113 winners! The results of the 19th "China Chip" Excellent Product Collection are released
In order to promote the high-quality development of the national integrated circuit industry, the 2024 China Microelectronics Industry Promotion Conference and the 19th "China Core" Excellent Product Collection Results Release Ceremony were held in Hengqin Guangdong-Macao Deep Cooperation Zone (hereinafter referred to as "Hengqin") on November 7. This conference will continue until November 8, showcasing the latest achievements of outstanding "China Core" companies, fully unleashing the brand influence of the "China Core" conference, and helping Hengqin build an industrial system with "frontier field core layout, full ecology of special chips, full chain of high-end production and testing, and full gathering of international talents", and comprehensively upgrade and build an innovative development platform for the microelectronics and integrated circuit industries.
Li Weinong, Director of the Executive Committee of the Hengqin Guangdong-Macao Deep Cooperation Zone, Wang Shijiang, Deputy Director of the Electronic Information Department of the Ministry of Industry and Information Technology, Qu Xiaojie, Member of the Party Leadership Group and Deputy Director of the Guangdong Provincial Department of Industry and Information Technology, Fu Yongge, Member of the Hengqin Working Committee of the Guangdong Provincial Party Committee and Deputy Director of the Executive Committee of the Hengqin Guangdong-Macao Deep Cooperation Zone, Tan Chun, Member of the Standing Committee of the Zhuhai Municipal Party Committee and Member of the Party Leadership Group of the Municipal Government, Liu Sheng, Professor of Wuhan University and Academician of the Chinese Academy of Sciences, Wang Lijun, National Distinguished Expert and Academician of the Russian Academy of Engineering, and other industry experts and entrepreneur representatives attended the event.
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Big names gathered together to participate in the "China Chip" event
Liu Sheng, a professor at Wuhan University and an academician of the Chinese Academy of Sciences, gave a speech on "Mechanics of Chip Manufacturing Process". In Liu Sheng's view, the development of automobile electrification and intelligent driving has put forward higher reliability requirements for electronic manufacturing. Extreme reliability and intelligent reliability are one of the core foundations of the intelligentization of new energy vehicles. Ppb-level device safety will become a necessary condition for the development of the industry.
Wang Lijun, a national expert and academician of the Russian Academy of Engineering, gave a keynote speech on "Glass-based multi-chiplet 3D heterogeneous integration and co-packaged optics (CPO) technology", and discussed with the participants the development opportunities and challenges of chip research and development. He pointed out that in the era of AI big models, chips must solve the problem of increasing computing power. It is worth noting that the mechanical, thermal, optical, and electrical properties of glass materials are better than those of silicon and organic materials, so glass-based heterogeneous integration technology has become a new track for the development of the industry.
Zhang Wei, Party Secretary and Director of Gree Electric Appliances Co., Ltd. of Zhuhai, made a keynote speech. He said that in the early days of the company, it mainly relied on the assembly and production of household air conditioners. Now it has developed into a diversified, technology-based global industrial manufacturing group, with industries covering two major fields: household consumer goods and industrial equipment, and its products are exported to more than 190 countries and regions. "Today, we are promoting energy-saving upgrades for Gree's entire product line through the research and development of the third-generation semiconductor silicon carbide chips. Currently, the chips have been used in large quantities in air-conditioning products, which reduces the operating temperature of the chips by 10°C, increases the operating efficiency by more than 0.5%, and improves the current parameters by 10%, continuously meeting people's needs for smart life."
At the roundtable forum, Zhang Li, President of China Academy of Information and Communications Technology, Yu Chengbin, Chief Strategy Officer of Silergy Group and Managing Director of Macau, Chen Jie, Director and Co-President of New Tsinghua Unigroup, Mai Peiran, Director of the State Key Laboratory of Analog and Mixed-Signal VLSI of the University of Macau, and Zhang Wei, Party Secretary and Director of Gree Electric Appliances Co., Ltd. of Zhuhai, had wonderful exchanges and sharing on the innovation and development of the integrated circuit industry, and the atmosphere was lively.
Entrepreneurs including Wang Kai, founder, director and CEO of Hubei Xinqing Technology Co., Ltd., which won the award for Outstanding Market Performance Products, and Bi Lei, general manager of Hefei Jiefa Technology Co., Ltd., which won the award for Outstanding Technological Innovation Products, gave keynote speeches and shared their acceptance speeches.
The conference also held a launching ceremony for the new RISC-V track and a unveiling ceremony for the “China Chip” Adaptation Center.
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Leading by innovation, 113 products were recognized
It is understood that the "China Core" excellent product collection activity is one of the most influential and authoritative industry activities in the field of integrated circuits in China, aiming to showcase the product innovation, technological innovation and application innovation achievements in the field of integrated circuits in my country. After the development in recent years, a number of excellent integrated circuit companies have been cultivated and discovered.
As the highlight of this conference, the conference released the results of the 2024 "China Core" annual collection. The "China Core" excellent product selection is known as the "weather vane" of the development of integrated circuit products and technologies. It commends the achievements of product innovation, technological innovation and application innovation in the domestic integrated circuit field. It has been successfully held for 18 sessions since its launch in 2006. It is understood that the 19th "China Core" excellent product collection activity has collected registration materials from 280 chip companies and a total of 364 chip products. The products basically cover the entire integrated circuit field, and finally 113 excellent products won awards.
