Huawei has officially released the P40 series of mobile phones, including the Huawei P40 Pro+, which has also been officially launched recently. Blogger @长安数码君 also disassembled the Huawei P40 Pro+ as soon as possible, and the device's 50-megapixel rear 5-camera module was also exposed.
From the screenshots, the rear 5-camera module of Huawei P40 Pro+ occupies nearly a quarter of the entire phone's space. According to the blogger, the rear 5-camera module of Huawei P40 Pro+ is tightly arranged, has no ball motor, adopts a suspended wire structure design, and is made of memory alloy as a material. The advantage of such a design is that the zoom and anti-shake of the phone are guaranteed, and at the same time, the lens will not lose its restraint when it is not powered on, ensuring the stability of the lens.
IT Home learned that the rear 5-camera module of Huawei P40 Pro+ consists of a 50-megapixel super-sensing camera (wide-angle, f/1.9 aperture, OIS optical image stabilization) + a 40-megapixel movie camera (ultra-wide-angle, f/1.8 aperture) + an 8-megapixel super zoom camera (10x optical zoom, f/4.4 aperture, OIS optical image stabilization) + an 8-megapixel telephoto camera (3x optical zoom, f/2.4 aperture, OIS optical image stabilization) + a 3D depth-sensing camera. The front camera solution is a 32-megapixel + depth-of-field camera.
Previous article:The world's first 5G smart car is launched using Huawei's 5G module
Next article:Qualcomm announces the launch of the world's first 5G and AI-enabled robotics platform, RB5
Recommended ReadingLatest update time:2024-11-23 11:49
- Popular Resources
- Popular amplifiers
- Siemens Motion Control Technology and Engineering Applications (Tongxue, edited by Wu Xiaojun)
- Modern Product Design Guide
- Virtualization Technology Practice Guide - High-efficiency and low-cost solutions for small and medium-sized enterprises (Wang Chunhai)
- Printed Circuit Board Design Practical Tutorial Protel DXP 2004 SP4 (Edited by Liu Huiheng)
- iPhone SE 4 reportedly debuts with Apple's self-developed 5G baseband: coming in March next year
- iPhone 17 series revealed to be the first to use 3nm A19 series chips: no chance of TSMC's 2nm process
- The supply chain said that upstream components will be greatly reduced in price: Will domestic mobile phones take the initiative to reduce their prices after the current price increase?
- Apple to spend nearly $100 million to lift Indonesia's iPhone 16 sales ban
- Tata Motors acquires Pegatron's only iPhone factory in India, deepening cooperation with Apple
- Apple faces class action lawsuit from 40 million UK iCloud users, faces $27.6 billion in claims
- Apple and Samsung reportedly failed to develop ultra-thin high-density batteries, iPhone 17 Air and Galaxy S25 Slim phones became thicker
- Micron will appear at the 2024 CIIE, continue to deepen its presence in the Chinese market and lead sustainable development
- Qorvo: Innovative technologies lead the next generation of mobile industry
- Intel promotes AI with multi-dimensional efforts in technology, application, and ecology
- ChinaJoy Qualcomm Snapdragon Theme Pavilion takes you to experience the new changes in digital entertainment in the 5G era
- Infineon's latest generation IGBT technology platform enables precise control of speed and position
- Two test methods for LED lighting life
- Don't Let Lightning Induced Surges Scare You
- Application of brushless motor controller ML4425/4426
- Easy identification of LED power supply quality
- World's first integrated photovoltaic solar system completed in Israel
- Sliding window mean filter for avr microcontroller AD conversion
- What does call mean in the detailed explanation of ABB robot programming instructions?
- STMicroelectronics discloses its 2027-2028 financial model and path to achieve its 2030 goals
- 2024 China Automotive Charging and Battery Swapping Ecosystem Conference held in Taiyuan
- State-owned enterprises team up to invest in solid-state battery giant
- The evolution of electronic and electrical architecture is accelerating
- The first! National Automotive Chip Quality Inspection Center established
- BYD releases self-developed automotive chip using 4nm process, with a running score of up to 1.15 million
- GEODNET launches GEO-PULSE, a car GPS navigation device
- Should Chinese car companies develop their own high-computing chips?
- Infineon and Siemens combine embedded automotive software platform with microcontrollers to provide the necessary functions for next-generation SDVs
- Continental launches invisible biometric sensor display to monitor passengers' vital signs
- Comparative test of TLP3547 and PVG612 with constant load
- Download the free NI white paper "Overcoming the Challenges of Production Test for Complex Devices Under Test"
- 2.4G module NRF24L01 debugging experience
- Design of a new self-reporting hydrological telemetry terminal based on MSP430 (Figure)
- Detailed explanation of Linux power management
- Could you please recommend a mature domestic high-power step-down DCDC?
- Design of analog signal source for remote sensing images with wide spectrum coverage
- Does anyone have any good methods to measure image encoding and decoding delay? Please share!
- Small solution based on TPS62300 high-frequency step-down converter enables dynamic voltage management
- DSP Basics--Fixed-point Decimal Operations