Taihu Core judges talk about "core": semiconductor startup teams have great potential
On
May
10-11
,
2022
, the project roadshow of the Shenzhen Division of the first integrated circuit "Taihu Core" Entrepreneurship Competition in the Yangtze River Delta Guangdong-Hong Kong-Macao Greater Bay Area, hosted by the Wuxi Economic Development Zone Management Committee of Jiangsu
Province, came to a successful conclusion.
How did the projects perform in the Shenzhen roadshow? What outstanding projects emerged? Xinshiye interviewed two expert judges who served in the offline roadshow in Shenzhen. This article is edited based on the interview with the expert judges and shared with you.
Video source: Xinshiye
A:
Lihewei Liu Yuancheng
This talent team has three characteristics: first, they are young, second, they are highly educated, and third, their knowledge structure is relatively complete. Secondly, the quality of the projects in the roadshow is relatively good. I feel that everyone is very enthusiastic about entrepreneurship in the semiconductor field. I think many good projects have emerged. These projects fully cover the entire semiconductor industry chain, including silicon carbide materials, chip design, and chip applications, and are a complete reflection of the entrepreneurial projects in the entire semiconductor industry chain.
Lixin Semiconductor Zhu Xiaoan
I participated in this roadshow and felt that I gained a lot. The projects of the entire participating team are distributed in various fields of the entire semiconductor industry. For example, there are projects in materials,
EDA
software, direct chip design, chip application, etc. The scope is very wide, and their knowledge level is also very high. Roadshow site
The diversity of projects and the trend of high-level talents shown are good things for the industry.
This shows that the entire semiconductor industry or the chip industry has truly attracted all-round resource support from capital, talent, education, etc., which is what the semiconductor industry needs. The semiconductor industry is a "money-eating beast" and any link in it has intensive demand for capital and talent.
For a judge, this roadshow is also an opportunity to learn and observe.
A:
Lihewei Liu Yuancheng
There are many excellent projects today, and there are two projects that impressed me the most. One is the "Quantum Alumina" project, which is a semiconductor material project. It is mainly used in polishing applications in the semiconductor field. In addition, it can also be used in the military field of national defense, so I think this project is quite valuable.
Another project is "Wide Spectrum High Resolution Visual Radar VISION RADAR (VIDAR)". The product of this project can not only be used in daily consumer applications, such as sweeping robots, but can also be used in the field of autonomous driving, with a wide range of applications.
Lixin Semiconductor Zhu Xiaoan
This is a difficult problem for the judges. Today's roadshow project teams all have their own characteristics, and of course they all have some shortcomings that need to be supplemented. The growth of these projects does require a lot of social resources, including government investment, funds, and affiliated companies to assist them in their development.
I have a deep impression. Since I am engaged in chip design services, I am more interested in the EDA software project "Electronic Design Automation Software EDA Based on Digital Twins and Artificial Intelligence". We may even explore whether there are opportunities for cooperation in the design field in the future. The roadshow project site is also a very good opportunity for industry exchanges.
From the perspective of scoring, I think there are many projects in the entire industrial chain that have performed well, such as visual radar projects, polymer materials, and quantum materials. I think they are all good.
A:
Lihewei Liu Yuancheng
I wish our competition a complete success and that more good projects can be implemented.
Lixin Semiconductor Zhu Xiaoan
I think the projects in this competition are very rich and the quality of the projects is also very good. I hope that our competition can attract more funds to support these companies, so that companies and teams have the opportunity to grow bigger and stronger.
Shenzhen Lihe Microelectronics Co., Ltd. (hereinafter referred to as Lihe Micro)
focuses on the design and development of Internet of Things communication chips. It is a domestic
leader
in power line communication (
PLC
) technology, chips and market, a pioneer of the domestic new generation of
PLC
technology and chips, and the author of China's low-voltage power line communication physical layer national standard. It has also launched
the PLBUS
and dedicated chips for
the unified communication interface of Internet of Things smart devices based on power lines
.
Based on the large-scale application of the State Grid / smart meters, the company's core technologies and chip products provide stable , reliable and effective communication methods for the "last mile " communication connection of consumer and industrial Internet of Things such as smart homes/smart appliances, smart lighting, smart cities / smart street lights, comprehensive energy efficiency management, charging pile management, photovoltaic power generation, etc., and provide domestic independent chip support.
Shenzhen Lixin Semiconductor Co., Ltd. (hereinafter referred to as Lixin Semiconductor) is a national high-tech enterprise focusing on integrated circuit design services. The company's team is experienced in the field of integrated circuit design, has been engaged in R&D and project management for more than 20 years, has undertaken many national R&D projects, and has won many national and provincial technology progress awards.
The company has established a complete ISO quality and information security management system, and its business covers: 1. Customized chip development, providing one-stop (above 40nm) complete chip development: from market research, product definition, functional design, physical implementation, wafer packaging and testing. 2. Advanced process (line width 5nm ~ 90nm) chip back-end physical implementation, wafer packaging and testing.
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