Vishay Automotive and Electric Vehicle Solutions Debut at 2024 Munich Shanghai Electronics Show

MALVERN, Pennsylvania, USA and Shanghai, China — July 8, 2024 — Vishay Intertechnology, Inc. recently announced that it will showcase a wide range of passive and discrete semiconductor solutions at electronica China 2024. These products and solutions are suitable for the latest automotive and electric vehicle designs and meet the design needs of providing accuracy and reliability under harsh operating conditions.

Mr. Gu Zhiming, Senior Vice President of Vishay Asia Sales and Marketing, said: "Electrification, intelligence and networking are the future direction of transportation. The electric vehicle revolution not only drives the automotive industry, but also promotes the growth of demand for advanced electronic devices in new energy, industry, communications and computing. Vishay will respond to this new demand with an excellent product portfolio, large-scale production capacity and excellent customer experience."

Vishay will showcase its unique products and solutions and their application advantages in design at booth 3600 in Hall E3. Vishay's main products include:

• The newly released 1200 V MaxSiC™ series of silicon carbide (SiC) MOSFETs are packaged in standard industrial applications and have three optional on-resistances of 45 mΩ, 80 mΩ and 250 mΩ, while customized products are also available. In addition, Vishay will provide a 650 V to 1700 V SiC MOSFET roadmap with an on-resistance range of 10 mΩ to 1 Ω, including planned AEC-Q101 standard automotive-grade products. Vishay's SiC platform is based on proprietary MOSFET technology - the company recently acquired MaxPower Semiconductor, Inc. - which will be used in the near future to meet the needs of a variety of automotive and industrial application markets, including DC/DC converters, energy storage systems, charging piles, on-board chargers and traction inverters

  
  

• A variety of reference designs for different voltage system applications, including a high-voltage smart battery current senser (HV-IBSS) reference design based on the WSBE8518 low temperature coefficient (TCR) Power Metal Strip® sense resistor; 400V/800V passive and active discharge; 400V, 11kW on-board charger; light electric vehicle 48V, 3.6kW on-board charger; 48V/12V bidirectional DC/DC converter; light electric vehicle 48V, 10kW traction inverter; resettable solid-state eFuse for 48V systems.

  
  

• Smart cockpit component solutions. These include the VCNL3030X01 fully integrated proximity sensor with a pressure button solution that can sense deformation with a resolution of up to 20 um; the VEML6031X00 high-precision ambient light sensor, which uses Filtron™ technology and has a spectral response close to that of the human eye; the VETH100A bidirectional single-channel ESD protection diode that complies with the OPEN Alliance 100Base-T1 and 1000Base-T1 specifications; and the IHPTA series vibration feedback device with strong vibration intensity and fast response capability.

  
  

• Power MOSFETs in the PowerPAK® 8x8LR package, which can be used to achieve energy-efficient designs while reducing overall PCB temperature, and integrated half-bridge MOSFETs in the PowerPAIR® 6x5FSW package, which can help reduce component count and increase power density

  
  

• Standard, Schottky, fast recovery (FRED Pt® ) diodes and rectifiers, transient suppression diodes (TVS), in compact DFN packages, increasing power density and improving thermal resistance. Also available are 7th generation ultra-fast recovery diodes (FRED Pt® Hyperfast), with fast recovery times down to 75 ns and typical forward voltage drops down to 1.10 V

  
  

• Capacitor solutions, including ceramic safety capacitors up to 10nF; ENYCAP™ double-layer energy storage capacitors; DC-Link metallized polypropylene film capacitors with operating temperatures up to +125°C

  
  

• A wide range of resistor solutions including temperature sensing and high voltage resistors; discharge resistors; battery shunts; PTC thermistors with energy absorption capability up to 300 J; NTC thermistors with high temperature operation up to +150°C; high precision thick film voltage dividers; high stability high voltage thin film chip resistors; non-inductive thick film power resistors; NTC thermistor die for wire bonding; very low resistance Power Metal Strip resistors

  
  

• IHLE® series high current inductors with integrated electric field shield, and IHSR series devices with very low DC resistance (DCR) and very low inductance

The 2024 Munich Shanghai Electronics Show will be held at the Shanghai New International Expo Center from July 8th to 10th.