MEMS and microsystems

This course comprehensively introduces the basic theory, analysis and design methods, manufacturing technology, typical products and devices of MEMS, and attempts to master miniaturization technology through this course. Course content includes basic mechanics and physics, micromachining technology, packaging integration technology, sensors, actuators, RF MEMS, optical MEMS and BioMEMS and microfluidics.
The course emphasizes the combination of design and manufacturing, the combination of cutting-edge and basic; it focuses on extracting basic, key and common knowledge, emphasizes the application of basic theories and manufacturing methods in different fields, and closely integrates cutting-edge academic research and product development trends in the industry.

• Chapter 1：Definition of MEMS (11 minutes and 33 seconds)

• Chapter 2：Application fields of MEMS (14 minutes and 30 seconds)

• Chapter 3：Development of MEMS (16 minutes and 30 seconds)

• Chapter 4：Development of MEMS (continued) (15 minutes and 13 seconds)

• Chapter 5：stress and strain (14 minutes and 29 seconds)

• Chapter 6：elastic beam (14 minutes and 11 seconds)

• Chapter 7：Elastic Beams (continued) (14 minutes and 49 seconds)

• Chapter 8：Basic concepts of sheets and fluids (12 minutes and 21 seconds)

• Chapter 9：Basic concepts of fluids (continued) (7 minutes and 47 seconds)

• Chapter 10：electrostatic force (13 minutes and 12 seconds)

• Chapter 11：size effect (4 minutes and 23 seconds)

• Chapter 12：MEMS lithography technology (14 minutes and 40 seconds)

• Chapter 13：Volume micromachining technology—isotropic wet etching (6 minutes and 55 seconds)

• Chapter 14：Volume micromachining technology—anisotropic wet etching (15 minutes and 36 seconds)

• Chapter 15：Volume micromachining technology—anisotropic wet etching (continued) (13 minutes and 46 seconds)

• Chapter 16：Volume micromachining technology—dry etching (12 minutes and 3 seconds)

• Chapter 17：Volumetric micromachining technology—time-division multiplexing deep etching (14 minutes and 15 seconds)

• Chapter 18：Volume micromachining technology—steady-state deep etching (6 minutes and 44 seconds)

• Chapter 19：Volume micromachining technology—dry etching equipment and applications (10 minutes and 4 seconds)

• Chapter 20：Overview of surface micromachining technology (10 minutes and 0 seconds)

• Chapter 21：Several issues in surface micromachining technology (13 minutes and 37 seconds)

• Chapter 22：Surface micromachining OEM process (5 minutes and 8 seconds)

• Chapter 23：Applications of surface micromachining (7 minutes and 8 seconds)

• Chapter 24：Thick structural layer technology (8 minutes and 40 seconds)

• Chapter 25：Bonding Overview vs. Direct Bonding (11 minutes and 59 seconds)

• Chapter 26：Anodic Bonding vs. Polymer Bonding (10 minutes and 22 seconds)

• Chapter 27：Metal bonding and bonding equipment (11 minutes and 58 seconds)

• Chapter 28：process integration (10 minutes and 22 seconds)

• Chapter 29：system integration (3 minutes and 38 seconds)

• Chapter 30：Single chip integration and multi-chip integration (13 minutes and 41 seconds)

• Chapter 31：3D integration (5 minutes and 40 seconds)

• Chapter 32：MEMS packaging (7 minutes and 45 seconds)

• Chapter 33：MEMS packaging (continued) (9 minutes and 30 seconds)

• Chapter 34：Overview (14 minutes and 28 seconds)

• Chapter 35：Piezoresistive sensor (11 minutes and 16 seconds)

• Chapter 36：Capacitive Sensors vs. Piezoelectric Sensors (6 minutes and 41 seconds)

• Chapter 37：Resonance Sensors and Tunneling Sensors (6 minutes and 27 seconds)

• Chapter 38：Pressure Sensor (7 minutes and 39 seconds)

• Chapter 39：Piezoresistive pressure sensor (11 minutes and 7 seconds)

• Chapter 40：Piezoresistive Pressure Sensors (continued) (8 minutes and 14 seconds)

• Chapter 41：Capacitive pressure sensor and resonant pressure sensor (7 minutes and 36 seconds)

• Chapter 42：Silicon Microphone (9 minutes and 43 seconds)

• Chapter 43：Overview of Inertial Sensors and Acceleration Sensors (12 minutes and 57 seconds)

• Chapter 44：Piezoresistive and capacitive acceleration sensors (8 minutes and 59 seconds)

• Chapter 45：Capacitive and thermal conductivity acceleration sensors (7 minutes and 38 seconds)

• Chapter 46：Overview of micromechanical gyroscope (9 minutes and 45 seconds)

• Chapter 47：Typical micromechanical gyroscope (11 minutes and 39 seconds)

• Chapter 48：Typical micromechanical gyroscope (continued) (8 minutes and 57 seconds)

• Chapter 49：Modal decoupling (6 minutes and 58 seconds)

• Chapter 50：Actuator overview (4 minutes and 35 seconds)

• Chapter 51：Electrostatic actuator - flat capacitive actuator (9 minutes and 40 seconds)

• Chapter 52：Electrostatic Actuator—Plate Capacitive Actuator (continued) (10 minutes and 30 seconds)

• Chapter 53：Electrostatic actuator - interdigital capacitive actuator (11 minutes and 51 seconds)

• Chapter 54：thermal actuator (13 minutes and 39 seconds)

• Chapter 55：Piezoelectric and magnetic actuators (5 minutes and 30 seconds)

• Chapter 56：RF MEMS Overview (10 minutes and 7 seconds)

• Chapter 57：MEMS switch I (9 minutes and 58 seconds)

• Chapter 58：MEMS switch II (1 minutes and 50 seconds)

• Chapter 59：MEMS switch III (9 minutes and 12 seconds)

• Chapter 60：MEMS resonator—comb resonator (15 minutes and 9 seconds)

• Chapter 61：MEMS resonator—plate resonator (8 minutes and 14 seconds)

• Chapter 62：Manufacturing of MEMS resonators (12 minutes and 44 seconds)

• Chapter 63：Optical MEMS Overview (10 minutes and 17 seconds)

• Chapter 64：MEMS optical switch I (12 minutes and 37 seconds)

• Chapter 65：MEMS optical switch II (7 minutes and 25 seconds)

• Chapter 66：Image Reproduction I—Reflective Devices (14 minutes and 47 seconds)

• Chapter 67：Image Reproduction II—Diffractive Devices (10 minutes and 39 seconds)

• Chapter 68：Image Reproduction III—Interference Device (5 minutes and 35 seconds)

• Chapter 69：Overview (5 minutes and 35 seconds)

• Chapter 70：Soft lithography (8 minutes and 20 seconds)

• Chapter 71：microfluidic transport (10 minutes and 44 seconds)

• Chapter 72：Microfluidic Transport (continued) (7 minutes and 42 seconds)

• Chapter 73：Sample handling (9 minutes and 15 seconds)

• Chapter 74：Specimen handling (continued) (12 minutes and 9 seconds)

• Chapter 75：Detection Technology (11 minutes and 59 seconds)

• Chapter 76：Microfluidic applications (11 minutes and 36 seconds)

• Chapter 77：Microfluidic Applications (continued) (13 minutes and 34 seconds)

• Chapter 78：Overview (10 minutes and 49 seconds)

• Chapter 79：Drug Release Neural Probe Biosensor (13 minutes and 9 seconds)

• Chapter 80：Wearable and Implantable Microsystems (6 minutes and 6 seconds)