Using sugar and corn syrup, researcher Gary Zabo transferred the word "NIST" in gold letters onto human hair. Image source: National Institute of Standards and Technology
Can regular table sugar transfer microchip patterns to new and unconventional surfaces? In the latest issue of the journal Science, scientists at the National Institute of Standards and Technology (NIST) report a method of using sugar to transfer onto almost any common surface. Opening up new materials and microstructures offers new possibilities.
Semiconductor chips, micropatterned surfaces and electronics all rely on microprinting, a process in which precise but tiny patterns between a millionth and a billionth of a meter wide are placed on surfaces to give them new properties. process. Traditionally, these tiny patterns of metals and other materials are printed on flat silicon wafers. But as the possibilities for semiconductor chips and smart materials expand, these complex, tiny patterns will need to be printed on new, non-traditional, non-planar surfaces. Printing patterns directly on these surfaces is tricky, so the scientists transferred the prints, but precise transfer to more common surfaces of arbitrary curvature remains elusive.
Researchers found that a simple combination of caramel and corn syrup can do just that. When dissolved in a small amount of water, this sugar mixture can be poured onto a flat surface in miniature patterns. Once the water evaporates, the candy hardens and can be lifted with the pattern embedded in it. The patterned candy is then placed on the new surface and melted. The combination of sugar and corn syrup maintains a high viscosity as it melts, allowing the pattern to maintain its alignment as it flows over curves and edges. The sugar is then washed away with water, leaving only the pattern.
Using this technology, called Reflow Driven Flexible Transfer (REFLEX), microcircuit patterns can be transferred like a template, allowing scientists or manufacturers to etch and fill the materials they need in the right places. Patterned materials can be transferred from the original chip onto fibers or microbeads for potential biomedical or microrobotic research, or onto sharp or curved surfaces in new devices.
Using REFLEX, researchers were able to imprint the word "NIST" in tiny gold letters on the tips of pins and on strands of human hair. In another example, 1-micron-diameter disks were successfully transferred onto the fuzz fibers of milkweed seeds. In the presence of a magnet, the magnetically printed fibers reacted, indicating that the transfer had been successful.
Use syrup to transfer microchip patterns? This imaginative approach is reminiscent of my country's traditional folk handicraft-sugar painting. It has to be said that the two have similar approaches but the same purpose. Of course, the patterns transferred by the above-mentioned research institute are only one millionth to one billionth of a meter wide. In terms of scale alone, they are many times finer than the sugar paintings that were once sold on the streets. Sugar is the most common ingredient in daily life. Applying it to cutting-edge research on microcircuit and semiconductor chips has achieved a seamless connection between "down-to-earth" and "high-end". This attempt to break the inherent thinking framework is worth it. Learn from.
Previous article:As stable as double-knotted shoelaces, tiny magnetic vortices may become next-generation memory materials
Next article:Transphorm expands its presence in China and expands its GaN application lab
Recommended ReadingLatest update time:2024-11-16 12:01
- Popular Resources
- Popular amplifiers
- Allegro MicroSystems Introduces Advanced Magnetic and Inductive Position Sensing Solutions at Electronica 2024
- Vietnam's chip packaging and testing business is growing, and supply-side fragmentation is splitting the market
- The US asked TSMC to restrict the export of high-end chips, and the Ministry of Commerce responded
- ASML predicts that its revenue in 2030 will exceed 457 billion yuan! Gross profit margin 56-60%
- ASML provides update on market opportunities at 2024 Investor Day
- It is reported that memory manufacturers are considering using flux-free bonding for HBM4 to further reduce the gap between layers
- Intel China officially releases 2023-2024 Corporate Social Responsibility Report
- Mouser Electronics and Analog Devices Launch New E-Book
- AMD launches second-generation Versal Premium series: FPGA industry's first to support CXL 3.1 and PCIe Gen 6
- Innolux's intelligent steer-by-wire solution makes cars smarter and safer
- 8051 MCU - Parity Check
- How to efficiently balance the sensitivity of tactile sensing interfaces
- What should I do if the servo motor shakes? What causes the servo motor to shake quickly?
- 【Brushless Motor】Analysis of three-phase BLDC motor and sharing of two popular development boards
- Midea Industrial Technology's subsidiaries Clou Electronics and Hekang New Energy jointly appeared at the Munich Battery Energy Storage Exhibition and Solar Energy Exhibition
- Guoxin Sichen | Application of ferroelectric memory PB85RS2MC in power battery management, with a capacity of 2M
- Analysis of common faults of frequency converter
- In a head-on competition with Qualcomm, what kind of cockpit products has Intel come up with?
- Dalian Rongke's all-vanadium liquid flow battery energy storage equipment industrialization project has entered the sprint stage before production
- Allegro MicroSystems Introduces Advanced Magnetic and Inductive Position Sensing Solutions at Electronica 2024
- Car key in the left hand, liveness detection radar in the right hand, UWB is imperative for cars!
- After a decade of rapid development, domestic CIS has entered the market
- Aegis Dagger Battery + Thor EM-i Super Hybrid, Geely New Energy has thrown out two "king bombs"
- A brief discussion on functional safety - fault, error, and failure
- In the smart car 2.0 cycle, these core industry chains are facing major opportunities!
- The United States and Japan are developing new batteries. CATL faces challenges? How should China's new energy battery industry respond?
- Murata launches high-precision 6-axis inertial sensor for automobiles
- Ford patents pre-charge alarm to help save costs and respond to emergencies
- New real-time microcontroller system from Texas Instruments enables smarter processing in automotive and industrial applications
- How to achieve ZigBee fast networking?
- EEWORLD University Hall ---- Low-speed ADC Hardware Trio
- Three failure modes of high-voltage connectors for new energy vehicles
- Is it necessary to take a shower for 10 minutes after a burn?
- Sensor Problems
- Latest solutions specifically for battery test equipment, 5G test equipment
- DCDC input capacitance waveform
- If anyone is willing to help improve the size of the building block library, we can share the profits in the future.
- EEWORLD University Hall ---- The second stop of the ADI Road theme tour of Shijian: Instruments
- The features of the SCI module are as follows (these functions can be set through the corresponding registers)