Chip News丨Houmo Intelligence received hundreds of millions of yuan in strategic financing, supported by China Mobile's Industrial Chain Development Fund
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Issue 0716
❶ Houmo Intelligence received hundreds of millions of yuan in strategic financing, supported by China Mobile's Industrial Chain Development Fund
On July 15, Houmo Intelligence officially announced the completion of strategic financing of hundreds of millions of yuan, jointly invested by Beijing Zhongmobile Digital New Economy Industry Fund and Shanghai Zhongmobile Digital Transformation Industry Fund under China Mobile. At the same time, China Mobile Research Institute and Houmo Intelligence officially signed a strategic cooperation agreement to jointly promote the innovative research and development and mass production application of storage-computing integrated AI chips. Houmo Intelligence has officially become a large-scale edge model chip company that China Mobile system supports. It is reported that China Mobile Research Institute will use Houmo Intelligence's advantages in storage-computing integrated algorithm research and development and application market promotion, focusing on product demand analysis, end-side large model research, new product solution design and new scenario exploration, while promoting the formulation and promotion of software tool chain standards.
❷Xinwanda : Plans to establish Vietnam Liwei and invest 2 billion yuan to build a factory
Xinwanda (300207.SZ) announced on July 15 that the company established Vietnam Liwei Co., Ltd. through its subsidiary Hong Kong Xinwei, and invested in the construction of Vietnam Liwei consumer lithium battery factory project with its own funds, with a total investment of no more than 2 billion yuan. The project aims to improve the company's business layout, serve international customers, expand overseas business, and increase global market share.
❸TSMC plans to establish a small-scale pilot production line for FOPLP
According to the "Science and Technology Innovation Board Daily" on the 15th, industry sources pointed out that TSMC has officially established a team for FOPLP (fan-out panel-level packaging) and plans to establish a mini line (small-scale trial production line). FOPLP uses a large rectangular substrate to replace the traditional circular silicon interposer. The large package size can improve area utilization and reduce unit cost, making up for the current insufficient production capacity of CoWoS advanced packaging. (MoneyDJ)
❹ "Zhuji Power" completed RMB 100 million in Series A financing
36Kr learned that on July 15, the general robot company "Zhuji Power" announced the completion of its Series A strategic financing, led by Alibaba, China Merchants Venture Capital, and SAIC Group's Shangqi Capital, and followed by original shareholders Frees Capital, Oasis Capital, and Mingshi Capital. It is worth noting that this is also the first humanoid robot company invested by Alibaba. The funds raised in this round of financing will be mainly used for technology iteration to meet the commercial application of humanoid robots.