small leadless (X2SON) package is 13% smaller than similar small-footprint devices , and its 2.0mm x 2.0mm ultra-small QFN (X2QFN) package is 7% smaller . These packages, along with the dual-channel 1.0mm x 1.5mm X2QFN package, provide multiple options to help you reduce PCB area. You can see the three packages on the right side of Figure 3.

Because manufacturing techniques may limit the use of ultra-small QFN packages due to smaller pitches, TI also offers a variety of small package options with different pitches . The application report "Designing and manufacturing with TI's X2SON package" provides layout and routing guidelines for these packages.

Some say too many choices can be overwhelming. But I think the more choices, the better, whether you’re deciding what barbecue to eat in Texas or a design engineer choosing an amplifier. The next time you start a design, choose from a family of op amps that offer three different performance levels ; one of 16 unique package options; and the industry’s smallest single and quad packages to save PCB area when you need it.