As competition in the smartphone market gradually shifts to the high-end, it becomes particularly important for mobile phone manufacturers to possess unique core competitiveness.
In this regard, manufacturers have basically chosen a similar breakthrough direction, that is, to conduct self-developed chip products. At present, well-known manufacturers in the market have basically brought their own chip products.
As relevant technologies gradually mature, more related product application revelations have now emerged.
A revelation from blogger @数码闲聊站 mentioned that "truly self-developed or highly self-developed technologies and chips will be deployed to multiple models in due course to evenly distribute the R&D costs. For example, Xiaomi's Pengpai P1 has been deployed to Redmi, and more models will use it later. Blue Factory's V1 ISP was adapted to multiple models when it was first released, and iterative products are on the way, and V1 will also be deployed to more product lines. Green Factory's second MariSilicon X phone is on the way, and Ouga series will also use it later."
According to the leak, in order to better spread the R&D costs, mobile phone manufacturers will gradually bring in self-developed chips after the first launch. In other words, non-high-end products of various brands may also be equipped with self-developed chips in the future.
Based on the existing information, although manufacturers have started research and development of chip products, for most brands, the first products they bring are not core processor products.
It is reported that at the launch event at the end of December 2021, Xiaomi 12 Pro was equipped with the self-developed charging chip Xiaomi Pengpai P1. Some time after this technology was officially introduced to everyone, the new Redmi K50 Pro is also equipped with the Pengpai P1 charging chip, which supports 120W fairy second charging with a built-in 5000mAh battery.
In other words, Xiaomi's Surge P1 charging chip has been transferred to the Redmi brand, and may be installed in more Xiaomi models in the future.
In addition, the recently released OPPO Find X5 series is also equipped with the MariaSilicon X self-developed chip based on TSMC's 6nm process. It is an imaging-specific NPU chip designed and developed independently by OPPO.
The latest news shows that OPPO will launch other products equipped with this chip in the future. In the future, multiple brand series under OPPO may also be equipped with this self-developed chip.
Previous article:i Moutai App software copyright registration approved
Next article:Huawei's real-person game interaction patent is released, which can improve the authenticity of the game
- Popular Resources
- Popular amplifiers
- iPhone SE 4 reportedly debuts with Apple's self-developed 5G baseband: coming in March next year
- iPhone 17 series revealed to be the first to use 3nm A19 series chips: no chance of TSMC's 2nm process
- The supply chain said that upstream components will be greatly reduced in price: Will domestic mobile phones take the initiative to reduce their prices after the current price increase?
- Apple to spend nearly $100 million to lift Indonesia's iPhone 16 sales ban
- Tata Motors acquires Pegatron's only iPhone factory in India, deepening cooperation with Apple
- Apple faces class action lawsuit from 40 million UK iCloud users, faces $27.6 billion in claims
- Apple and Samsung reportedly failed to develop ultra-thin high-density batteries, iPhone 17 Air and Galaxy S25 Slim phones became thicker
- Micron will appear at the 2024 CIIE, continue to deepen its presence in the Chinese market and lead sustainable development
- Qorvo: Innovative technologies lead the next generation of mobile industry
- Intel promotes AI with multi-dimensional efforts in technology, application, and ecology
- ChinaJoy Qualcomm Snapdragon Theme Pavilion takes you to experience the new changes in digital entertainment in the 5G era
- Infineon's latest generation IGBT technology platform enables precise control of speed and position
- Two test methods for LED lighting life
- Don't Let Lightning Induced Surges Scare You
- Application of brushless motor controller ML4425/4426
- Easy identification of LED power supply quality
- World's first integrated photovoltaic solar system completed in Israel
- Sliding window mean filter for avr microcontroller AD conversion
- What does call mean in the detailed explanation of ABB robot programming instructions?
- STMicroelectronics discloses its 2027-2028 financial model and path to achieve its 2030 goals
- 2024 China Automotive Charging and Battery Swapping Ecosystem Conference held in Taiyuan
- State-owned enterprises team up to invest in solid-state battery giant
- The evolution of electronic and electrical architecture is accelerating
- The first! National Automotive Chip Quality Inspection Center established
- BYD releases self-developed automotive chip using 4nm process, with a running score of up to 1.15 million
- GEODNET launches GEO-PULSE, a car GPS navigation device
- Should Chinese car companies develop their own high-computing chips?
- Infineon and Siemens combine embedded automotive software platform with microcontrollers to provide the necessary functions for next-generation SDVs
- Continental launches invisible biometric sensor display to monitor passengers' vital signs
- Is this dime-sized millimeter-wave sensor evaluation board worth trying?
- Questions about TPS65090 power management chip selection
- VK1621B/VK1622 is a perfect replacement for HT1621B/HT1622, and is compatible with all packaged chips, die, wafers, bonding COB chips, etc.
- Xintang M2354 Fault Injection Attack Protection
- Date in spring - go to the beach and relax
- Some experience accumulated when debugging a system using Keil C
- Power amplifier driving capacitive load case sharing
- Power supply zero and live wire detection
- RSL1 Bluetooth characteristic value reading and writing
- Sapphire on PCB---DFM about optical positioning points