Apple's new edge AI SoC uses Ceva sensor hub DSP

Ceva-SensPro2 DSP in S300 edge computing chip supports audio/video/sensor fusion processing for wearable devices, cameras, smart healthcare and other fields

Ceva, a global licensor of semiconductor products and software IP that enable intelligent edge devices to more reliably and efficiently connect, sense and infer data, has licensed the Ceva-SensPro2 sensor hub DSP for deployment in its S300 edge AI system-on-chip (SoC) for wearables, cameras, smart healthcare and more. The Ceva-SensPro2 DSP serves as the sensor hub of the SoC and works with the in-memory neural network processing unit (NPU) to process sensor data in real time.

Apple Core Technology's S300 SoC is an efficient edge AI chip designed around the concept of in-memory computing. The architecture integrates memory and processing functions, allowing data processing directly in memory, significantly reducing energy consumption. With an energy efficiency of up to 27 TOPS/W, this SoC can save up to 90% energy when performing specific tasks, making it ideal for power-sensitive applications such as smart wearable devices, AI-driven devices, and real-time control systems. The integrated Ceva-SensPro2 DSP supports multimodal sensing and decision-making, and can efficiently process audio and video inputs for tasks such as speech recognition, motion tracking, and visual recognition.

Dr. Yang Yue, CEO of Apple Core, said: "Our Apple Core S300 SoC leverages the power of in-memory AI computing and Ceva sensor hub DSP to deliver unprecedented energy efficiency and performance for on-device AI-driven tasks. These technologies complement each other, allowing us to create edge AI solutions that can achieve real-time multimodal perception and intelligent decision-making with ultra-low power consumption, reshaping the landscape of smart devices and AI applications."

“Edge AI is ushering in a new era of smart, connected devices, changing the way everyday tasks are handled. The silicon chips that power these devices are increasingly complex and require exceptional performance to deliver on the promise of AI inference processing,” said Ran Snir, vice president and general manager of Ceva’s Vision Business Unit. “Apple Semiconductor’s S300 Edge AI SoC, powered by our SensPro2 DSP and in-memory AI compute, delivers a compelling balance between power efficiency and exceptional performance for a wide range of perception-related applications, and we look forward to seeing the S300 cutting-edge SoC powering a new generation of intelligent edge devices.”