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Molex Launches Open Accelerator Infrastructure (OAI) Solution

Latest update time:2024-10-31
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With the revolutionary development of data centers, the market demand for responsive optimization equipment is becoming increasingly urgent, especially in the fields of high-performance computing (HPC) and artificial intelligence (AI). The pressure on data centers is increasing, and their infrastructure is pushed to the limit. There is an urgent need for powerful and adaptable solutions to improve the performance of various equipment and extend the service life of existing assets.

Challenges facing the Open Accelerator Infrastructure (OAI)


In this new situation, the accelerator module has become a key solution strategy. It has a variety of functions that can significantly improve device performance, surpass the capabilities of traditional CPUs, and improve the efficiency of target devices. In the process of designing the accelerator module, designers have taken into account the scalability and adaptability , so that it can be smoothly integrated into the existing system to meet the ever-changing needs of various technologies and applications.


However, accelerator modules in the PCIe CEM form factor are becoming a barrier to efficient data center expansion. The reasons include:


• The signal insertion loss from ASIC (application specific chip) to PCIe connector is large

• Complex inter-card wiring reduces system reliability and maintainability

• There are some limitations in supporting inter-ASIC topologies







Gusset plate solution


Faced with these challenges, the gusset connector has emerged as an efficient alternative solution. This interface method has won the favor of the Open Compute Project (OCP) and played a role in the OCP's Open Accelerator Infrastructure (OAI) program. It uses a high-density connector design to improve I/O

The performance of the link also ensures low signal transmission loss, thereby achieving high-speed interconnection.


To meet these challenges, OCP introduced the Open Accelerator Module (OAM), which provides ample space for the accelerator itself, local logic and power components, and supports a variety of cooling solutions, including air cooling and liquid cooling systems. In addition, the flexibility of this design is also reflected in the interconnection topology between modules, which can meet the needs of various devices.

Calculate demand.


By adopting the gusset plate connection module, customers can take advantage of enhanced modular design, scalability and compatibility, laying a solid foundation for smooth integration in various computing environments, thereby promoting innovation in cutting-edge fields such as high-performance computing.




Superior design features, specially designed for accelerator modules


Molex's Mirror Mezz high-speed connector reshapes the outlook for open accelerator modules by using innovative solutions optimized for OAI . Mirror Mezz uses a hermaphroditic mating interface to deploy accelerator modules, ensuring a stable and reliable connection. Its complete set of mating parts only requires one part number, which simplifies the procurement and assembly process, improves installation efficiency, and reduces the complexity of bill of materials (BOM) management.


The contacts feature a “stubble-free” design that provides excellent signal integrity for the high-speed demands of modern computing infrastructure.

Click on the video to watch the Mirror Mezz connector


The design highlight of Mirror Mezz is its high flexibility, which can achieve a variety of stacking heights such as 11 mm, 8 mm and 5 mm to adapt to different application scenarios. Its sturdy blind-mating guide and pin shield design effectively protect the connector, ensure the precise docking of contacts and prevent contact damage, thereby improving the durability and reliability of the product.


In addition, the Mirror Mezz connectors offer increased flexibility and integration by using flat ball grid array (BGA) surface mount technology (SMT) for termination. This widely used termination method is favored by contract manufacturers and original design manufacturers for its ease of use, which helps achieve efficient and cost-effective manufacturing.




Committed to building open infrastructure


As an active participant in the OCP (Open Infrastructure Project), Molex is an industry leader in designing and developing hardware that meets OCP requirements.


The inclusion of the Mirror Mezz connector in the OCP and Open Data Center Council (ODCC) specifications highlights the connector's relevance and adaptability to meet current and future computing needs. This award-winning connector, with its superior design and powerful features, opens a new chapter in the development of open accelerator infrastructure to effectively address the growing needs of data centers.

▲Mirror Mezz plate connector







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