Hangzhou, sprinting towards 100 billion!
On July 15, the Hangzhou Municipal People's Government issued the "Implementation Opinions on Promoting the High-Quality Development of the Integrated Circuit Industry" (hereinafter referred to as the "Opinions"), which proposed industrial development goals from five aspects: doubling the industrial capacity, reasonable spatial layout, improving innovation capabilities, strengthening platform services, and controllable industrial risks.
Among them, in terms of doubling the industry's capacity, the "Opinions" pointed out that by 2025, the scale of the integrated circuit industry will reach 80 billion yuan and strive for 100 billion yuan, with an average annual growth of 20% ; cultivate 1-2 companies with revenue of 10 billion yuan, more than 3 companies with 5 billion yuan, and more than 10 companies with 1 billion yuan; cultivate a group of "specialized, precise and innovative" small and medium-sized enterprises in the fields of design and manufacturing, compound semiconductors, semiconductor core materials, key equipment and components.
In terms of improving innovation capabilities, by 2025, a number of innovative achievements will be formed in frontier fields such as artificial intelligence chips, vision processing chips, server chips, automotive-grade chips, quantum computing chips, brain-like computing chips, and compound semiconductors, and the R&D expenses of key integrated circuit companies will account for more than 5% of their operating income.
In order to achieve the above-mentioned industrial development goals, the "Opinions" clearly defined five key tasks, including implementing high-end design leading actions, implementing characteristic manufacturing improvement actions, implementing key material and equipment research actions, implementing platform capacity leap actions, and implementing the Yangtze River Delta collaborative research actions.
(I) Implement high-end design-led actions . Promote integrated circuit high-end chip R&D plans and industry chain collaborative innovation projects, and vigorously develop high-end analog chips and mixed analog and digital chips. Focus on Binjiang District, the West City Science and Technology Innovation Corridor, and Linping District to enhance the development of new special chips such as RF sensors, baseband, switching, optical communications, display drivers, power management, RISC-V, IoT smart hardware, automotive grade, FBAR filters, and storage and computing integration; innovate and develop high-end general-purpose chips such as embedded systems, memory, processors, and servers; cultivate and develop cutting-edge technology products such as brain-like computing, edge computing, quantum computing, flexible electronics, and compound semiconductors.
(II) Implement the action plan for improving special manufacturing . Build special process chip manufacturing production lines and cultivate billion-level chain-leading enterprises. Support the adoption of CMOS, MOSFET and other process technologies to develop IGBT, smart sensors, MEMS, FinFET, semiconductor lasers, optoelectronic devices and other products. Support the construction of compound semiconductor projects such as gallium nitride, silicon carbide, gallium arsenide, indium phosphide, and aluminum nitride. Focus on Qiantang District, Xiaoshan District, Fuyang District, Tonglu County, and Yuhang District to support mature process complete process chip manufacturing production line projects. Support the planning and construction of major high-end storage projects in the West City Science and Technology Innovation Corridor.
(III) Implement key material and equipment research and development actions . Focusing on Binjiang District, Qiantang District, Fuyang District, Lin'an District, Xiaoshan District, Yuhang District, Linping District, and Jiande City, support the research and development of key materials such as large-size silicon wafers; improve the self-sufficiency rate and local matching rate of photoresists, high-purity chemical reagents, electronic gases, functional polymer materials, etc.; improve the research and development capabilities of equipment such as circuit testing, sorting, ultra-clean flow control systems, semiconductor epitaxy, and chemical mechanical planarization and polishing, and break through a number of key core technologies.
(IV) Implement platform capacity leap action . Improve the operation and service level of platforms such as Hangzhou National "Core Fire" Entrepreneurship and Innovation Base, Zhejiang Integrated Circuit Innovation Center, Qiantang Core Valley, Gallium Valley RF Industrial Park, Lin'an Cloud Manufacturing Town, and Hangzhou Integrated Circuit Testing Service Center, and promote the coordinated development of innovation bases, R&D platforms, and industrial bases. Rely on backbone enterprises and scientific research institutes to build an incubation platform for small and medium-sized enterprises, and provide guidance services such as technology development, credit financing, market promotion, legal proceedings, and intellectual property rights for start-ups.
(V) Implement the Yangtze River Delta collaborative research action . Explore the Yangtze River Delta collaborative research "unveiling the list and appointing the leader" mechanism, promote the multi-party linkage of chip, software and terminal enterprises in the Yangtze River Delta region, carry out collaborative research around the deployment of terminal system requirements, and build an independent and controllable IP core layout. Build a Yangtze River Delta "chip-machine linkage" docking platform to support the development of major application scenarios.
In addition, the Opinion also proposed 14 specific measures and issued a series of preferential policies to ensure the smooth implementation of the tasks. For example, in terms of increasing support for first tape-outs, key materials, core equipment and EDA tools, the maximum subsidy is 50 million yuan.
Source: Global Semiconductor Observation
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