IPC report details PCB manufacturer technology trends

　　IPC - Association Connecting Electronics Industries® released a global research report this month: " PCB Technology Trends 2016  ". The report uses data research to focus on how PCB manufacturers can meet the current technology development requirements and the technology changes that will affect the industry by 2021. Let's follow the mobile phone portable editor to learn about the relevant content.

　　This report collects data from 118 electronic assembly companies and PCB manufacturers around the world, classified by the following five major application areas: automotive, defense and aerospace, high-end systems, industrial, and medical electronics; the full text is 237 pages.

　　The report covers board performance, such as thickness, number of layers, heat dissipation and tolerance; miniaturization, such as line width and spacing, I/O pitch, through-hole aperture, aspect ratio, through-hole structure, etc.; materials, such as rigidity, flexibility, ductility, metal core, reinforcement, thermal performance, loss characteristics, lead-free, halogen-free, surface treatment; special structures, such as embedding, optical channel, chip packaging. At the same time, this study also investigated the use of printed electronics, including 3D printing, PCB manufacturers in traceability, compliance, technical adjustments, etc.

　　The study found that more than half of data providers use press-fit technology to produce or assemble through-hole boards to achieve tolerance requirements. One-third of standard through-hole board manufacturers predict tolerance requirements before 2021. In addition, the study found that most companies today use subtractive production processes to achieve extremely fine line width and spacing requirements, but will gradually switch to additive or semi-additive and graphic printing production processes in the next four years. The study also found that only 1% of data providers use stretchable materials now, but by 2021, its users are expected to exceed 20%. The companies participating in the survey also predicted that the proportion of chip packages or modules in PCB manufacturing will continue to rise in the next few years.

　　"PCB Technology Trends 2016" is now on sale, member price: US$675, non-member price: US$1,350.

    The above is an introduction to the IPC report detailing the technology development trends of PCB manufacturers in portable mobile phones. If you want to know more relevant information, please pay more attention to eeworld. eeworld Electronic Engineering will provide you with more complete, detailed and updated information.