1. Rashba Valley Control and Quantum Hall Effect of Black Arsenic Semiconductors
Rashba valley regulation and quantum Hall devices in black arsenic.
2. Controllable preparation of two-dimensional semiconductor single crystal wafers
3. New spectroscopic method to detect lattice dynamics at semiconductor interfaces
4. Fully flexible fabric display system
5. Multi-mode quantum relay based on absorption-type quantum memory
6. Neuromorphic hardware with integrated sensing, computing and storage based on homogeneous device architecture
7. Stable α-FAPbI3 perovskite at room temperature and high humidity and its efficient and stable photovoltaic devices
8. High-brightness orbital angular momentum single-photon solid-state quantum light source
9. Efficient p-type doping of ultra-wide bandgap nitride semiconductor materials
The research team of Li Dabing from the Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, and Researcher Deng Huixiong from the Institute of Semiconductors, Chinese Academy of Sciences, have collaborated to solve the international problem of p-type doping in wide-bandgap nitride materials. In response to the fundamental physical limitations of ultra-high acceptor activation energy, they proposed a method of quantum engineering non-equilibrium doping to regulate the position of the top energy level of the valence band, thereby significantly reducing the activation energy. This has achieved high hole concentration p-type ultra-wide bandgap nitride materials, providing a new idea for solving the problem of doping in wide-bandgap semiconductors and is expected to promote the further development of the wide-bandgap semiconductor industry. The results were published in the journal Light: Science & Applications (Light: Science & Applications, 2021, 10: 69).
10. High-efficiency capacitive sensing chip integrated on silicon substrate
Capacitive sensing chips are the data sensing infrastructure in the era of industrial Internet and the Internet of Everything. The research team of Huang Ru and Ye Le from Peking University has realized an on-chip integrated dynamic charge domain high-efficiency capacitive sensing chip based on domestic silicon-based CMOS technology. Through the first-proposed dynamic charge domain power consumption self-sensing technology and dynamic range adaptive sliding technology, the energy efficiency of data perception has been significantly improved, the performance degradation and reliability problems caused by complex working environments have been solved, and the application of environmental humidity sensing has been demonstrated, breaking the world energy efficiency record of similar chips and the foreign blockade.
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