From the signing boom to the construction boom, more than 300 billion semiconductor projects were landed, started, and invested in March

In March when the epidemic was effectively controlled, various places ushered in a round of concentrated construction and signing waves. Many major projects, including the Fuxin Semiconductor analog chip IDM project, the Xiamen Tianma G6 flexible AMOLED project, and the HiSilicon China headquarters and integrated circuit R&D and production base project, all started this month.

In addition to the commencement of construction and signing of contracts, the products of the first phase of the second phase of the Samsung high-end memory chip project in Xi'an were rolled off the production line, the Wuxi SK Hynix M8 project was put into production, and the Shanghai Jetta Semiconductor special process production line was put into production...

It is worth noting that Jiwei.com editors sorted out the data and found that the projects that started construction, went into production, signed contracts and disclosed investment amounts in March were all over 100 million yuan. This may to some extent indicate that under the epidemic, the promotion of major projects has received attention from local governments.

" Concentrated Construction Month", 10 billion yuan projects frequently appear

The third and fourth weeks of February this year can be called "Signing Week". Qingdao, Nanjing, Wuxi, Shaoxing, Hefei, Xiamen, Yangzhou, Chongqing, Quanzhou, Shanghai, Jinan and other places ushered in the first concentrated signing after the Spring Festival, and integrated circuit projects were implemented in many places. Compared with the signing and implementation of corporate contracts, some projects under construction were affected by the epidemic, such as Youyan and Xin'en projects. Similarly, only a few semiconductor projects started projects under the epidemic and made important progress such as production.

However, since March, major projects have started in various places, mostly in the form of centralized construction. More than 11 provinces and 17 cities have started projects, with the Yangtze River Delta having the strongest momentum. Among the centralized construction projects in many places, integrated circuit and panel projects are not absent.

Xiamen Tianma G6 Flexible AMOLED Project

On March 18, Fujian Province launched 265 major projects, including the Xiamen New Generation Display Panel Production Line Project located in the Torch Tongxiang Industrial Base. According to Xiamen Daily, the total investment in the Xiamen New Generation Display Panel Production Line Project is nearly 50 billion yuan. After the project reaches full production, the annual output value is expected to exceed 10 billion yuan. At the same time, it will also drive the production of Xiamen's supporting enterprises and attract upstream high-end technology supporting enterprises to settle in, which will play a role in supplementing, strengthening and extending the 100 billion yuan industrial chain of Xiamen's flat panel display. Regarding the production capacity of the project, Southeast Net reported that the production capacity will reach 48,000 sheets per month.

Based on the above information, the implementation entity of the project is about to be revealed. In August 2019, Tianma Microelectronics Co., Ltd. signed an Investment Cooperation Framework Agreement with the Management Committee of Xiamen Torch High-tech Zone. The Tianma 6th generation flexible AMOLED production line project with a total investment of 48 billion yuan was officially settled in Xiamen Torch High-tech Zone.

Fuxin Semiconductor Analog Chip IDM Project

On March 17, the Hangzhou High-tech Zone (Binjiang) Fuyang Special Cooperation Zone project signing and construction ceremony was held. Fuxin Semiconductor Analog Chip IDM Project participated in this construction event. The total investment of the project is about 40 billion yuan, with a land area of ​​647 acres. It will produce high-power power management core analog chips for automotive electronics, artificial intelligence, mobile digital, smart home appliances and industrial drives.

Taijia Optoelectronics' annual production of 1.44 million ultra-high-definition LCD panels

On March 3, at the Huzhou branch of the Zhejiang Province's major project launch ceremony for expanding effective investment, the ultra-thin glass substrate deep processing project of Jiangtaijia Optoelectronics Technology Co., Ltd. was officially launched. The project was invested and constructed by Shenzhen Hefengtai Technology Co., Ltd. with an investment of 16 billion yuan and was signed in September 2019. After the project reaches full production, it will have an annual production capacity of 1.44 million ultra-high-definition LCD panels of 32 inches, 50 inches, 55 inches and 65 inches.

HiSilicon China Headquarters and Integrated Circuit R&D and Production Base Project

The HiSilicon China Headquarters and IC R&D and Production Base Project is one of the most watched projects recently. On March 18, the Guangdong HiSilicon Integrated Circuit Co., Ltd. R&D and Production Base Project held a groundbreaking ceremony, and Xinen founder Zhang Rujing also attended the ceremony. For this reason, the industry regarded Zhang Rujing's move as a confirmation of Zhang Rujing's move to Guangzhou. In response, Zhang Rujing issued a statement that he was an old acquaintance of the project founder Chen Yongzheng and only served as a company consultant.

