According to Qichacha information, Huawei recently added a number of patent information, one of which is related to chip technology, named "Chips and their preparation methods, electronic devices", and the publication number is CN112309991A.
Image source: Qichacha
The patent abstract shows that the application provides a chip and its preparation method, and an electronic device, which relate to the field of chip technology and are used to solve the problem of cracks on bare chips, causing bare chips to fail.
The chip includes a functional area and a non-functional area located outside the functional area. The chip includes: a semiconductor substrate; multiple dielectric layers, which are arranged on the semiconductor substrate, and a portion of the dielectric layers are located in the non-functional area; at least one first reinforcement member, which is located in the non-functional area; the first reinforcement member is embedded in at least two dielectric layers, and the first reinforcement member is connected to the dielectric layer in which it is embedded.
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