Infineon Technologies Launches New Generation EiceDRIVER™ 2EDN Gate Driver IC

Infineon Technologies Launches Next-Generation EiceDRIVER™ 2EDN Gate Driver IC, Setting New Standards in Form Factor, UVLO Response Speed, Active Output Clamping, etc.

[Munich, Germany, March 28, 2022] Infineon Technologies AG recently launched the next-generation EiceDRIVER™ 2EDN gate driver chip series. The new devices complement the existing 2EDN driver chip product line, reducing the number of external components and saving design space, thereby achieving higher system efficiency, excellent power density and continuous system robustness. With the launch of new products, the 2EDN series driver chips can be widely used in applications such as servers, telecommunications equipment, DC-DC converters, industrial SMPS, electric vehicle charging piles, motor control, low-speed light electric vehicles, power tools, LED lighting and solar energy systems to improve the performance of power switching devices.

The new generation of EiceDRIVER 2EDN driver chip series includes stable and reliable dual-channel low-side 4 A/5 A gate driver ICs. It is not only suitable for high-speed power MOSFETs, but also for switching devices based on wide bandgap (WBG) materials. These gate drivers can help engineers meet the design requirements of different package sizes, ensure that the system is safely shut down before entering the undervoltage lockout (UVLO) state, and speed up the response speed of the UVLO function, thereby ensuring the stable operation of the system and enhancing anti-interference capabilities.

The new generation of EiceDRIVER 2EDN driver chip family has 14 devices in various packages. In addition to the compatible and interchangeable 8-pin DSO, TSSOP and WSON packages, Infineon now also offers ultra-small 6-pin SOT23 packages (2.8 x 2.9 mm2) and TSNP packages (1.1 x 1.5 mm2). The SOT23 and TSNP packages eliminate the uncommonly used enable (EN) signal, which can effectively save space, optimize system design, thereby increasing power density and improving the robustness of temperature cycles on board (TCoB).

Designers can choose between 4 V or 8 V UVLO options to provide instantaneous UVLO protection for the power switch under abnormal conditions. Essentially, these new products reduce UVLO hysteresis time, enter UVLO mode faster, and more than double the speed of response from startup and burst mode to UVLO function. In addition, they feature highly accurate, precise rail-to-rail outputs and fast active output clamping of VDD at 1.2 V. The clamping action is typically achieved in just 20 ns, further improving system robustness.

Availability

The new generation of EiceDRIVER 2EDN gate driver chips (2EDNxx3xx) are available in five different packages: 8-pin DSO, TSSOP, WSON, and 6-pin SOT23 and TSNP. Infineon is now sampling to customers. The TSNP package variant will be available in the second quarter of 2022.