CES2020 is in full swing, and Goertek has brought us new products in optics, MEMS sensors, SiP packaging, etc., which are used in VR/AR display, smart wearables, TWS headphones and other fields. Goertek is a global technology innovation company, mainly engaged in the research and development, manufacturing and sales of precision acoustic and optical components and precision structural parts, smart machines and high-end equipment.
Goertek has positioned itself in four major fields: acoustics, optics, precision components and precision structures. It has established stable cooperation with many well-known manufacturers in the field of consumer electronics.
At this CES, Goertek demonstrated advanced miniaturized VR/AR head-mounted display optical solutions and complete products in the VR/AR field, including the VR Pancake folded optical path lens module that it independently developed and has been mass-produced and delivered. It is understood that products using the Pancake folded optical path can reduce the total optical length (TTL) to only 1/3 of the traditional solution, which means that it can reduce the thickness of a single piece of glass and reduce the thickness and weight of the VR head-mounted display.
In addition, Goertek has jointly developed a number of AR glasses reference designs with WaveOptics, a global leading design solution provider in the diffractive waveguide field, which use diffractive optical waveguide solutions and have field of view angles of 28°, 40° and 55°. It also announced that its diffractive waveguide nanoimprint production line now has mass production capabilities.
In the wearable field, Goertek has independently developed a reference design for smart watches with ECG electrocardiogram detection, which is expected to obtain NMPA Class II certification from the China National Medical Products Administration within the year, rapidly promoting the popularization of ECG functions in smart watches while improving the accuracy of ECG detection.
Goertek also brought a variety of miniaturized, highly integrated, high-performance SiP (system-level packaging) products that can meet the miniaturization and functional integration requirements of intelligent hardware systems, including Component Sip and System Sip. Of course, there are also new high-performance and high-precision MEMS sensor series products, including blood pressure sensors, pressure sensors, airflow sensors, etc. It is worth mentioning that the detection accuracy of the pressure sensor can reach the millimeter level in water and the centimeter level in air.
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