HiSilicon was jointly established by Guangzhou Nansha Development and Construction Group Co., Ltd., Shenzhen Xinxin Technology Co., Ltd., Guangzhou Nansha Yunxin Investment Partnership (Limited Partnership), and Rongmei (Guangzhou) Investment Holding Partnership (Limited Partnership). After completion, the project is expected to produce power devices, MOSFET, IGBT, digital-analog hybrid, micro-electromechanical, single-chip and other products. After reaching full production, it will form an annual production capacity of 420,000 8-inch chips and 80,000 12-inch chips.

Chen Yongzheng, founder of HiSilicon Integrated Circuit, pointed out at the "Jiwei Live Room·Connection [Zhang Rujing] [Chen Yongzheng]-How CIDM Helps China's Chips Open a Road to Breakthrough " event held on the morning of April 2 that currently a large number of chips in China rely on imports, and how to find a way to make up for the shortage of domestic products is a question that the industry needs to think about. The combination of domestic design companies and manufacturing companies to form a consortium-CIDM can be a transitional model for domestic substitution of imports, and can also become a long-term model to help more companies win-win.

Talking about the reason for founding HiSilicon, Chen Yongzheng said that in 2019, the country released the Guangdong-Hong Kong-Macao Greater Bay Area plan, and some people believe that the Greater Bay Area may become the "Silicon Valley of China". On the one hand, various industries in the Greater Bay Area have a large demand for semiconductor products, and on the other hand, there are not many companies in the IDM or CIDM model in the Greater Bay Area. At the same time, the Nansha Free Trade Zone Government is very supportive of HiSilicon's landing in Nansha. At present, the HiSilicon project is progressing smoothly. Negotiations with the Nansha government began at the end of 2019, and construction had already started in March 2020. The speed of HiSilicon's development is amazing.

Production was not delayed by the epidemic

In February, various major projects resumed work one after another to minimize the losses caused by the epidemic. Some companies even did not stop work or production during the Spring Festival.

In March, the products of the first phase of the second phase of Samsung's high-end memory chip project in Xi'an rolled off the production line, the SK Hynix M8 project in Wuxi was put into production, and the Shanghai Jetta Semiconductor special process production line was put into production.

Samsung High-End Memory Chip Phase II Phase I Project

On March 10, Samsung (China) Semiconductor Co., Ltd. held a ceremony to launch the products of the first phase of the second phase of Samsung's high-end memory chip project.

Samsung's high-end memory chip Phase II Phase I project has an investment of approximately US$7 billion and currently has mass production capacity. It is expected to achieve full production in August this year. The first batch of products launched this time are the first batch of Samsung's high-end memory chip Phase II Phase I project. The Phase II Phase II project, with an investment of US$8 billion, was officially launched on December 25, 2019 and is expected to achieve mass production in the first half of 2021 .

In addition, the Samsung semiconductor memory chip phase I project in Xi'an High-tech Zone achieved full production in January and February. Affected by the epidemic, there were problems such as poor logistics, weak supply of raw materials, and insufficient manpower in February. However, with the joint efforts of the Shaanxi Provincial and Xi'an Municipal Governments and enterprises, the Samsung Phase I project maintained full production of 130,000 memory chips per month in January and February.

Wuxi SK Hynix M8 Project

On March 16, SK Hynix's M8 project was successfully taped out according to the original schedule. The project was signed in Wuxi on December 28, 2017, with a total investment of US$1.4 billion. It is mainly engaged in foundry manufacturing and sales of CIS, DDI, PMIC and NAND memory, and is also developing new foundry businesses such as logic and mixed signal chips. In September 2018, the project officially started construction and will produce 115,000 8-inch wafers per month after mass production.

Shanghai Jetta Semiconductor Special Process Production Line

On March 30, the JITA Semiconductor Specialty Process Production Line was officially put into production. The JITA Specialty Process Production Line construction project started in August 2018, and the equipment was moved in in December 2019. The project is located in the Lingang Heavy Equipment Industrial Zone, with a total investment of 35.9 billion yuan. It is an important part of the cooperation agreement between the Shanghai Municipal Government and China Electronics Information Industry Group, and it is also the first major industrial project to be implemented.