Nidec Precision Testing Technology will participate in SEMICON TAIWAN 2024

Publisher:EE小广播Latest update time:2024-09-02 Source: EEWORLDKeywords:Nidec Reading articles on mobile phones Scan QR code
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Nidec Precision Testing Technology Co., Ltd. (hereinafter referred to as "the Company") will participate in "SEMICON TAIWAN 2024" held at the Taipei Nangang Convention and Exhibition Center from September 4 (Wednesday) to September 6 (Friday) , 2024. The exhibition is one of the largest international exhibitions in Asia that showcases cutting-edge technologies and innovative achievements in the semiconductor industry.


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The exhibition is a very influential semiconductor industry exhibition in Taiwan. This year's theme is "BREAKING LIMITS: POWERING THE AI ERA." It is expected that more than 1,100 companies will participate.


The market demand for AI semiconductor-related products is expected to grow significantly in the future, and their miniaturization and installation complexity are also increasing, so new inspection technologies are needed to cope with this trend.


Nidec Precision Inspection Technology will introduce its proud optical inspection technology, electrical inspection technology, and detection technology under the theme of "TEST SYSTEM ONE STOP SOLUTIONS", and provide excellent inspection solutions for all processes of cutting-edge semiconductor packaging, including wafers, chips, substrates, and packaging. In addition, it will introduce cutting-edge technologies and products for power semiconductors, which have recently attracted much attention in the industry.


〈Exhibition Overview〉


・Period: September 4 (Wednesday) to September 6 (Friday), 2024

・Venue: Taipei Nangang Exhibition Center (TaiNEX 2)

・Booth: Hall 2 Q5652


〈Exhibition Content〉


・High-precision optical wafer inspection equipment "NSW series"

・Optical 2D/3D inspection equipment for wafer bumps "RWi series"

・"Space Transformer MLO" that supports up to 60 layers

・2D MEMS probe card with high precision and reduced noise effects

・TC probe that supports −40℃ to 200℃ measurement

・MEMS FLEX probe card that supports the minimum bump pitch of 60㎛ for cutting-edge semiconductor devices

・"Chamber Head" probe card that supports high voltage and high temperature environments

・xEV modeling simulator "E-Transport Simulator"


In the future, Nidec Precision Testing Technology will continue to accelerate the independent manufacturing of various products that use testing device technology, improve electricity efficiency by achieving overall system optimization including motor energy saving, and provide customers with innovative solutions that are beneficial to reducing the load on the earth's environment.


Keywords:Nidec Reference address:Nidec Precision Testing Technology will participate in SEMICON TAIWAN 2024

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