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Economic and trade investigation between Qianhai and Macao to share the achievements of “core” development
In order to strengthen the exchanges and cooperation between the participating companies and the top integrated circuit design companies in Hengqin, this conference also organized three inspection and exchange routes in Hengqin, Macau and Gree, visiting Macau universities and companies in the Hengqin Guangdong-Macao Deep Cooperation Zone respectively, and holding on-site matchmaking meetings and investment promotion meetings for in-depth interactive exchanges.
During the "Hengqin Tour", the company representatives visited the Guangdong-Macao Integrated Circuit Design Industrial Park. As the first integrated circuit special industrial park in Hengqin and the Guangdong Provincial Characteristic Industrial Park in 2023, the industrial park has gathered more than 80 integrated circuit companies. During the "Macau Tour", the guests visited the State Key Laboratory of Analog and Mixed-Signal VLSI of the University of Macau and the Macau University of Science and Technology to learn about the latest achievements of "Macau R&D + Hengqin Transformation".
Through the on-site inspection of Qinzhuhai and Macao, we visited advanced enterprises and professional parks, learned about cutting-edge development models and R&D directions, and fully demonstrated the "strong magnetic field" and "core gravity" of the Guangdong-Hong Kong-Macao Greater Bay Area in the field of integrated circuit industry, which is very inspiring for subsequent product development. At the same time, people also found new opportunities for the extension of the industrial chain in the collision and communication.
Relying on the brand influence of the "China Core" conference, the event is also committed to building an international, high-end and professional communication platform, bringing together the forces of government, industry, academia, research and application, and promoting the further improvement of the Hengqin semiconductor industry ecology and the landing of enterprises. It is worth noting that the main venue of the conference forum also set up the Hengqin Integrated Circuit Industry Image Exhibition, the "China Core" Excellent Enterprise Image Exhibition and other supporting exhibitions, fully demonstrating Hengqin's advantages and achievements in policy support, industrial development, technological innovation, talent training and other aspects, and building an efficient and pragmatic communication and cooperation space for enterprises and guests.
In an interview, Mai Peiran, director of the State Key Laboratory of Analog and Mixed-Signal VLSI at the University of Macau, said that Hengqin currently has many development resources, which are sufficient to support Macau graduates to stay in Hengqin to start businesses and conduct scientific research in analog chips, etc. The "China Chip" forum has built a platform to allow more people to understand the characteristics of Hengqin's industrial ecology, policy system, etc., and to promote interactive cooperation between industry, academia and research.
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Building a "core" highland for the development of the Bay Area
Relying on its important location connecting the Macau free port and the vast market of the Mainland, Hengqin is committed to promoting the development of the integrated circuit industry, leveraging the scientific research resource advantages of Macau universities, creating an integrated circuit industry ecosystem and industrial cluster in the Guangdong-Hong Kong-Macao Greater Bay Area, and promoting domestic and foreign integrated circuit companies to go overseas through the platforms of Hengqin and Macau, and building it into a "bridgehead" for the internationalization of "China Chip" and a strategic support point for the "dual circulation" of China's integrated circuit industry.
It is worth noting that in this year's "China Core" excellent product collection activity, a total of four companies in the Hengqin Guangdong-Macao Deep Cooperation Zone were commended, namely Zhuhai Miaocun Technology Co., Ltd., Zhuhai Jiuhai Semiconductor Co., Ltd., Guangdong Qixin Semiconductor Co., Ltd., and Zhuhai Yiwei Semiconductor Co., Ltd.
Jiang Xinqiao, president of Zhuhai Yiwei Semiconductor Co., Ltd., said in an interview that the company has been deeply involved in the field of robot-specific chips for many years and has accumulated nearly 2,000 intellectual property rights, which have been applied in cleaning robots, service robots, family companion robots, educational robots and other fields. Currently, more than 50% of cleaning robot brands on the market are using Yiwei's chips and solutions. "The company has been rooted in Hengqin for 10 years. Hengqin not only provides policy and financial support for enterprises, but also provides an important platform for connecting with Macau universities and promoting the industrialization of scientific research results. We have also established a subsidiary in Macau, which will better rely on Macau's advantages to attract overseas talents and connect with market resources in Portuguese-speaking countries."
In recent years, Hengqin has closely followed the mission given by the Overall Plan for the Construction of the Hengqin Guangdong-Macao Deep Cooperation Zone and accelerated the development of the "four new" characteristic industries. In terms of scientific and technological research and development and high-end manufacturing industries, efforts have been made to promote the development of the integrated circuit industry, especially the introduction of the "double 15%" tax preferential policy and the "Several Measures for Hengqin to Promote the Development of the Integrated Circuit Industry", which have significantly reduced the innovation costs of design companies.
Relying on the Guangdong-Macao Integrated Circuit Design Industrial Park, we will build an integrated circuit design and manufacturing industry cluster. At present, the industrial park has gathered a number of integrated circuit companies and public service platform institutions such as Chiptronix, Biren Technology, Miaocun Technology, Huayan Weifu, and Lingyange Chip Technology, and the scale of the cluster has initially emerged, with revenue exceeding 1.4 billion yuan in 2023.
This conference will last for two days, during which four professional sub-forums will be held to carry out industry exchanges and discussions on the four areas of domestic EDA/IP technology innovation and application, opportunities and challenges for Chinese "core" enterprises to go overseas, training of chip design talents and integration of industry and education, and investment and financing docking of integrated circuits in Qinhuangdao, Zhuhai and Macao. A special investment zone will be set up at the conference to facilitate policy docking, business negotiations, cooperation and discussion for visiting enterprises. The University of Macau Alumni Association will also be held at the same time to promote communication and exchanges among alumni and jointly make suggestions for promoting the high-quality development of the integrated circuit industry in Qinhuangdao and Macao.
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