On March 26, Xinwei Communication stated on the investor interaction platform that MIM parts are key parts of folding screen hinges. The company attaches importance to and is optimistic about the development of this business, and has already supplied MIM components for folding screen hinges to well-known domestic mobile phone manufacturers.
As for whether the company supplies products for Honor's latest mobile phone, Xinwei Communication responded that the above-mentioned enterprise is an important customer of the company, and the company maintains good cooperation with it and has provided it with pan-RF products such as antennas, wireless charging, EMIEMC, etc. It is inconvenient to comment on specific product information, and please forgive me. At present, all projects are progressing smoothly.
In the field of LCP business, Xinwei Communication said that the company actively promoted cooperation with customers according to project planning. "LCP is a new business that the company focuses on expanding. It has built a medium-sized LCP production line to provide LCP products for domestic and foreign customers." In terms of Android customers, the company's LCP products have long been mass-produced, and customers who have received orders include domestic and foreign mobile phone manufacturers. In terms of North American customers, the company follows the strategy of first entering the watch and then conquering other terminal applications such as mobile phones. At present, mobile phone LCP has also begun testing and communicating with North American customers, striving to enter North American customers' mobile phones and other applications as soon as possible.
Previous article:Vivo's first foldable screen flagship officially announced: a masterpiece that will be released on April 11
Next article:Galaxy Microelectronics: orderly resumption of work and production from March 25
- Popular Resources
- Popular amplifiers
- Apple faces class action lawsuit from 40 million UK iCloud users, faces $27.6 billion in claims
- Apple and Samsung reportedly failed to develop ultra-thin high-density batteries, iPhone 17 Air and Galaxy S25 Slim phones became thicker
- Micron will appear at the 2024 CIIE, continue to deepen its presence in the Chinese market and lead sustainable development
- Qorvo: Innovative technologies lead the next generation of mobile industry
- BOE exclusively supplies Nubia and Red Magic flagship new products with a new generation of under-screen display technology, leading the industry into the era of true full-screen
- OPPO and Hong Kong Polytechnic University renew cooperation to upgrade innovation research center and expand new boundaries of AI imaging
- Gurman: Vision Pro will upgrade the chip, Apple is also considering launching glasses connected to the iPhone
- OnePlus 13 officially released: the first flagship of the new decade is "Super Pro in every aspect"
- Goodix Technology helps iQOO 13 create a new flagship experience for e-sports performance
- LED chemical incompatibility test to see which chemicals LEDs can be used with
- Application of ARM9 hardware coprocessor on WinCE embedded motherboard
- What are the key points for selecting rotor flowmeter?
- LM317 high power charger circuit
- A brief analysis of Embest's application and development of embedded medical devices
- Single-phase RC protection circuit
- stm32 PVD programmable voltage monitor
- Introduction and measurement of edge trigger and level trigger of 51 single chip microcomputer
- Improved design of Linux system software shell protection technology
- What to do if the ABB robot protection device stops
- Microchip Accelerates Real-Time Edge AI Deployment with NVIDIA Holoscan Platform
- Microchip Accelerates Real-Time Edge AI Deployment with NVIDIA Holoscan Platform
- Melexis launches ultra-low power automotive contactless micro-power switch chip
- Melexis launches ultra-low power automotive contactless micro-power switch chip
- Molex leverages SAP solutions to drive smart supply chain collaboration
- Pickering Launches New Future-Proof PXIe Single-Slot Controller for High-Performance Test and Measurement Applications
- Apple faces class action lawsuit from 40 million UK iCloud users, faces $27.6 billion in claims
- Apple faces class action lawsuit from 40 million UK iCloud users, faces $27.6 billion in claims
- The US asked TSMC to restrict the export of high-end chips, and the Ministry of Commerce responded
- The US asked TSMC to restrict the export of high-end chips, and the Ministry of Commerce responded
- Doherty Amplifier
- Three points are destined?
- How to increase the current of RLC oscillation circuit
- EEWORLD University----[High Precision Laboratory] Motor Drive: Stepper Motor Driver
- 2812 TxPR register write failure caused by TxCON highest bit
- (Transfer) CC2640R2F BLE5.0 Bluetooth protocol stack Generic Attribute Profile (GATT)
- [GD32L233C-START Evaluation] Development Environment Construction
- Disadvantages of Traditional Differential Amplifiers and Solutions
- Can I ask how the air pressure sensor can achieve accurate height (altitude) measurement and ignore the influence of wind speed?
- The Differences and Relationships between POP3, SMTP and IMAP