[Veco Cup] Yinniu Microelectronics participated in the "Veco Cup OFweek 2023 China Robotics Industry Annual Technology Breakthrough Award"

OFweek Cup · OFweek 2023 China Robot Industry Annual Selection (abbreviated as OFweek Robot Awards 2023) is jointly organized by OFweek, China's high-tech industry portal, and its authoritative robot professional media - OFweek Robot. This selection is a major brand event in China's robot industry and one of the most professional and influential selections in the high-tech industry.

The event aims to build a brand communication and display platform for products, technologies and companies in the robotics industry, and leverage the resources and influence of the OFweek platform to promote innovative products and solutions to industry users and the market, encouraging more companies to invest in technological innovation; at the same time, it will deliver more innovative products and cutting-edge technologies to the industry, and together imagine the future of the robotics industry.

The OFweek Robot Awards 2023, the annual selection of China's robot industry, will enter the online voting stage from February 20 to March 20, 2024, and the award ceremony will be held in Shenzhen on April 18. At present, the event is in the hot stage of enterprise application, and enterprises in the industry have responded positively.

Yinniu Microelectronics participated in the "Veco Cup OFweek 2023 China Robotics Industry Annual Technology Breakthrough Award"

Award: Veken Cup OFweek 2023 China Robotics Industry Annual Technology Breakthrough Award

Participating companies: Hefei Yinniu Microelectronics Co., Ltd.

Product Introduction:

Yinniu's 3D spatial intelligent computing single-chip solution is mainly used in its self-developed chips and visual modules. This series of chips is currently the only SoC chip in the world that integrates 3D real-time perception, SLAM, and AI on a single chip. It has turned 3D algorithms into chips and can achieve 3D real-time perception, SLAM, and AI functions that traditional technologies require a lot of computing power (software) to achieve through single-chip hardware with a power consumption of about 1w.

Technological innovation:

Yinniu's 3D spatial intelligent computing single chip solution can effectively solve two major pain points in market applications:

Pain point 1: The traditional solution of software-based 3D algorithm + AI chip/FPGA has many limitations. Currently, the processing methods of image information in the market are generally divided into two categories: one is the underlying algorithm, which uses a large number of algorithm processing tool libraries to develop specific applications; the other is software processing after secondary development, which is developed for some specific functions. Both methods require the use of a large number of algorithms for calculation, so the delay and power consumption are large, and when facing applications in complex scenarios, software development is also difficult;

Pain point 2: 3D sensing devices suitable for complex scenarios are expensive, and multi -sensor fusion greatly increases system cost and complexity, which limits the product development process.

Yinniu's 3D spatial intelligent computing single-chip solution can effectively solve the above pain points through hardware upgrades. In terms of 3D real-time perception, the common practice in the industry is to consume computing power on the Host side to perform alignment calculations, which increases the system computing power burden to a certain extent. Yinniu's technology can run point cloud alignment, depth and RGB alignment on the chip's built-in hardware engine, thereby reducing system power consumption, cost and computing power. In terms of SLAM, compared with the industry's common method of running software algorithms directly on the system processor, Yinniu has realized SLAM chipization and divided the SLAM process into different chip modules for operation, thereby saving the computing power of the system's main control chip. In terms of AI, Yinniu's technology is also more stable and easy to use. Yinniu chips have achieved more convenient algorithm interfaces and higher computing power. Through the fully programmable AI CNN engine built into the chip, it can currently provide up to 3.5TOPS of computing power. It not only provides a complete artificial intelligence/deep learning solution and algorithm library, but also provides customized artificial intelligence algorithm API interfaces to meet customers' flexible needs, which can effectively save system computing power and reduce system power consumption, delay time and cost.

Market Application:

Due to the high integration of Yinniu chips, it has advantages in power consumption and cost, and Yinniu's technology has continuity, which can ensure low technology migration costs and continuous iterations. The Yinniu module using the 3D spatial intelligent computing single-chip solution can completely replace the products of a certain international first-tier manufacturer, and can provide better operational delivery and reduce customers' own development costs. For example, the R132 binocular stereo vision module is benchmarked against the products of a certain international first-tier manufacturer, which has provided customers with more choices. At present, the core needs of customers are detection and obstacle avoidance related functions. The next step will be the demand for VSLAM applications. The advantage of Yinniu is that it is the only single chip in the world that integrates the three functions of 3D real-time perception + SLAM + AI, which are all what customers need for development.

In the application of robots, a leading domestic ARM robot customer expects to use a solution with a higher degree of integration than traditional solutions. In addition to providing a complete solution, Yinniu also provides wide-angle binocular stereo vision function, and integrates the SLAM core technology to extract feature points on the chip, effectively solving the key bottleneck problem. In addition, customers' warehousing, industrial manufacturing and consumer businesses will also use Yinniu's products, such as warehouse robots for QR code detection and obstacle avoidance, unmanned forklifts in the manufacturing industry for obstacle avoidance and pallet detection, and service robots' VSLAM and landmark detection and following all have 3D vision requirements.

Company Introduction:

Yinniu Microelectronics is a high-tech enterprise focusing on visual processing and multi-sensor fusion + artificial intelligence chip and product design. Its self-developed series of chips are the world's only single-chip integrated 3D visual perception, AI artificial intelligence , SLAM real-time positioning and mapping system-level chips. The company's global headquarters is located in Hefei, and it has subsidiaries and branches in Shanghai, Israel, Beijing and Shenzhen. It is committed to becoming a leader and ecosystem builder in the 3D spatial computing era.

Reasons for participation:

The world's only Yinniu 3D spatial intelligent computing single-chip solution can effectively solve the limitations of traditional software-based 3D algorithms + AI chips/FPGA solutions, as well as the multi-sensor fusion of 3D perception devices in complex scenes, which greatly increases system costs and complexity, resulting in high product development costs, high power consumption and high complexity. It provides customers with system solutions through underlying technologies and achieves cost reduction and efficiency improvement.

Voting time:

The voting for this year's "OFweek Robot Awards 2023" event will begin on February 20. Please pay attention to the robot-related selection news on Veken.com and you are welcome to vote.