Low carbonization and digitalization promote sustainable development Infineon Technologies appears at the 2024 Munich Shanghai Electronics Show

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Electric Vehicles


As the world's largest automotive semiconductor supplier, Infineon has been deeply involved in the field of automotive electronics for decades and is able to provide a broad portfolio of products and solutions to enable future travel.


In the electric vehicle exhibition area, Infineon conducted a series of technical demonstrations, including a motor controller system demonstration using Infineon's second-generation HybridPACK™ Drive silicon carbide power module. The system integrated AURIX™ TC3xx, second-generation 1200V SiC HybridPACK™ Drive module, third-generation EiceDRIVERTM driver chip 1EDI30XX, coreless current sensor, etc., allowing the audience to experience and deeply understand the excellent functions and innovative features of Infineon products, and their unique value in alleviating electric vehicle range anxiety applications.


In addition, Infineon also displayed current sensor modules, discrete power device families, QDPAK packaged low on-resistance silicon carbide devices, component demo solutions based on weldable TO247 single tubes, HybridPACK™ Drive product series, 11kW OBC full GaN high power density charging system solutions, as well as products and solutions based on CoolMOS™ and OptiMOS™ power MOSFETs, CoolGaN™ SG HEMT switches, CoolMOS™ QDPAK CFD7A, 6.5A 2300V single-channel isolated gate driver evaluation board (with SiC MOSFET) that support the rapid development of electric travel and electric transportation.

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Reference address:Low carbonization and digitalization promote sustainable development Infineon Technologies appears at the 2024 Munich Shanghai Electronics Show

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