Xilinx Expands Its Revolutionary Zynq UltraScale+ RFSoC Family to Provide Full Support for Sub-6GHz Frequency Bands

Industry’s only single-chip adaptive RF platform for 5G wireless, cable access, and radar applications

February 21, 2019, Beijing, China - Xilinx, Inc. (NASDAQ: XLNX), a global leader in adaptive and intelligent computing, today announced that its award-winning Zynq® UltraScale+™ RF (RF) system-on-chip (SoC) product series has been expanded with higher RF (RF) performance and stronger scalability. The new generation of devices is based on the success of the Zynq UltraScale + RFSoC basic product series in multiple markets, supporting all frequency bands below 6GHz, thus meeting the key requirements of the next-generation 5G deployment. At the same time, it can also support direct RF sampling for 14-bit analog-to-digital converters (ADCs) with sampling rates up to 5GS/S and 14-bit digital-to-analog converters (DACs) with sampling rates of 10 GS/S, both of which have analog bandwidths of up to 6GHz.

The Xilinx RFSoC portfolio is the industry's only single-chip adaptable RF platform that can meet current and future industry needs. The portfolio now includes:

• Xilinx Zynq UltraScale+ RFSoC Gen 2 (Second Generation) : This device, which is now sampling and scheduled to be put into mass production in June 2019, not only meets the timeline of 5G deployment in Asia, but also supports the latest RF technology.

• Xilinx Zynq UltraScale+ RFSoC Gen 3: Provides full support for sub-6 GHz direct RF sampling, extended mmWave interfaces, and up to 20% lower power consumption in the RF data converter subsystem compared to the base product line. Available in the second half of 2019.

The new products integrate higher performance RF data converters on a single chip, providing the wide frequency band coverage required for the deployment of 5G wireless communication systems, cable TV access, advanced phased array radar solutions, and other applications including measurement and testing and satellite communications. By replacing discrete components, these devices can reduce power consumption and package size by 50%, making them an ideal choice for telecom operators to deploy 5G systems to achieve large-scale multiple-input multiple-output base stations.

With pin compatibility across the portfolio, customers can now design and deploy their systems using first-generation devices with second- and third-generation roadmaps to achieve higher performance. For more information on Zynq UltraScale+ RFSoC, please click "Read the original article" to learn more . It also includes details on the ZCU111 evaluation kit.

Mobile World Congress 2019

Xilinx will be showcasing its RFSoC products and other adaptable, intelligent 5G infrastructure at Mobile World Congress in Barcelona, ​​February 25-28, 2019, in Hall 6, Stand 6M30. In addition, Xilinx will be on stage with partners and customers at the Power Hour on Thursday, February 28, from 10am to 12:30pm CET. Xilinx-hosted sessions will be held in Hall 8.0 – NEXTech Theatre D.